17 jobs found

Job Description The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms. Within APTM, the Assembly Technology Development (ATD) team pioneers innovative package assembly solutions and scales them for high-volume manufacturing. As a Packaging Module Development Engineer, you will: • Contribute to the advancement of technology and foundry capabilities by developing First Level Interconnect (FLI) to support Intel's future packaging platforms. • Collaborate with multifunctional, cross organizational teams to optimize assembly processes for quality, reliability, cost, yield, productivity, and manufacturability. • Drive innovation in next generation equipment, materials, and fabrication processes to scale advanced semiconductor packaging capabilities • Lead equipment development activities, including pathfinding, new equipment definition, selection, technology development, and transition to high volume manufacturing. • Manage projects to ensure alignment with product development schedules and execution milestones. • Apply sound engineering principles, formal education, and professional judgment to resolve complex technical challenges. • Provide sustaining engineering support to maintain equipment performance and process health in high volume manufacturing environments • Respond effectively and with urgency to foundry customer requests, escalations, and manufacturing events The ideal candidate should demonstrate: • Technical leadership, strategic planning, and critical thinking. • Ability to coach and develop technical teams. • Tolerance for ambiguity and adaptability in a dynamic environment. • Flexibility in managing changing priorities and responsibilities. • Experience leading teams in a highly matrixed organization. • Initiative and ability to work independently. • Strong communication, influencing, technical, and analytical skills. This position requires regular onsite presence. Qualifications You must possess the minimum education requirements and minimum required qualifications to be initially considered for this position. Relevant experience can be obtained through schoolwork, classes, project work, internships, and/or military experience. Additional preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Minimum Qualifications: • Master's degree in Mechanical Engineering, Materials Science, Electrical Engineering, Physics/Applied Physics, or a related field with 3+ years of experience or PhD in Mechanical Engineering, Materials Science, Electrical Engineering, Physics/Applied Physics, or a related field. • Experience listed above should be a combination of the following: Programming/script (e.g., Python, MATLAB) development with artificial intelligence and machine learning concepts. Preferred Qualifications: One or more years of experience in one or more of the following areas: • Technology development, including familiarity with Statistical Process Control (SPC) and/or Design of Experiments (DOE) • Delivery of results for complex, time-critical technical projects. • Semiconductor fabrication processes and technologies. • Prior related work experience within a semiconductor foundry. Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. Annual Salary Range for jobs which could be performed in the US $127,400.00-$179,900.00 Salary range dependent on a number of factors including location and experience Working Model This role will require an on-site presence. Job posting details (such as work model, location or time type) are subject to change.

Job Description The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms. Within APTM, the Assembly Technology Development (ATD) team pioneers innovative package assembly solutions and scales them for high-volume manufacturing. As a Packaging Module Development Engineer, you will: • Contribute to the advancement of technology and foundry capabilities by developing First Level Interconnect (FLI) to support Intel's future packaging platforms. • Collaborate with multifunctional, cross organizational teams to optimize assembly processes for quality, reliability, cost, yield, productivity, and manufacturability. • Drive innovation in next generation equipment, materials, and fabrication processes to scale advanced semiconductor packaging capabilities • Lead equipment development activities, including pathfinding, new equipment definition, selection, technology development, and transition to high volume manufacturing. • Manage projects to ensure alignment with product development schedules and execution milestones. • Apply sound engineering principles, formal education, and professional judgment to resolve complex technical challenges. • Provide sustaining engineering support to maintain equipment performance and process health in high volume manufacturing environments • Respond effectively and with urgency to foundry customer requests, escalations, and manufacturing events The ideal candidate should demonstrate: • Technical leadership, strategic planning, and critical thinking. • Ability to coach and develop technical teams. • Tolerance for ambiguity and adaptability in a dynamic environment. • Flexibility in managing changing priorities and responsibilities. • Experience leading teams in a highly matrixed organization. • Initiative and ability to work independently. • Strong communication, influencing, technical, and analytical skills. This position requires regular onsite presence. Qualifications You must possess the minimum education requirements and minimum required qualifications to be initially considered for this position. Relevant experience can be obtained through schoolwork, classes, project work, internships, and/or military experience. Additional preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Minimum Qualifications: • Master's degree in Mechanical Engineering, Materials Science, Electrical Engineering, Physics/Applied Physics, or a related field with 3+ years of experience or PhD in Mechanical Engineering, Materials Science, Electrical Engineering, Physics/Applied Physics, or a related field. • Experience listed above should be a combination of the following: Programming/script (e.g., Python, MATLAB) development with artificial intelligence and machine learning concepts. Preferred Qualifications: One or more years of experience in one or more of the following areas: • Technology development, including familiarity with Statistical Process Control (SPC) and/or Design of Experiments (DOE) • Delivery of results for complex, time-critical technical projects. • Semiconductor fabrication processes and technologies. • Prior related work experience within a semiconductor foundry. Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. Annual Salary Range for jobs which could be performed in the US $127,400.00-$179,900.00 Salary range dependent on a number of factors including location and experience Working Model This role will require an on-site presence. Job posting details (such as work model, location or time type) are subject to change.

