RELOCATION ASSISTANCE: Relocation assistance may be available CLEARANCE REQUIRED FOR START: Yes CLEARANCE TYPE: Secret TRAVEL: Yes, 10% of the Time Description At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work - and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, they're making history. The AMS E&S organization at Northrop Grumman Missions Systems in Baltimore, Maryland is seeking experienced digital and RF subsystem integration and test engineers and technical leads in the following areas: Digital receiver/exciter and related digital-RF subsystem integration, subsystem control design, and architecture. Work is performed without appreciable direction and exercising considerable latitude in determining technical objectives of assignments. Candidates would have the ability to develop technical solutions to complex problems which require the regular use of ingenuity and creativity. The qualified candidates will work with a diverse and talented team of engineers developing innovative and cost-effective systems that support a broad range of products and business areas across the lifecycle of a program. Applicants should possess the ability to communicate effectively and clearly present technical approaches and findings. Responsibilities may include: Integration of digital receiver/exciter hardware and representative lab test environments Integration of new equipment and programs in a state-of-the-art facility Software development for automating test processes and data analysis Troubleshooting digital and RF issues during test of advanced antenna systems and system-on-chip designs Analyzing test data and identifying early trends Supporting program meetings in developing root cause and corrective actions Collaborating with design engineering for hardware, controls, and test improvements Subsystem analysis including digital architecture, signal paths, and hardware interfaces from RF front end through digital processing Support for performance testing, requirements verification, and more. In addition, this candidate should have demonstrated technical ability/leadership and expertise in one or more of the following areas: Digital-RF subsystem integration, test, and system integration System-on-chip FPGA and/or front-end software design Highly integrated digital-RF subsystems, antenna hardware, and receiver/exciter hardware for active electronically scanned array (AESA) systems Development and verification of complex front-end and subsystem controls across systems Electronic warfare, radar, or related mission-system principles and their system applications Subsystem requirements (hardware and digital) derivation, flow-down, and configuration Comfort creating test support applications and tools using MATLAB or similar technical computing tools Conducting Test Readiness Reviews and/or Design Readiness Reviews Concept of operations development for integration and test activities Executing subsystem and system level testing - both in engineering development and manufacturing environments This role is contingent upon candidates having a current, active government Secret Clearance. This role is contingent upon Program Award. This is a Dual-level opening, candidates will be considered at both a level 3 (Principal Engineer) or 4 (Sr. Principal Engineer) based upon the Basic Qualifications listed below. Basic Qualification - Principal Digital-RF Subsystems Integration & Test: Must hold a Secret or Top-Secret security clearance Must have a Bachelors Degree in Engineering or related discipline with 5 years of experience in the areas described in the job description or Master's Degree with 3 years of experience or PhD with 0 years of experience. An additional 4 years' experience is acceptable in lieu of degree. Experience using MATLAB or similar engineering analysis tools Experience with digital and/or RF subsystem integration and test Experience with setup and testing of hardware in a lab or benchtop environment Basic Qualification Sr. Principal Digital-RF Subsystems Integration & Test: Must hold a Secret or Top-Secret security clearance Must have a Bachelors Degree in Engineering or related discipline with 8 years of experience in the areas described in the job description or a Masters Degree with 6 years of experience or PhD with 4 years of experience. An additional 4 years' experience is acceptable in lieu of a degree. Strong experience using MATLAB or similar engineering analysis tools Experience with digital and/or RF subsystem integration and test Experience with setup and testing of hardware in a lab or benchtop environment Ability to delegate, task, and provide technical oversight for junior engineers Preferred Qualifications: TS/SCI clearance SAP clearance Strong knowledge of: Setting up lab, system integration, and digital-RF hardware test environments Control architectures and control design/integration for hardware with firmware, embedded software, and ASICs Knowledge of: RF and antenna theory, including RF performance analysis Python VHDL/Verilog C++ Test development experience for lab test environments and subsystem hardware Experience troubleshooting digital-RF subsystems Understanding of digital signal processing chains Experience working with and supporting engineers across firmware, software, power, and RF test teams Primary Level Salary Range: $119,600.00 - $179,400.00 Secondary Level Salary Range: $149,300.00 - $223,900.00 The above salary range represents a general guideline; however, Northrop Grumman considers a number of factors when determining base salary offers such as the scope and responsibilities of the position and the candidate's experience, education, skills and current market conditions. Depending on the position, employees may be eligible for overtime, shift differential, and a discretionary bonus in addition to base pay. Annual bonuses are designed to reward individual contributions as well as allow employees to share in company results. Employees in Vice President or Director positions may be eligible for Long Term Incentives. In addition, Northrop Grumman provides a variety of benefits including health insurance coverage, life and disability insurance, savings plan, Company paid holidays and paid time off (PTO) for vacation and/or personal business. The application period for the job is estimated to be 20 days from the job posting date. However, this timeline may be shortened or extended depending on business needs and the availability of qualified candidates. Northrop Grumman is an Equal Opportunity Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO and pay transparency statement, please visit U.S. Citizenship is required for all positions with a government clearance and certain other restricted positions.
11/13/2026
Full time
RELOCATION ASSISTANCE: Relocation assistance may be available CLEARANCE REQUIRED FOR START: Yes CLEARANCE TYPE: Secret TRAVEL: Yes, 10% of the Time Description At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work - and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, they're making history. The AMS E&S organization at Northrop Grumman Missions Systems in Baltimore, Maryland is seeking experienced digital and RF subsystem integration and test engineers and technical leads in the following areas: Digital receiver/exciter and related digital-RF subsystem integration, subsystem control design, and architecture. Work is performed without appreciable direction and exercising considerable latitude in determining technical objectives of assignments. Candidates would have the ability to develop technical solutions to complex problems which require the regular use of ingenuity and creativity. The qualified candidates will work with a diverse and talented team of engineers developing innovative and cost-effective systems that support a broad range of products and business areas across the lifecycle of a program. Applicants should possess the ability to communicate effectively and clearly present technical approaches and findings. Responsibilities may include: Integration of digital receiver/exciter hardware and representative lab test environments Integration of new equipment and programs in a state-of-the-art facility Software development for automating test processes and data analysis Troubleshooting digital and RF issues during test of advanced antenna systems and system-on-chip designs Analyzing test data and identifying early trends Supporting program meetings in developing root cause and corrective actions Collaborating with design engineering for hardware, controls, and test improvements Subsystem analysis including digital architecture, signal paths, and hardware interfaces from RF front end through digital processing Support for performance testing, requirements verification, and more. In addition, this candidate should have demonstrated technical ability/leadership and expertise in one or more of the following areas: Digital-RF subsystem integration, test, and system integration System-on-chip FPGA and/or front-end software design Highly integrated digital-RF subsystems, antenna hardware, and receiver/exciter hardware for active electronically scanned array (AESA) systems Development and verification of complex front-end and subsystem controls across systems Electronic warfare, radar, or related mission-system principles and their system applications Subsystem requirements (hardware and digital) derivation, flow-down, and configuration Comfort creating test support applications and tools using MATLAB or similar technical computing tools Conducting Test Readiness Reviews and/or Design Readiness Reviews Concept of operations development for integration and test activities Executing subsystem and system level testing - both in engineering development and manufacturing environments This role is contingent upon candidates having a current, active government Secret Clearance. This role is contingent upon Program Award. This is a Dual-level opening, candidates will be considered at both a level 3 (Principal Engineer) or 4 (Sr. Principal Engineer) based upon the Basic Qualifications listed below. Basic Qualification - Principal Digital-RF Subsystems Integration & Test: Must hold a Secret or Top-Secret security clearance Must have a Bachelors Degree in Engineering or related discipline with 5 years of experience in the areas described in the job description or Master's Degree with 3 years of experience or PhD with 0 years of experience. An additional 4 years' experience is acceptable in lieu of degree. Experience using MATLAB or similar engineering analysis tools Experience with digital and/or RF subsystem integration and test Experience with setup and testing of hardware in a lab or benchtop environment Basic Qualification Sr. Principal Digital-RF Subsystems Integration & Test: Must hold a Secret or Top-Secret security clearance Must have a Bachelors Degree in Engineering or related discipline with 8 years of experience in the areas described in the job description or a Masters Degree with 6 years of experience or PhD with 4 years of experience. An additional 4 years' experience is acceptable in lieu of a degree. Strong experience using MATLAB or similar engineering analysis tools Experience with digital and/or RF subsystem integration and test Experience with setup and testing of hardware in a lab or benchtop environment Ability to delegate, task, and provide technical oversight for junior engineers Preferred Qualifications: TS/SCI clearance SAP clearance Strong knowledge of: Setting up lab, system integration, and digital-RF hardware test environments Control architectures and control design/integration for hardware with firmware, embedded software, and ASICs Knowledge of: RF and antenna theory, including RF performance analysis Python VHDL/Verilog C++ Test development experience for lab test environments and subsystem hardware Experience troubleshooting digital-RF subsystems Understanding of digital signal processing chains Experience working with and supporting engineers across firmware, software, power, and RF test teams Primary Level Salary Range: $119,600.00 - $179,400.00 Secondary Level Salary Range: $149,300.00 - $223,900.00 The above salary range represents a general guideline; however, Northrop Grumman considers a number of factors when determining base salary offers such as the scope and responsibilities of the position and the candidate's experience, education, skills and current market conditions. Depending on the position, employees may be eligible for overtime, shift differential, and a discretionary bonus in addition to base pay. Annual bonuses are designed to reward individual contributions as well as allow employees to share in company results. Employees in Vice President or Director positions may be eligible for Long Term Incentives. In addition, Northrop Grumman provides a variety of benefits including health insurance coverage, life and disability insurance, savings plan, Company paid holidays and paid time off (PTO) for vacation and/or personal business. The application period for the job is estimated to be 20 days from the job posting date. However, this timeline may be shortened or extended depending on business needs and the availability of qualified candidates. Northrop Grumman is an Equal Opportunity Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO and pay transparency statement, please visit U.S. Citizenship is required for all positions with a government clearance and certain other restricted positions.