Job Description The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms. Within APTM, the Assembly Technology Development (ATD) team pioneers innovative package assembly solutions and scales them for high-volume manufacturing. As a Packaging Module Development Engineer, you will: • Contribute to the advancement of technology and foundry capabilities by developing First Level Interconnect (FLI) to support Intel's future packaging platforms. • Collaborate with multifunctional, cross organizational teams to optimize assembly processes for quality, reliability, cost, yield, productivity, and manufacturability. • Drive innovation in next generation equipment, materials, and fabrication processes to scale advanced semiconductor packaging capabilities • Lead equipment development activities, including pathfinding, new equipment definition, selection, technology development, and transition to high volume manufacturing. • Manage projects to ensure alignment with product development schedules and execution milestones. • Apply sound engineering principles, formal education, and professional judgment to resolve complex technical challenges. • Provide sustaining engineering support to maintain equipment performance and process health in high volume manufacturing environments • Respond effectively and with urgency to foundry customer requests, escalations, and manufacturing events The ideal candidate should demonstrate: • Technical leadership, strategic planning, and critical thinking. • Ability to coach and develop technical teams. • Tolerance for ambiguity and adaptability in a dynamic environment. • Flexibility in managing changing priorities and responsibilities. • Experience leading teams in a highly matrixed organization. • Initiative and ability to work independently. • Strong communication, influencing, technical, and analytical skills. This position requires regular onsite presence. Qualifications You must possess the minimum education requirements and minimum required qualifications to be initially considered for this position. Relevant experience can be obtained through schoolwork, classes, project work, internships, and/or military experience. Additional preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Minimum Qualifications: • Master's degree in Mechanical Engineering, Materials Science, Electrical Engineering, Physics/Applied Physics, or a related field with 3+ years of experience or PhD in Mechanical Engineering, Materials Science, Electrical Engineering, Physics/Applied Physics, or a related field. • Experience listed above should be a combination of the following: Programming/script (e.g., Python, MATLAB) development with artificial intelligence and machine learning concepts. Preferred Qualifications: One or more years of experience in one or more of the following areas: • Technology development, including familiarity with Statistical Process Control (SPC) and/or Design of Experiments (DOE) • Delivery of results for complex, time-critical technical projects. • Semiconductor fabrication processes and technologies. • Prior related work experience within a semiconductor foundry. Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. Annual Salary Range for jobs which could be performed in the US $127,400.00-$179,900.00 Salary range dependent on a number of factors including location and experience Working Model This role will require an on-site presence. Job posting details (such as work model, location or time type) are subject to change.