RELOCATION ASSISTANCE: Relocation assistance may be available CLEARANCE REQUIRED FOR START: Yes CLEARANCE TYPE: Secret TRAVEL: Yes, 10% of the Time Description At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work - and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, they're making history. The AMS E&S organization at Northrop Grumman Missions Systems in Baltimore, Maryland is seeking experienced digital and RF subsystem integration and test engineers and technical leads in the following areas: Digital receiver/exciter and related digital-RF subsystem integration, subsystem control design, and architecture. Work is performed without appreciable direction and exercising considerable latitude in determining technical objectives of assignments. Candidates would have the ability to develop technical solutions to complex problems which require the regular use of ingenuity and creativity. The qualified candidates will work with a diverse and talented team of engineers developing innovative and cost-effective systems that support a broad range of products and business areas across the lifecycle of a program. Applicants should possess the ability to communicate effectively and clearly present technical approaches and findings. Responsibilities may include: Integration of digital receiver/exciter hardware and representative lab test environments Integration of new equipment and programs in a state-of-the-art facility Software development for automating test processes and data analysis Troubleshooting digital and RF issues during test of advanced antenna systems and system-on-chip designs Analyzing test data and identifying early trends Supporting program meetings in developing root cause and corrective actions Collaborating with design engineering for hardware, controls, and test improvements Subsystem analysis including digital architecture, signal paths, and hardware interfaces from RF front end through digital processing Support for performance testing, requirements verification, and more. In addition, this candidate should have demonstrated technical ability/leadership and expertise in one or more of the following areas: Digital-RF subsystem integration, test, and system integration System-on-chip FPGA and/or front-end software design Highly integrated digital-RF subsystems, antenna hardware, and receiver/exciter hardware for active electronically scanned array (AESA) systems Development and verification of complex front-end and subsystem controls across systems Electronic warfare, radar, or related mission-system principles and their system applications Subsystem requirements (hardware and digital) derivation, flow-down, and configuration Comfort creating test support applications and tools using MATLAB or similar technical computing tools Conducting Test Readiness Reviews and/or Design Readiness Reviews Concept of operations development for integration and test activities Executing subsystem and system level testing - both in engineering development and manufacturing environments This role is contingent upon candidates having a current, active government Secret Clearance. This role is contingent upon Program Award. This is a Dual-level opening, candidates will be considered at both a level 3 (Principal Engineer) or 4 (Sr. Principal Engineer) based upon the Basic Qualifications listed below. Basic Qualification - Principal Digital-RF Subsystems Integration & Test: Must hold a Secret or Top-Secret security clearance Must have a Bachelors Degree in Engineering or related discipline with 5 years of experience in the areas described in the job description or Master's Degree with 3 years of experience or PhD with 0 years of experience. An additional 4 years' experience is acceptable in lieu of degree. Experience using MATLAB or similar engineering analysis tools Experience with digital and/or RF subsystem integration and test Experience with setup and testing of hardware in a lab or benchtop environment Basic Qualification Sr. Principal Digital-RF Subsystems Integration & Test: Must hold a Secret or Top-Secret security clearance Must have a Bachelors Degree in Engineering or related discipline with 8 years of experience in the areas described in the job description or a Masters Degree with 6 years of experience or PhD with 4 years of experience. An additional 4 years' experience is acceptable in lieu of a degree. Strong experience using MATLAB or similar engineering analysis tools Experience with digital and/or RF subsystem integration and test Experience with setup and testing of hardware in a lab or benchtop environment Ability to delegate, task, and provide technical oversight for junior engineers Preferred Qualifications: TS/SCI clearance SAP clearance Strong knowledge of: Setting up lab, system integration, and digital-RF hardware test environments Control architectures and control design/integration for hardware with firmware, embedded software, and ASICs Knowledge of: RF and antenna theory, including RF performance analysis Python VHDL/Verilog C++ Test development experience for lab test environments and subsystem hardware Experience troubleshooting digital-RF subsystems Understanding of digital signal processing chains Experience working with and supporting engineers across firmware, software, power, and RF test teams Primary Level Salary Range: $119,600.00 - $179,400.00 Secondary Level Salary Range: $149,300.00 - $223,900.00 The above salary range represents a general guideline; however, Northrop Grumman considers a number of factors when determining base salary offers such as the scope and responsibilities of the position and the candidate's experience, education, skills and current market conditions. Depending on the position, employees may be eligible for overtime, shift differential, and a discretionary bonus in addition to base pay. Annual bonuses are designed to reward individual contributions as well as allow employees to share in company results. Employees in Vice President or Director positions may be eligible for Long Term Incentives. In addition, Northrop Grumman provides a variety of benefits including health insurance coverage, life and disability insurance, savings plan, Company paid holidays and paid time off (PTO) for vacation and/or personal business. The application period for the job is estimated to be 20 days from the job posting date. However, this timeline may be shortened or extended depending on business needs and the availability of qualified candidates. Northrop Grumman is an Equal Opportunity Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO and pay transparency statement, please visit U.S. Citizenship is required for all positions with a government clearance and certain other restricted positions.