Job Description Shift 5: (Day s hift c ompressed w ork w eek) 6 A M-6 P M ( Sun day - Tues day and alternating Wednesday s ). Shift 7: (Day shift compressed work week) 6 A M-6 P M (Thursday- Satur day and alternating Wednesdays ). About the Role Join Intel's Foundry Technology Manufacturing business unit and play a key role in shaping the future of semiconductor packaging. As a Module Engineer , you will develop and optimize assembly processes and equipment, applying innovative concepts to enable Intel's next-generation foundry packaging platform technologies. You will work at the intersection of engineering, manufacturing, and technology development to deliver world-class packaging solutions for our foundry customers. What You Will Do Design and develop assembly processes and equipment, applying novel engineering concepts to advance Intel's foundry packaging roadmap and platform technologies. Optimize manufacturing efficiency for foundry packages, developing processes that meet rigorous quality, reliability, cost, yield, productivity, and manufacturability requirements specific to foundry customer needs. Define process and equipment specifications using Design of Experiments (DOE) and data analysis principles, documenting innovations and improvements through technical white papers. Develop and maintain equipment used to evaluate silicon and package technologies under simulated field conditions, including thermal cycling, heat, humidity, and dynamic mechanical stress testing. Ensure physical package designs are manufacturable within foundry process flows, and oversee the full cycle of package manufacturing processes, procedures, and production flows. Establish material specifications for contract assemblers and raw material vendors, partnering closely with supplier quality and procurement teams to enforce process compliance and vendor performance standards. Create new reliability screening techniques, acceleration methods, and quality tools to enable early detection of potential packaging quality and reliability risks within the foundry manufacturing environment. Define reliability requirements aligned to foundry customer needs, and influence design decisions, material selection , and process development based on a fundamental understanding of failure mechanisms. Lead continuous improvement initiatives using statistical methods and experimental design to innovate, troubleshoot, and enhance equipment and process performance. Serve as a technical resource for foundry packaging challenges, responding to customer and partner requests and providing consultation on process improvements. Drive standardization across product qualification frameworks, manufacturing quality systems, and methodologies, while actively engaging with packaging technology development and partner engineering teams to assess process maturity and mitigate risks to key product milestones. Qualifications The Minimum qualifications are required to be initially considered for this position . Minimum qualifications listed below would be obtained through a combination of industry relevant job experience, internship experience and / or schoolwork/classes/research. The preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Minimum Qualifications US Citizenship required . Bachelor's degree with 1+ years of experience in one of the following fields: Mechanical Engineering, Materials Science Engineering, Chemical Engineering, Electrical Engineering, or in a STEM related field of study . -OR - Master's degree in Mechanical Engineering, Materials Science Engineering, Chemical Engineering, Electrical Engineering, or in a STEM related field of study . - OR - Associate degree in Mechanical Engineering, Materials Science Engineering, Chemical Engineering, Electrical Engineering, or in a STEM related field of study with 12 + years of experience in an engineering role. 6+ months of experience with Statistical Process Control (SPC) and/or Design of Experiments (DOE) principles. Preferred Qualifications Prior experience working in a technology or semiconductor manufacturing environment. Experience in semiconductor packaging processes, including assembly, materials, or reliability engineering within a foundry context. Why Intel Foundry Technology Manufacturing? Intel's Foundry Technology Manufacturing business unit is at the forefront of delivering advanced packaging solutions for a broad ecosystem of customers. You will collaborate with world-class engineers, contribute to cutting-edge technology development, and directly impact the quality and performance of products that power the global technology industry. This is your opportunity to grow your career while helping define the future of foundry manufacturing. Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. Annual Salary Range for jobs which could be performed in the US $94,300.00-$133,200.00 Salary range dependent on a number of factors including location and experience Working Model This role will require an on-site presence. Job posting details (such as work model, location or time type) are subject to change.

Job Description Drives technology development and enablement for both high volume manufacturing and future technology, provides process integration and equipment solutions, and performs feasibility studies to meet desired device specifications Leads design and development of technically sophisticated manufacturing processes and/or repair reverse engineering including material selection, parameter optimization, equipment metrology, and system design to enable new product designs and functional requirements Performs pathfinding activities in support of process and hardware development enabling manufacturing of innovative device architectures, and develops roadmaps for technologies enabling future roadmap Recommends and implements modifications for operating equipment to improve production efficiency, manufacturing techniques, and optimizing production output for existing products Partners with key equipment and materials suppliers to develop and implement enabling elements of the technology Performs process technology feasibility studies through theoretical simulations and/or practical engineering methods Remains updated on relevant industrial process and material manufacturing technical trends and develops view of inherent future Intel process technology needs to push industry forward by partnering with vendor ecosystem to build cost sensitive roadmap Qualifications Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research. Minimum Qualifications: PhD in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field with 4+ years of relevant experience OR Master's degree in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field with 6+ years of relevant experience OR Bachelor's degree in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field with 9+ years of relevant experience Relevant recent experience includes, but is not limited to: Hands-on experience in dry etch semiconductor manufacturing, including ownership of complex process development and optimization in a foundry or high volume manufacturing environment Strong command of plasma etch fundamentals, including plasma generation, plasma-surface interactions, selectivity, profile control, and defect mechanisms Demonstrated record of delivering dry etch process solutions that improved yield, reliability, performance, or manufacturability for advanced technology nodes Proven ability to lead technical problem solving across projects or sub modules, influencing peers and stakeholders without formal people management responsibility Expertise in statistical analysis and DOE methodologies, using tools such as JMP, Python, or MATLAB to drive data based decisions Experience working with and troubleshooting advanced semiconductor manufacturing equipment in a cleanroom environment Preferred Qualifications: 5+ years of direct experience developing and deploying dry etch processes for advanced logic or foundry technologies, including technology node transitions or major process changes Experience with advanced dry etch technologies such as: ICP / CCP plasma etch o High aspect ratio etch (HARC) o Atomic Layer Etch (ALE) o Radical and Vapor phase isotropic etching o Ash and surface treatments o EUV patterned layer etch integration Demonstrated impact on cross module or integration level challenges, such as pattern fidelity, CD control, defectivity, variability reduction, or process window expansion Strong understanding of advanced device architectures (e.g., FinFET, GAA, nanosheet) and their etch integration requirements Experience with materials and device characterization techniques, including SEM, TEM, CD SEM, AFM, XPS, or electrical correlation Ability to define technical approaches, de risk options, and guide less senior engineers through complex problem solving Track record of effective collaboration with integration, lithography, device, yield, and equipment partner teams to deliver robust manufacturing solutions Evidence of broader technical influence, such as internal technology disclosures, patents, publications, or recognized subject matter expertise within the organization For information on Intel's immigration sponsorship guidelines, please see Intel U.S. Immigration Sponsorship Information Other Locations US, AZ, Phoenix; US, CA, Santa Clara Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. Annual Salary Range for jobs which could be performed in the US $172,200.00-$243,000.00 Salary range dependent on a number of factors including location and experience Working Model This role will require an on-site presence. Job posting details (such as work model, location or time type) are subject to change.