11/13/2026
Full time
RELOCATION ASSISTANCE: Relocation assistance may be available CLEARANCE REQUIRED FOR START: Yes CLEARANCE TYPE: Secret TRAVEL: Yes, 10% of the Time Description At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work - and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, they're making history. The AMS E&S organization at Northrop Grumman Missions Systems in Baltimore, Maryland is seeking experienced digital and RF subsystem integration and test engineers and technical leads in the following areas: Digital receiver/exciter and related digital-RF subsystem integration, subsystem control design, and architecture. Work is performed without appreciable direction and exercising considerable latitude in determining technical objectives of assignments. Candidates would have the ability to develop technical solutions to complex problems which require the regular use of ingenuity and creativity. The qualified candidates will work with a diverse and talented team of engineers developing innovative and cost-effective systems that support a broad range of products and business areas across the lifecycle of a program. Applicants should possess the ability to communicate effectively and clearly present technical approaches and findings. Responsibilities may include: Integration of digital receiver/exciter hardware and representative lab test environments Integration of new equipment and programs in a state-of-the-art facility Software development for automating test processes and data analysis Troubleshooting digital and RF issues during test of advanced antenna systems and system-on-chip designs Analyzing test data and identifying early trends Supporting program meetings in developing root cause and corrective actions Collaborating with design engineering for hardware, controls, and test improvements Subsystem analysis including digital architecture, signal paths, and hardware interfaces from RF front end through digital processing Support for performance testing, requirements verification, and more. In addition, this candidate should have demonstrated technical ability/leadership and expertise in one or more of the following areas: Digital-RF subsystem integration, test, and system integration System-on-chip FPGA and/or front-end software design Highly integrated digital-RF subsystems, antenna hardware, and receiver/exciter hardware for active electronically scanned array (AESA) systems Development and verification of complex front-end and subsystem controls across systems Electronic warfare, radar, or related mission-system principles and their system applications Subsystem requirements (hardware and digital) derivation, flow-down, and configuration Comfort creating test support applications and tools using MATLAB or similar technical computing tools Conducting Test Readiness Reviews and/or Design Readiness Reviews Concept of operations development for integration and test activities Executing subsystem and system level testing - both in engineering development and manufacturing environments This role is contingent upon candidates having a current, active government Secret Clearance. This role is contingent upon Program Award. This is a Dual-level opening, candidates will be considered at both a level 3 (Principal Engineer) or 4 (Sr. Principal Engineer) based upon the Basic Qualifications listed below. Basic Qualification - Principal Digital-RF Subsystems Integration & Test: Must hold a Secret or Top-Secret security clearance Must have a Bachelors Degree in Engineering or related discipline with 5 years of experience in the areas described in the job description or Master's Degree with 3 years of experience or PhD with 0 years of experience. An additional 4 years' experience is acceptable in lieu of degree. Experience using MATLAB or similar engineering analysis tools Experience with digital and/or RF subsystem integration and test Experience with setup and testing of hardware in a lab or benchtop environment Basic Qualification Sr. Principal Digital-RF Subsystems Integration & Test: Must hold a Secret or Top-Secret security clearance Must have a Bachelors Degree in Engineering or related discipline with 8 years of experience in the areas described in the job description or a Masters Degree with 6 years of experience or PhD with 4 years of experience. An additional 4 years' experience is acceptable in lieu of a degree. Strong experience using MATLAB or similar engineering analysis tools Experience with digital and/or RF subsystem integration and test Experience with setup and testing of hardware in a lab or benchtop environment Ability to delegate, task, and provide technical oversight for junior engineers Preferred Qualifications: TS/SCI clearance SAP clearance Strong knowledge of: Setting up lab, system integration, and digital-RF hardware test environments Control architectures and control design/integration for hardware with firmware, embedded software, and ASICs Knowledge of: RF and antenna theory, including RF performance analysis Python VHDL/Verilog C++ Test development experience for lab test environments and subsystem hardware Experience troubleshooting digital-RF subsystems Understanding of digital signal processing chains Experience working with and supporting engineers across firmware, software, power, and RF test teams Primary Level Salary Range: $119,600.00 - $179,400.00 Secondary Level Salary Range: $149,300.00 - $223,900.00 The above salary range represents a general guideline; however, Northrop Grumman considers a number of factors when determining base salary offers such as the scope and responsibilities of the position and the candidate's experience, education, skills and current market conditions. Depending on the position, employees may be eligible for overtime, shift differential, and a discretionary bonus in addition to base pay. Annual bonuses are designed to reward individual contributions as well as allow employees to share in company results. Employees in Vice President or Director positions may be eligible for Long Term Incentives. In addition, Northrop Grumman provides a variety of benefits including health insurance coverage, life and disability insurance, savings plan, Company paid holidays and paid time off (PTO) for vacation and/or personal business. The application period for the job is estimated to be 20 days from the job posting date. However, this timeline may be shortened or extended depending on business needs and the availability of qualified candidates. Northrop Grumman is an Equal Opportunity Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO and pay transparency statement, please visit U.S. Citizenship is required for all positions with a government clearance and certain other restricted positions.
RELOCATION ASSISTANCE: Relocation assistance may be available CLEARANCE REQUIRED FOR START: Yes CLEARANCE TYPE: Secret TRAVEL: Yes, 10% of the Time Description At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work - and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, they're making history. The AMS E&S organization at Northrop Grumman Missions Systems in Baltimore, Maryland is seeking experienced digital and RF subsystem integration and test engineers and technical leads in the following areas: Digital receiver/exciter and related digital-RF subsystem integration, subsystem control design, and architecture. Work is performed without appreciable direction and exercising considerable latitude in determining technical objectives of assignments. Candidates would have the ability to develop technical solutions to complex problems which require the regular use of ingenuity and creativity. The qualified candidates will work with a diverse and talented team of engineers developing innovative and cost-effective systems that support a broad range of products and business areas across the lifecycle of a program. Applicants should possess the ability to communicate effectively and clearly present technical approaches and findings. Responsibilities may include: Integration of digital receiver/exciter hardware and representative lab test environments Integration of new equipment and programs in a state-of-the-art facility Software development for automating test processes and data analysis Troubleshooting digital and RF issues during test of advanced antenna systems and system-on-chip designs Analyzing test data and identifying early trends Supporting program meetings in developing root cause and corrective actions Collaborating with design engineering for hardware, controls, and test improvements Subsystem analysis including digital architecture, signal paths, and hardware interfaces from RF front end through digital processing Support for performance testing, requirements verification, and more. In addition, this candidate should have demonstrated technical ability/leadership and expertise in one or more of the following areas: Digital-RF subsystem integration, test, and system integration System-on-chip FPGA and/or front-end software design Highly integrated digital-RF subsystems, antenna hardware, and receiver/exciter hardware for active electronically scanned array (AESA) systems Development and verification of complex front-end and subsystem controls across systems Electronic warfare, radar, or related mission-system principles and their system applications Subsystem requirements (hardware and digital) derivation, flow-down, and configuration Comfort creating test support applications and tools using MATLAB or similar technical computing tools Conducting Test Readiness Reviews and/or Design Readiness Reviews Concept of operations development for integration and test activities Executing subsystem and system level testing - both in engineering development and manufacturing environments This role is contingent upon candidates having a current, active government Secret Clearance. This role is contingent upon Program Award. This is a Dual-level opening, candidates will be considered at both a level 3 (Principal Engineer) or 4 (Sr. Principal Engineer) based upon the Basic Qualifications listed below. Basic Qualification - Principal Digital-RF Subsystems Integration & Test: Must hold a Secret or Top-Secret security clearance Must have a Bachelors Degree in Engineering or related discipline with 5 years of experience in the areas described in the job description or Master's Degree with 3 years of experience or PhD with 0 years of experience. An additional 4 years' experience is acceptable in lieu of degree. Experience using MATLAB or similar engineering analysis tools Experience with digital and/or RF subsystem integration and test Experience with setup and testing of hardware in a lab or benchtop environment Basic Qualification Sr. Principal Digital-RF Subsystems Integration & Test: Must hold a Secret or Top-Secret security clearance Must have a Bachelors Degree in Engineering or related discipline with 8 years of experience in the areas described in the job description or a Masters Degree with 6 years of experience or PhD with 4 years of experience. An additional 4 years' experience is acceptable in lieu of a degree. Strong experience using MATLAB or similar engineering analysis tools Experience with digital and/or RF subsystem integration and test Experience with setup and testing of hardware in a lab or benchtop environment Ability to delegate, task, and provide technical oversight for junior engineers Preferred Qualifications: TS/SCI clearance SAP clearance Strong knowledge of: Setting up lab, system integration, and digital-RF hardware test environments Control architectures and control design/integration for hardware with firmware, embedded software, and ASICs Knowledge of: RF and antenna theory, including RF performance analysis Python VHDL/Verilog C++ Test development experience for lab test environments and subsystem hardware Experience troubleshooting digital-RF subsystems Understanding of digital signal processing chains Experience working with and supporting engineers across firmware, software, power, and RF test teams Primary Level Salary Range: $119,600.00 - $179,400.00 Secondary Level Salary Range: $149,300.00 - $223,900.00 The above salary range represents a general guideline; however, Northrop Grumman considers a number of factors when determining base salary offers such as the scope and responsibilities of the position and the candidate's experience, education, skills and current market conditions. Depending on the position, employees may be eligible for overtime, shift differential, and a discretionary bonus in addition to base pay. Annual bonuses are designed to reward individual contributions as well as allow employees to share in company results. Employees in Vice President or Director positions may be eligible for Long Term Incentives. In addition, Northrop Grumman provides a variety of benefits including health insurance coverage, life and disability insurance, savings plan, Company paid holidays and paid time off (PTO) for vacation and/or personal business. The application period for the job is estimated to be 20 days from the job posting date. However, this timeline may be shortened or extended depending on business needs and the availability of qualified candidates. Northrop Grumman is an Equal Opportunity Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO and pay transparency statement, please visit U.S. Citizenship is required for all positions with a government clearance and certain other restricted positions.
11/13/2026
Full time
RELOCATION ASSISTANCE: Relocation assistance may be available CLEARANCE REQUIRED FOR START: Yes CLEARANCE TYPE: Secret TRAVEL: Yes, 10% of the Time Description At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work - and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, they're making history. The AMS E&S organization at Northrop Grumman Missions Systems in Baltimore, Maryland is seeking experienced digital and RF subsystem integration and test engineers and technical leads in the following areas: Digital receiver/exciter and related digital-RF subsystem integration, subsystem control design, and architecture. Work is performed without appreciable direction and exercising considerable latitude in determining technical objectives of assignments. Candidates would have the ability to develop technical solutions to complex problems which require the regular use of ingenuity and creativity. The qualified candidates will work with a diverse and talented team of engineers developing innovative and cost-effective systems that support a broad range of products and business areas across the lifecycle of a program. Applicants should possess the ability to communicate effectively and clearly present technical approaches and findings. Responsibilities may include: Integration of digital receiver/exciter hardware and representative lab test environments Integration of new equipment and programs in a state-of-the-art facility Software development for automating test processes and data analysis Troubleshooting digital and RF issues during test of advanced antenna systems and system-on-chip designs Analyzing test data and identifying early trends Supporting program meetings in developing root cause and corrective actions Collaborating with design engineering for hardware, controls, and test improvements Subsystem analysis including digital architecture, signal paths, and hardware interfaces from RF front end through digital processing Support for performance testing, requirements verification, and more. In addition, this candidate should have demonstrated technical ability/leadership and expertise in one or more of the following areas: Digital-RF subsystem integration, test, and system integration System-on-chip FPGA and/or front-end software design Highly integrated digital-RF subsystems, antenna hardware, and receiver/exciter hardware for active electronically scanned array (AESA) systems Development and verification of complex front-end and subsystem controls across systems Electronic warfare, radar, or related mission-system principles and their system applications Subsystem requirements (hardware and digital) derivation, flow-down, and configuration Comfort creating test support applications and tools using MATLAB or similar technical computing tools Conducting Test Readiness Reviews and/or Design Readiness Reviews Concept of operations development for integration and test activities Executing subsystem and system level testing - both in engineering development and manufacturing environments This role is contingent upon candidates having a current, active government Secret Clearance. This role is contingent upon Program Award. This is a Dual-level opening, candidates will be considered at both a level 3 (Principal Engineer) or 4 (Sr. Principal Engineer) based upon the Basic Qualifications listed below. Basic Qualification - Principal Digital-RF Subsystems Integration & Test: Must hold a Secret or Top-Secret security clearance Must have a Bachelors Degree in Engineering or related discipline with 5 years of experience in the areas described in the job description or Master's Degree with 3 years of experience or PhD with 0 years of experience. An additional 4 years' experience is acceptable in lieu of degree. Experience using MATLAB or similar engineering analysis tools Experience with digital and/or RF subsystem integration and test Experience with setup and testing of hardware in a lab or benchtop environment Basic Qualification Sr. Principal Digital-RF Subsystems Integration & Test: Must hold a Secret or Top-Secret security clearance Must have a Bachelors Degree in Engineering or related discipline with 8 years of experience in the areas described in the job description or a Masters Degree with 6 years of experience or PhD with 4 years of experience. An additional 4 years' experience is acceptable in lieu of a degree. Strong experience using MATLAB or similar engineering analysis tools Experience with digital and/or RF subsystem integration and test Experience with setup and testing of hardware in a lab or benchtop environment Ability to delegate, task, and provide technical oversight for junior engineers Preferred Qualifications: TS/SCI clearance SAP clearance Strong knowledge of: Setting up lab, system integration, and digital-RF hardware test environments Control architectures and control design/integration for hardware with firmware, embedded software, and ASICs Knowledge of: RF and antenna theory, including RF performance analysis Python VHDL/Verilog C++ Test development experience for lab test environments and subsystem hardware Experience troubleshooting digital-RF subsystems Understanding of digital signal processing chains Experience working with and supporting engineers across firmware, software, power, and RF test teams Primary Level Salary Range: $119,600.00 - $179,400.00 Secondary Level Salary Range: $149,300.00 - $223,900.00 The above salary range represents a general guideline; however, Northrop Grumman considers a number of factors when determining base salary offers such as the scope and responsibilities of the position and the candidate's experience, education, skills and current market conditions. Depending on the position, employees may be eligible for overtime, shift differential, and a discretionary bonus in addition to base pay. Annual bonuses are designed to reward individual contributions as well as allow employees to share in company results. Employees in Vice President or Director positions may be eligible for Long Term Incentives. In addition, Northrop Grumman provides a variety of benefits including health insurance coverage, life and disability insurance, savings plan, Company paid holidays and paid time off (PTO) for vacation and/or personal business. The application period for the job is estimated to be 20 days from the job posting date. However, this timeline may be shortened or extended depending on business needs and the availability of qualified candidates. Northrop Grumman is an Equal Opportunity Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO and pay transparency statement, please visit U.S. Citizenship is required for all positions with a government clearance and certain other restricted positions.
RELOCATION ASSISTANCE: Relocation assistance may be available CLEARANCE REQUIRED FOR START: Yes CLEARANCE TYPE: Secret TRAVEL: Yes, 10% of the Time Description At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work - and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, they're making history. Job Description Northrop Grumman Mission Systems is a trusted provider of mission-enabling solutions for global security. Our Engineering and Sciences (E&S) organization pushes the boundaries of innovation, redefines engineering capabilities, and drives advances in various sciences. Our team is chartered with providing the skills, innovative technologies to develop, design, produce and sustain optimized product lines across the sector while providing a decisive advantage to the warfighter. Come be a part of our mission! We are looking for you to join our team as a Mechanical Analysis Engineer based out of Woodland Hills, CA. As a Mechanical Analysis Engineer at Northrop Grumman, you will have a challenging and rewarding opportunity to be a part of our Enterprise-wide digital transformation. Through the use of model-based engineering and agile practices, we continue to evolve how we deliver critical national defense products and capabilities for the warfighter. Our success is grounded in our ability to embrace change, move quickly and continuously drive innovation. The successful candidate will be collaborative, open, transparent, and team-oriented with a focus on team empowerment & shared responsibility, flexibility, continuous learning, and a culture of automation. Based in our Woodland Hills, CA office, this position will support senior mechanical engineers in the design of military avionics including inertial navigation and measurement systems and mission computers for the Sentinel program. This position is not eligible for remote work. This position will be 100% on-site. This role may offer a competitive relocation assistance package. This requisition may be filled as a Principal Mechanical Analysis Engineer or a Senior Principal Mechanical Analysis Engineer. Roles and Responsibilities: Serve as technical individual contributor for the Analysis Engineering Team Understanding of the requirements and methods of analyzing structures to determine structural viability that leads to certification Perform structural analysis including static, dynamics, stability, and damage tolerance analysis of metallic structures, mechanical systems, electromechanical systems, and equipment, by hand and by using the automated methods and procedures approved for the program Build Finite Element Models (FEMs) using CAD geometry, meshing, and running solutions Review drawings, requirements for materials, structure systems & subsystems and perform required analyses to demonstrate compliance. Able to manipulate large scale finite element models Document structural analysis methods and implementation using calculation aids and propose new methods depending on the needs of the project Compute margins using appropriate analysis methods Document static/dynamic test plans and procedure requirements Participate and present in internal and external (customer) design reviews Able to support material review board (MRB) and nonconformance to ensure we have sound structural substantiation Solid understanding and background in loads development, preliminary and detailed design, static analysis, FEM, D&DT, fatigue, bolted and bonded interfaces, repair, structural test, and in-service mods, repairs and extensions Candidate must be able to collaborate in a team environment, prioritize and adjust tasks to accomplish the project result, prioritize multiple responsibilities and/or accomplish them simultaneously, and comprehend and analyze complex problems and develop solutions Basic Qualifications for a Principal Mechanical Analysis Engineer: Bachelor's degree with 5 years of experience, a Master's degree with 3 years of experience or a Ph.D. with 0 years of experience in Science, Technology, Engineering, Mathematics, or related technical fields U.S. Citizenship is required Active US Government Secret clearance is required Experience with developing FEA models and conducting analyses in ANSYS Experience in 3 or more of the following topics: system/sub-system FEA modeling/analysis, piece parts, static, modal, buckling, dynamic (sine, random, acoustic), thermal strength/distortion, and bolted joint analyses Ability to verify validity of simulation results by hand-calcs and/or comparison with heritage programs and to perform bolted joint analyses Ability to work on site in Woodland Hills, Ca as required by this position Basic Qualifications for a Senior Principal Mechanical Analysis Engineer: Bachelor's degree with 8 years of experience, a Master's degree with 6 years of experience or a Ph.D. with 4 years of experience in Science, Technology, Engineering, Mathematics, or related technical fields U.S. Citizenship is required. Active US Government Secret clearance is required Experience with developing FEA models and conducting analyses in ANSYS Experience in 3 or more of the following topics: system/sub-system FEA modeling/analysis, piece parts, static, modal, buckling, dynamic (sine, random, acoustic), thermal strength/distortion, and bolted joint analyses Ability to verify validity of simulation results by hand-calcs and/or comparison with heritage programs and to perform bolted joint analyses Ability to work on site in Woodland Hills, Ca as required by this position Preferred Qualifications: Thermal analysis experience CCA analysis experience Prior experience with 3D Computer Aided Design (CAD) software applications Experience in test planning, test support, and data reduction Experience supporting mechanical analysis of circuit card design Demonstrated high degree of creativity and ability to solve a wide range of difficult problems Demonstrated ability to be self-motivated, willing to learn, experience working in a team environment Competence and confidence working under pressure on requests with short turn-around times As a full-time employee of Northrop Grumman Mission Systems, you are eligible for our robust benefits package including: Medical, Dental & Vision coverage 401k Educational Assistance Life Insurance Employee Assistance Programs & Work/Life Solutions Paid Time Off Health & Wellness Resources Employee Discounts Link to Benefits: This position's standard work schedule is a 9/80. The 9/80 schedule allows employees who work a nine-hour day Monday through Thursday to take every other Friday off. Primary Level Salary Range: $103,600.00 - $155,400.00 Secondary Level Salary Range: $129,300.00 - $193,900.00 The above salary range represents a general guideline; however, Northrop Grumman considers a number of factors when determining base salary offers such as the scope and responsibilities of the position and the candidate's experience, education, skills and current market conditions. Depending on the position, employees may be eligible for overtime, shift differential, and a discretionary bonus in addition to base pay. Annual bonuses are designed to reward individual contributions as well as allow employees to share in company results. Employees in Vice President or Director positions may be eligible for Long Term Incentives. In addition, Northrop Grumman provides a variety of benefits including health insurance coverage, life and disability insurance, savings plan, Company paid holidays and paid time off (PTO) for vacation and/or personal business. The application period for the job is estimated to be 20 days from the job posting date. However, this timeline may be shortened or extended depending on business needs and the availability of qualified candidates. Northrop Grumman is an Equal Opportunity Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO and pay transparency statement, please visit U.S. Citizenship is required for all positions with a government clearance and certain other restricted positions.
11/13/2026
Full time
RELOCATION ASSISTANCE: Relocation assistance may be available CLEARANCE REQUIRED FOR START: Yes CLEARANCE TYPE: Secret TRAVEL: Yes, 10% of the Time Description At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work - and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, they're making history. Job Description Northrop Grumman Mission Systems is a trusted provider of mission-enabling solutions for global security. Our Engineering and Sciences (E&S) organization pushes the boundaries of innovation, redefines engineering capabilities, and drives advances in various sciences. Our team is chartered with providing the skills, innovative technologies to develop, design, produce and sustain optimized product lines across the sector while providing a decisive advantage to the warfighter. Come be a part of our mission! We are looking for you to join our team as a Mechanical Analysis Engineer based out of Woodland Hills, CA. As a Mechanical Analysis Engineer at Northrop Grumman, you will have a challenging and rewarding opportunity to be a part of our Enterprise-wide digital transformation. Through the use of model-based engineering and agile practices, we continue to evolve how we deliver critical national defense products and capabilities for the warfighter. Our success is grounded in our ability to embrace change, move quickly and continuously drive innovation. The successful candidate will be collaborative, open, transparent, and team-oriented with a focus on team empowerment & shared responsibility, flexibility, continuous learning, and a culture of automation. Based in our Woodland Hills, CA office, this position will support senior mechanical engineers in the design of military avionics including inertial navigation and measurement systems and mission computers for the Sentinel program. This position is not eligible for remote work. This position will be 100% on-site. This role may offer a competitive relocation assistance package. This requisition may be filled as a Principal Mechanical Analysis Engineer or a Senior Principal Mechanical Analysis Engineer. Roles and Responsibilities: Serve as technical individual contributor for the Analysis Engineering Team Understanding of the requirements and methods of analyzing structures to determine structural viability that leads to certification Perform structural analysis including static, dynamics, stability, and damage tolerance analysis of metallic structures, mechanical systems, electromechanical systems, and equipment, by hand and by using the automated methods and procedures approved for the program Build Finite Element Models (FEMs) using CAD geometry, meshing, and running solutions Review drawings, requirements for materials, structure systems & subsystems and perform required analyses to demonstrate compliance. Able to manipulate large scale finite element models Document structural analysis methods and implementation using calculation aids and propose new methods depending on the needs of the project Compute margins using appropriate analysis methods Document static/dynamic test plans and procedure requirements Participate and present in internal and external (customer) design reviews Able to support material review board (MRB) and nonconformance to ensure we have sound structural substantiation Solid understanding and background in loads development, preliminary and detailed design, static analysis, FEM, D&DT, fatigue, bolted and bonded interfaces, repair, structural test, and in-service mods, repairs and extensions Candidate must be able to collaborate in a team environment, prioritize and adjust tasks to accomplish the project result, prioritize multiple responsibilities and/or accomplish them simultaneously, and comprehend and analyze complex problems and develop solutions Basic Qualifications for a Principal Mechanical Analysis Engineer: Bachelor's degree with 5 years of experience, a Master's degree with 3 years of experience or a Ph.D. with 0 years of experience in Science, Technology, Engineering, Mathematics, or related technical fields U.S. Citizenship is required Active US Government Secret clearance is required Experience with developing FEA models and conducting analyses in ANSYS Experience in 3 or more of the following topics: system/sub-system FEA modeling/analysis, piece parts, static, modal, buckling, dynamic (sine, random, acoustic), thermal strength/distortion, and bolted joint analyses Ability to verify validity of simulation results by hand-calcs and/or comparison with heritage programs and to perform bolted joint analyses Ability to work on site in Woodland Hills, Ca as required by this position Basic Qualifications for a Senior Principal Mechanical Analysis Engineer: Bachelor's degree with 8 years of experience, a Master's degree with 6 years of experience or a Ph.D. with 4 years of experience in Science, Technology, Engineering, Mathematics, or related technical fields U.S. Citizenship is required. Active US Government Secret clearance is required Experience with developing FEA models and conducting analyses in ANSYS Experience in 3 or more of the following topics: system/sub-system FEA modeling/analysis, piece parts, static, modal, buckling, dynamic (sine, random, acoustic), thermal strength/distortion, and bolted joint analyses Ability to verify validity of simulation results by hand-calcs and/or comparison with heritage programs and to perform bolted joint analyses Ability to work on site in Woodland Hills, Ca as required by this position Preferred Qualifications: Thermal analysis experience CCA analysis experience Prior experience with 3D Computer Aided Design (CAD) software applications Experience in test planning, test support, and data reduction Experience supporting mechanical analysis of circuit card design Demonstrated high degree of creativity and ability to solve a wide range of difficult problems Demonstrated ability to be self-motivated, willing to learn, experience working in a team environment Competence and confidence working under pressure on requests with short turn-around times As a full-time employee of Northrop Grumman Mission Systems, you are eligible for our robust benefits package including: Medical, Dental & Vision coverage 401k Educational Assistance Life Insurance Employee Assistance Programs & Work/Life Solutions Paid Time Off Health & Wellness Resources Employee Discounts Link to Benefits: This position's standard work schedule is a 9/80. The 9/80 schedule allows employees who work a nine-hour day Monday through Thursday to take every other Friday off. Primary Level Salary Range: $103,600.00 - $155,400.00 Secondary Level Salary Range: $129,300.00 - $193,900.00 The above salary range represents a general guideline; however, Northrop Grumman considers a number of factors when determining base salary offers such as the scope and responsibilities of the position and the candidate's experience, education, skills and current market conditions. Depending on the position, employees may be eligible for overtime, shift differential, and a discretionary bonus in addition to base pay. Annual bonuses are designed to reward individual contributions as well as allow employees to share in company results. Employees in Vice President or Director positions may be eligible for Long Term Incentives. In addition, Northrop Grumman provides a variety of benefits including health insurance coverage, life and disability insurance, savings plan, Company paid holidays and paid time off (PTO) for vacation and/or personal business. The application period for the job is estimated to be 20 days from the job posting date. However, this timeline may be shortened or extended depending on business needs and the availability of qualified candidates. Northrop Grumman is an Equal Opportunity Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO and pay transparency statement, please visit U.S. Citizenship is required for all positions with a government clearance and certain other restricted positions.
RELOCATION ASSISTANCE: Relocation assistance may be available CLEARANCE REQUIRED FOR START: Yes CLEARANCE TYPE: Secret TRAVEL: Yes, 10% of the Time Description At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work - and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, they're making history. The AMS E&S organization at Northrop Grumman Missions Systems in Baltimore, Maryland is seeking experienced digital and RF subsystem integration and test engineers and technical leads in the following areas: Digital receiver/exciter and related digital-RF subsystem integration, subsystem control design, and architecture. Work is performed without appreciable direction and exercising considerable latitude in determining technical objectives of assignments. Candidates would have the ability to develop technical solutions to complex problems which require the regular use of ingenuity and creativity. The qualified candidates will work with a diverse and talented team of engineers developing innovative and cost-effective systems that support a broad range of products and business areas across the lifecycle of a program. Applicants should possess the ability to communicate effectively and clearly present technical approaches and findings. Responsibilities may include: Integration of digital receiver/exciter hardware and representative lab test environments Integration of new equipment and programs in a state-of-the-art facility Software development for automating test processes and data analysis Troubleshooting digital and RF issues during test of advanced antenna systems and system-on-chip designs Analyzing test data and identifying early trends Supporting program meetings in developing root cause and corrective actions Collaborating with design engineering for hardware, controls, and test improvements Subsystem analysis including digital architecture, signal paths, and hardware interfaces from RF front end through digital processing Support for performance testing, requirements verification, and more. In addition, this candidate should have demonstrated technical ability/leadership and expertise in one or more of the following areas: Digital-RF subsystem integration, test, and system integration System-on-chip FPGA and/or front-end software design Highly integrated digital-RF subsystems, antenna hardware, and receiver/exciter hardware for active electronically scanned array (AESA) systems Development and verification of complex front-end and subsystem controls across systems Electronic warfare, radar, or related mission-system principles and their system applications Subsystem requirements (hardware and digital) derivation, flow-down, and configuration Comfort creating test support applications and tools using MATLAB or similar technical computing tools Conducting Test Readiness Reviews and/or Design Readiness Reviews Concept of operations development for integration and test activities Executing subsystem and system level testing - both in engineering development and manufacturing environments This role is contingent upon candidates having a current, active government Secret Clearance. This role is contingent upon Program Award. This is a Dual-level opening, candidates will be considered at both a level 3 (Principal Engineer) or 4 (Sr. Principal Engineer) based upon the Basic Qualifications listed below. Basic Qualification - Principal Digital-RF Subsystems Integration & Test: Must hold a Secret or Top-Secret security clearance Must have a Bachelors Degree in Engineering or related discipline with 5 years of experience in the areas described in the job description or Master's Degree with 3 years of experience or PhD with 0 years of experience. An additional 4 years' experience is acceptable in lieu of degree. Experience using MATLAB or similar engineering analysis tools Experience with digital and/or RF subsystem integration and test Experience with setup and testing of hardware in a lab or benchtop environment Basic Qualification Sr. Principal Digital-RF Subsystems Integration & Test: Must hold a Secret or Top-Secret security clearance Must have a Bachelors Degree in Engineering or related discipline with 8 years of experience in the areas described in the job description or a Masters Degree with 6 years of experience or PhD with 4 years of experience. An additional 4 years' experience is acceptable in lieu of a degree. Strong experience using MATLAB or similar engineering analysis tools Experience with digital and/or RF subsystem integration and test Experience with setup and testing of hardware in a lab or benchtop environment Ability to delegate, task, and provide technical oversight for junior engineers Preferred Qualifications: TS/SCI clearance SAP clearance Strong knowledge of: Setting up lab, system integration, and digital-RF hardware test environments Control architectures and control design/integration for hardware with firmware, embedded software, and ASICs Knowledge of: RF and antenna theory, including RF performance analysis Python VHDL/Verilog C++ Test development experience for lab test environments and subsystem hardware Experience troubleshooting digital-RF subsystems Understanding of digital signal processing chains Experience working with and supporting engineers across firmware, software, power, and RF test teams Primary Level Salary Range: $119,600.00 - $179,400.00 Secondary Level Salary Range: $149,300.00 - $223,900.00 The above salary range represents a general guideline; however, Northrop Grumman considers a number of factors when determining base salary offers such as the scope and responsibilities of the position and the candidate's experience, education, skills and current market conditions. Depending on the position, employees may be eligible for overtime, shift differential, and a discretionary bonus in addition to base pay. Annual bonuses are designed to reward individual contributions as well as allow employees to share in company results. Employees in Vice President or Director positions may be eligible for Long Term Incentives. In addition, Northrop Grumman provides a variety of benefits including health insurance coverage, life and disability insurance, savings plan, Company paid holidays and paid time off (PTO) for vacation and/or personal business. The application period for the job is estimated to be 20 days from the job posting date. However, this timeline may be shortened or extended depending on business needs and the availability of qualified candidates. Northrop Grumman is an Equal Opportunity Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO and pay transparency statement, please visit U.S. Citizenship is required for all positions with a government clearance and certain other restricted positions.
11/13/2026
Full time
RELOCATION ASSISTANCE: Relocation assistance may be available CLEARANCE REQUIRED FOR START: Yes CLEARANCE TYPE: Secret TRAVEL: Yes, 10% of the Time Description At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work - and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, they're making history. The AMS E&S organization at Northrop Grumman Missions Systems in Baltimore, Maryland is seeking experienced digital and RF subsystem integration and test engineers and technical leads in the following areas: Digital receiver/exciter and related digital-RF subsystem integration, subsystem control design, and architecture. Work is performed without appreciable direction and exercising considerable latitude in determining technical objectives of assignments. Candidates would have the ability to develop technical solutions to complex problems which require the regular use of ingenuity and creativity. The qualified candidates will work with a diverse and talented team of engineers developing innovative and cost-effective systems that support a broad range of products and business areas across the lifecycle of a program. Applicants should possess the ability to communicate effectively and clearly present technical approaches and findings. Responsibilities may include: Integration of digital receiver/exciter hardware and representative lab test environments Integration of new equipment and programs in a state-of-the-art facility Software development for automating test processes and data analysis Troubleshooting digital and RF issues during test of advanced antenna systems and system-on-chip designs Analyzing test data and identifying early trends Supporting program meetings in developing root cause and corrective actions Collaborating with design engineering for hardware, controls, and test improvements Subsystem analysis including digital architecture, signal paths, and hardware interfaces from RF front end through digital processing Support for performance testing, requirements verification, and more. In addition, this candidate should have demonstrated technical ability/leadership and expertise in one or more of the following areas: Digital-RF subsystem integration, test, and system integration System-on-chip FPGA and/or front-end software design Highly integrated digital-RF subsystems, antenna hardware, and receiver/exciter hardware for active electronically scanned array (AESA) systems Development and verification of complex front-end and subsystem controls across systems Electronic warfare, radar, or related mission-system principles and their system applications Subsystem requirements (hardware and digital) derivation, flow-down, and configuration Comfort creating test support applications and tools using MATLAB or similar technical computing tools Conducting Test Readiness Reviews and/or Design Readiness Reviews Concept of operations development for integration and test activities Executing subsystem and system level testing - both in engineering development and manufacturing environments This role is contingent upon candidates having a current, active government Secret Clearance. This role is contingent upon Program Award. This is a Dual-level opening, candidates will be considered at both a level 3 (Principal Engineer) or 4 (Sr. Principal Engineer) based upon the Basic Qualifications listed below. Basic Qualification - Principal Digital-RF Subsystems Integration & Test: Must hold a Secret or Top-Secret security clearance Must have a Bachelors Degree in Engineering or related discipline with 5 years of experience in the areas described in the job description or Master's Degree with 3 years of experience or PhD with 0 years of experience. An additional 4 years' experience is acceptable in lieu of degree. Experience using MATLAB or similar engineering analysis tools Experience with digital and/or RF subsystem integration and test Experience with setup and testing of hardware in a lab or benchtop environment Basic Qualification Sr. Principal Digital-RF Subsystems Integration & Test: Must hold a Secret or Top-Secret security clearance Must have a Bachelors Degree in Engineering or related discipline with 8 years of experience in the areas described in the job description or a Masters Degree with 6 years of experience or PhD with 4 years of experience. An additional 4 years' experience is acceptable in lieu of a degree. Strong experience using MATLAB or similar engineering analysis tools Experience with digital and/or RF subsystem integration and test Experience with setup and testing of hardware in a lab or benchtop environment Ability to delegate, task, and provide technical oversight for junior engineers Preferred Qualifications: TS/SCI clearance SAP clearance Strong knowledge of: Setting up lab, system integration, and digital-RF hardware test environments Control architectures and control design/integration for hardware with firmware, embedded software, and ASICs Knowledge of: RF and antenna theory, including RF performance analysis Python VHDL/Verilog C++ Test development experience for lab test environments and subsystem hardware Experience troubleshooting digital-RF subsystems Understanding of digital signal processing chains Experience working with and supporting engineers across firmware, software, power, and RF test teams Primary Level Salary Range: $119,600.00 - $179,400.00 Secondary Level Salary Range: $149,300.00 - $223,900.00 The above salary range represents a general guideline; however, Northrop Grumman considers a number of factors when determining base salary offers such as the scope and responsibilities of the position and the candidate's experience, education, skills and current market conditions. Depending on the position, employees may be eligible for overtime, shift differential, and a discretionary bonus in addition to base pay. Annual bonuses are designed to reward individual contributions as well as allow employees to share in company results. Employees in Vice President or Director positions may be eligible for Long Term Incentives. In addition, Northrop Grumman provides a variety of benefits including health insurance coverage, life and disability insurance, savings plan, Company paid holidays and paid time off (PTO) for vacation and/or personal business. The application period for the job is estimated to be 20 days from the job posting date. However, this timeline may be shortened or extended depending on business needs and the availability of qualified candidates. Northrop Grumman is an Equal Opportunity Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO and pay transparency statement, please visit U.S. Citizenship is required for all positions with a government clearance and certain other restricted positions.
RELOCATION ASSISTANCE: Relocation assistance may be available CLEARANCE REQUIRED FOR START: Yes CLEARANCE TYPE: Secret TRAVEL: Yes, 10% of the Time Description At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work - and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, they're making history. The AMS E&S organization at Northrop Grumman Missions Systems in Baltimore, Maryland is seeking experienced digital and RF subsystem integration and test engineers and technical leads in the following areas: Digital receiver/exciter and related digital-RF subsystem integration, subsystem control design, and architecture. Work is performed without appreciable direction and exercising considerable latitude in determining technical objectives of assignments. Candidates would have the ability to develop technical solutions to complex problems which require the regular use of ingenuity and creativity. The qualified candidates will work with a diverse and talented team of engineers developing innovative and cost-effective systems that support a broad range of products and business areas across the lifecycle of a program. Applicants should possess the ability to communicate effectively and clearly present technical approaches and findings. Responsibilities may include: Integration of digital receiver/exciter hardware and representative lab test environments Integration of new equipment and programs in a state-of-the-art facility Software development for automating test processes and data analysis Troubleshooting digital and RF issues during test of advanced antenna systems and system-on-chip designs Analyzing test data and identifying early trends Supporting program meetings in developing root cause and corrective actions Collaborating with design engineering for hardware, controls, and test improvements Subsystem analysis including digital architecture, signal paths, and hardware interfaces from RF front end through digital processing Support for performance testing, requirements verification, and more. In addition, this candidate should have demonstrated technical ability/leadership and expertise in one or more of the following areas: Digital-RF subsystem integration, test, and system integration System-on-chip FPGA and/or front-end software design Highly integrated digital-RF subsystems, antenna hardware, and receiver/exciter hardware for active electronically scanned array (AESA) systems Development and verification of complex front-end and subsystem controls across systems Electronic warfare, radar, or related mission-system principles and their system applications Subsystem requirements (hardware and digital) derivation, flow-down, and configuration Comfort creating test support applications and tools using MATLAB or similar technical computing tools Conducting Test Readiness Reviews and/or Design Readiness Reviews Concept of operations development for integration and test activities Executing subsystem and system level testing - both in engineering development and manufacturing environments This role is contingent upon candidates having a current, active government Secret Clearance. This role is contingent upon Program Award. This is a Dual-level opening, candidates will be considered at both a level 3 (Principal Engineer) or 4 (Sr. Principal Engineer) based upon the Basic Qualifications listed below. Basic Qualification - Principal Digital-RF Subsystems Integration & Test: Must hold a Secret or Top-Secret security clearance Must have a Bachelors Degree in Engineering or related discipline with 5 years of experience in the areas described in the job description or Master's Degree with 3 years of experience or PhD with 0 years of experience. An additional 4 years' experience is acceptable in lieu of degree. Experience using MATLAB or similar engineering analysis tools Experience with digital and/or RF subsystem integration and test Experience with setup and testing of hardware in a lab or benchtop environment Basic Qualification Sr. Principal Digital-RF Subsystems Integration & Test: Must hold a Secret or Top-Secret security clearance Must have a Bachelors Degree in Engineering or related discipline with 8 years of experience in the areas described in the job description or a Masters Degree with 6 years of experience or PhD with 4 years of experience. An additional 4 years' experience is acceptable in lieu of a degree. Strong experience using MATLAB or similar engineering analysis tools Experience with digital and/or RF subsystem integration and test Experience with setup and testing of hardware in a lab or benchtop environment Ability to delegate, task, and provide technical oversight for junior engineers Preferred Qualifications: TS/SCI clearance SAP clearance Strong knowledge of: Setting up lab, system integration, and digital-RF hardware test environments Control architectures and control design/integration for hardware with firmware, embedded software, and ASICs Knowledge of: RF and antenna theory, including RF performance analysis Python VHDL/Verilog C++ Test development experience for lab test environments and subsystem hardware Experience troubleshooting digital-RF subsystems Understanding of digital signal processing chains Experience working with and supporting engineers across firmware, software, power, and RF test teams Primary Level Salary Range: $119,600.00 - $179,400.00 Secondary Level Salary Range: $149,300.00 - $223,900.00 The above salary range represents a general guideline; however, Northrop Grumman considers a number of factors when determining base salary offers such as the scope and responsibilities of the position and the candidate's experience, education, skills and current market conditions. Depending on the position, employees may be eligible for overtime, shift differential, and a discretionary bonus in addition to base pay. Annual bonuses are designed to reward individual contributions as well as allow employees to share in company results. Employees in Vice President or Director positions may be eligible for Long Term Incentives. In addition, Northrop Grumman provides a variety of benefits including health insurance coverage, life and disability insurance, savings plan, Company paid holidays and paid time off (PTO) for vacation and/or personal business. The application period for the job is estimated to be 20 days from the job posting date. However, this timeline may be shortened or extended depending on business needs and the availability of qualified candidates. Northrop Grumman is an Equal Opportunity Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO and pay transparency statement, please visit U.S. Citizenship is required for all positions with a government clearance and certain other restricted positions.
11/13/2026
Full time
RELOCATION ASSISTANCE: Relocation assistance may be available CLEARANCE REQUIRED FOR START: Yes CLEARANCE TYPE: Secret TRAVEL: Yes, 10% of the Time Description At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work - and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, they're making history. The AMS E&S organization at Northrop Grumman Missions Systems in Baltimore, Maryland is seeking experienced digital and RF subsystem integration and test engineers and technical leads in the following areas: Digital receiver/exciter and related digital-RF subsystem integration, subsystem control design, and architecture. Work is performed without appreciable direction and exercising considerable latitude in determining technical objectives of assignments. Candidates would have the ability to develop technical solutions to complex problems which require the regular use of ingenuity and creativity. The qualified candidates will work with a diverse and talented team of engineers developing innovative and cost-effective systems that support a broad range of products and business areas across the lifecycle of a program. Applicants should possess the ability to communicate effectively and clearly present technical approaches and findings. Responsibilities may include: Integration of digital receiver/exciter hardware and representative lab test environments Integration of new equipment and programs in a state-of-the-art facility Software development for automating test processes and data analysis Troubleshooting digital and RF issues during test of advanced antenna systems and system-on-chip designs Analyzing test data and identifying early trends Supporting program meetings in developing root cause and corrective actions Collaborating with design engineering for hardware, controls, and test improvements Subsystem analysis including digital architecture, signal paths, and hardware interfaces from RF front end through digital processing Support for performance testing, requirements verification, and more. In addition, this candidate should have demonstrated technical ability/leadership and expertise in one or more of the following areas: Digital-RF subsystem integration, test, and system integration System-on-chip FPGA and/or front-end software design Highly integrated digital-RF subsystems, antenna hardware, and receiver/exciter hardware for active electronically scanned array (AESA) systems Development and verification of complex front-end and subsystem controls across systems Electronic warfare, radar, or related mission-system principles and their system applications Subsystem requirements (hardware and digital) derivation, flow-down, and configuration Comfort creating test support applications and tools using MATLAB or similar technical computing tools Conducting Test Readiness Reviews and/or Design Readiness Reviews Concept of operations development for integration and test activities Executing subsystem and system level testing - both in engineering development and manufacturing environments This role is contingent upon candidates having a current, active government Secret Clearance. This role is contingent upon Program Award. This is a Dual-level opening, candidates will be considered at both a level 3 (Principal Engineer) or 4 (Sr. Principal Engineer) based upon the Basic Qualifications listed below. Basic Qualification - Principal Digital-RF Subsystems Integration & Test: Must hold a Secret or Top-Secret security clearance Must have a Bachelors Degree in Engineering or related discipline with 5 years of experience in the areas described in the job description or Master's Degree with 3 years of experience or PhD with 0 years of experience. An additional 4 years' experience is acceptable in lieu of degree. Experience using MATLAB or similar engineering analysis tools Experience with digital and/or RF subsystem integration and test Experience with setup and testing of hardware in a lab or benchtop environment Basic Qualification Sr. Principal Digital-RF Subsystems Integration & Test: Must hold a Secret or Top-Secret security clearance Must have a Bachelors Degree in Engineering or related discipline with 8 years of experience in the areas described in the job description or a Masters Degree with 6 years of experience or PhD with 4 years of experience. An additional 4 years' experience is acceptable in lieu of a degree. Strong experience using MATLAB or similar engineering analysis tools Experience with digital and/or RF subsystem integration and test Experience with setup and testing of hardware in a lab or benchtop environment Ability to delegate, task, and provide technical oversight for junior engineers Preferred Qualifications: TS/SCI clearance SAP clearance Strong knowledge of: Setting up lab, system integration, and digital-RF hardware test environments Control architectures and control design/integration for hardware with firmware, embedded software, and ASICs Knowledge of: RF and antenna theory, including RF performance analysis Python VHDL/Verilog C++ Test development experience for lab test environments and subsystem hardware Experience troubleshooting digital-RF subsystems Understanding of digital signal processing chains Experience working with and supporting engineers across firmware, software, power, and RF test teams Primary Level Salary Range: $119,600.00 - $179,400.00 Secondary Level Salary Range: $149,300.00 - $223,900.00 The above salary range represents a general guideline; however, Northrop Grumman considers a number of factors when determining base salary offers such as the scope and responsibilities of the position and the candidate's experience, education, skills and current market conditions. Depending on the position, employees may be eligible for overtime, shift differential, and a discretionary bonus in addition to base pay. Annual bonuses are designed to reward individual contributions as well as allow employees to share in company results. Employees in Vice President or Director positions may be eligible for Long Term Incentives. In addition, Northrop Grumman provides a variety of benefits including health insurance coverage, life and disability insurance, savings plan, Company paid holidays and paid time off (PTO) for vacation and/or personal business. The application period for the job is estimated to be 20 days from the job posting date. However, this timeline may be shortened or extended depending on business needs and the availability of qualified candidates. Northrop Grumman is an Equal Opportunity Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO and pay transparency statement, please visit U.S. Citizenship is required for all positions with a government clearance and certain other restricted positions.
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our team is at the forefront of developing next-generation memory and AI computing platforms. We are core contributors to the design, validation, and mass production of advanced systems using emerging memory technologies, ASICs, FPGAs, high-speed digital interfaces, mixed-signal and analog circuitry, and complex power delivery architectures! We are seeking a highly experienced Mechanical & Thermal Engineer to provide technical leadership and drive the mechanical and thermal architecture of ground breaking hardware platforms. This role offers the opportunity to influence product strategy, lead critical engineering decisions, and collaborate across global multidisciplinary teams to enable world-class computing solutions. The ideal candidate brings deep expertise in thermal, mechanical, and heat mitigation solutions for memory product. They demonstrate strong analytical and problem-solving skills. They have a proven record of delivering products from concept through high-volume manufacturing! Performs design and development engineering assignments related to hardware products and systems including development of new products or updates to existing products. Work may encompass one or more areas of engineering including electronic design, mechanical design, or other related fields. Duties may include research, evaluation, development, and application of new processes and methods into products. May be responsible for establishing and conducting testing routines, developing or implementing project plans, budgets, and schedules, and documentation of work and results. Responsibilities Design, develop, test, validate, and release mechanical and thermal solutions for advanced electronic systems, modules, and emerging memory technologies. Develop innovative cooling solutions, including heat spreaders, heatsinks, vapor chambers, heat pipes, and liquid cooling technologies. Define mechanical, thermal, reliability, and manufacturability requirements to meet product performance, quality, and customer objectives. Perform and lead thermal CFD and mechanical FEA analyses to optimize product performance, reliability, cost, and design efficiency. Develop and implement validation strategies, including thermal characterization, shock and vibration testing, thermal cycling, humidity testing, DFMEA, derating analysis, and reliability assessments. Drive design reviews, risk assessments, root cause investigations, and corrective actions throughout the product lifecycle. Collaborate with electrical, package, PCB, system, manufacturing, and reliability teams to deliver optimized and manufacturable solutions while contributing to JEDEC and industry standards development. Mentor engineers, establish engineering guidelines, serve as the mechanical and thermal domain expert across multiple programs, and champion AI-enabled engineering workflows to enhance simulation, design optimization, validation, and productivity. Education & Experience Requirements Bachelor's or Master's degree or equivalent experience in Mechanical Engineering with 7+ years of mechanical and thermal engineering experience, including 7+ years in the electronics, storage, or semiconductor industry. Proven track record of architecting, developing, and delivering mechanical and thermal solutions for product development and customer applications. Strong expertise in SolidWorks, thermal modeling, and CFD simulation tools such as ANSYS Icepak, Fluent, or similar platforms, including AI-enabled design and validation workflows. Hands-on experience with thermal management technologies, including heatsinks, thermal interface materials, vapor chambers, heat pipes, and liquid cooling solutions, as well as thermal and mechanical testing, validation, and failure analysis. Deep understanding of mechanical design principles, heat transfer, fluid dynamics, GD&T, tolerance analysis, DFM/DFA, product qualification methodologies, and demonstrated technical leadership across multi-functional teams. Preferred Qualifications Experience with DDR, LPDDR, PCIe, HBM, memory modules, storage subsystems, and AI accelerator platforms. Solid understanding of JEDEC standards and data center/server hardware architectures. Expertise in advanced thermal and cooling technologies for AI and high-performance computing (HPC) environments. Familiarity with finite element analysis (FEA), mechanical reliability modeling, and product performance optimization. Proven ability to collaborate with global suppliers and manufacturing partners, demonstrated by a history of innovation through patents, publications, or significant technical contributions. As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on . Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws. To learn about your right to work click here. To learn more about Micron, please visit For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron's People Organization at or 1- (select option ) Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards. Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron. AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification. Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.
11/12/2026
Full time
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our team is at the forefront of developing next-generation memory and AI computing platforms. We are core contributors to the design, validation, and mass production of advanced systems using emerging memory technologies, ASICs, FPGAs, high-speed digital interfaces, mixed-signal and analog circuitry, and complex power delivery architectures! We are seeking a highly experienced Mechanical & Thermal Engineer to provide technical leadership and drive the mechanical and thermal architecture of ground breaking hardware platforms. This role offers the opportunity to influence product strategy, lead critical engineering decisions, and collaborate across global multidisciplinary teams to enable world-class computing solutions. The ideal candidate brings deep expertise in thermal, mechanical, and heat mitigation solutions for memory product. They demonstrate strong analytical and problem-solving skills. They have a proven record of delivering products from concept through high-volume manufacturing! Performs design and development engineering assignments related to hardware products and systems including development of new products or updates to existing products. Work may encompass one or more areas of engineering including electronic design, mechanical design, or other related fields. Duties may include research, evaluation, development, and application of new processes and methods into products. May be responsible for establishing and conducting testing routines, developing or implementing project plans, budgets, and schedules, and documentation of work and results. Responsibilities Design, develop, test, validate, and release mechanical and thermal solutions for advanced electronic systems, modules, and emerging memory technologies. Develop innovative cooling solutions, including heat spreaders, heatsinks, vapor chambers, heat pipes, and liquid cooling technologies. Define mechanical, thermal, reliability, and manufacturability requirements to meet product performance, quality, and customer objectives. Perform and lead thermal CFD and mechanical FEA analyses to optimize product performance, reliability, cost, and design efficiency. Develop and implement validation strategies, including thermal characterization, shock and vibration testing, thermal cycling, humidity testing, DFMEA, derating analysis, and reliability assessments. Drive design reviews, risk assessments, root cause investigations, and corrective actions throughout the product lifecycle. Collaborate with electrical, package, PCB, system, manufacturing, and reliability teams to deliver optimized and manufacturable solutions while contributing to JEDEC and industry standards development. Mentor engineers, establish engineering guidelines, serve as the mechanical and thermal domain expert across multiple programs, and champion AI-enabled engineering workflows to enhance simulation, design optimization, validation, and productivity. Education & Experience Requirements Bachelor's or Master's degree or equivalent experience in Mechanical Engineering with 7+ years of mechanical and thermal engineering experience, including 7+ years in the electronics, storage, or semiconductor industry. Proven track record of architecting, developing, and delivering mechanical and thermal solutions for product development and customer applications. Strong expertise in SolidWorks, thermal modeling, and CFD simulation tools such as ANSYS Icepak, Fluent, or similar platforms, including AI-enabled design and validation workflows. Hands-on experience with thermal management technologies, including heatsinks, thermal interface materials, vapor chambers, heat pipes, and liquid cooling solutions, as well as thermal and mechanical testing, validation, and failure analysis. Deep understanding of mechanical design principles, heat transfer, fluid dynamics, GD&T, tolerance analysis, DFM/DFA, product qualification methodologies, and demonstrated technical leadership across multi-functional teams. Preferred Qualifications Experience with DDR, LPDDR, PCIe, HBM, memory modules, storage subsystems, and AI accelerator platforms. Solid understanding of JEDEC standards and data center/server hardware architectures. Expertise in advanced thermal and cooling technologies for AI and high-performance computing (HPC) environments. Familiarity with finite element analysis (FEA), mechanical reliability modeling, and product performance optimization. Proven ability to collaborate with global suppliers and manufacturing partners, demonstrated by a history of innovation through patents, publications, or significant technical contributions. As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on . Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws. To learn about your right to work click here. To learn more about Micron, please visit For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron's People Organization at or 1- (select option ) Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards. Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron. AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification. Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.