Job Description Drives technology development and enablement for both high volume manufacturing and future technology, provides process integration and equipment solutions, and performs feasibility studies to meet desired device specifications Leads design and development of technically sophisticated manufacturing processes and/or repair reverse engineering including material selection, parameter optimization, equipment metrology, and system design to enable new product designs and functional requirements Performs pathfinding activities in support of process and hardware development enabling manufacturing of innovative device architectures, and develops roadmaps for technologies enabling future roadmap Recommends and implements modifications for operating equipment to improve production efficiency, manufacturing techniques, and optimizing production output for existing products Partners with key equipment and materials suppliers to develop and implement enabling elements of the technology Performs process technology feasibility studies through theoretical simulations and/or practical engineering methods Remains updated on relevant industrial process and material manufacturing technical trends and develops view of inherent future Intel process technology needs to push industry forward by partnering with vendor ecosystem to build cost sensitive roadmap Qualifications Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research. Minimum Qualifications: PhD in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field with 4+ years of relevant experience OR Master's degree in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field with 6+ years of relevant experience OR Bachelor's degree in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field with 9+ years of relevant experience Relevant recent experience includes, but is not limited to: Hands-on experience in dry etch semiconductor manufacturing, including ownership of complex process development and optimization in a foundry or high volume manufacturing environment Strong command of plasma etch fundamentals, including plasma generation, plasma-surface interactions, selectivity, profile control, and defect mechanisms Demonstrated record of delivering dry etch process solutions that improved yield, reliability, performance, or manufacturability for advanced technology nodes Proven ability to lead technical problem solving across projects or sub modules, influencing peers and stakeholders without formal people management responsibility Expertise in statistical analysis and DOE methodologies, using tools such as JMP, Python, or MATLAB to drive data based decisions Experience working with and troubleshooting advanced semiconductor manufacturing equipment in a cleanroom environment Preferred Qualifications: 5+ years of direct experience developing and deploying dry etch processes for advanced logic or foundry technologies, including technology node transitions or major process changes Experience with advanced dry etch technologies such as: ICP / CCP plasma etch o High aspect ratio etch (HARC) o Atomic Layer Etch (ALE) o Radical and Vapor phase isotropic etching o Ash and surface treatments o EUV patterned layer etch integration Demonstrated impact on cross module or integration level challenges, such as pattern fidelity, CD control, defectivity, variability reduction, or process window expansion Strong understanding of advanced device architectures (e.g., FinFET, GAA, nanosheet) and their etch integration requirements Experience with materials and device characterization techniques, including SEM, TEM, CD SEM, AFM, XPS, or electrical correlation Ability to define technical approaches, de risk options, and guide less senior engineers through complex problem solving Track record of effective collaboration with integration, lithography, device, yield, and equipment partner teams to deliver robust manufacturing solutions Evidence of broader technical influence, such as internal technology disclosures, patents, publications, or recognized subject matter expertise within the organization For information on Intel's immigration sponsorship guidelines, please see Intel U.S. Immigration Sponsorship Information Other Locations US, AZ, Phoenix; US, CA, Santa Clara Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. Annual Salary Range for jobs which could be performed in the US $172,200.00-$243,000.00 Salary range dependent on a number of factors including location and experience Working Model This role will require an on-site presence. Job posting details (such as work model, location or time type) are subject to change.

Job Description Drives technology development and enablement for both high volume manufacturing and future technology, provides process integration and equipment solutions, and performs feasibility studies to meet desired device specifications Leads design and development of technically sophisticated manufacturing processes and/or repair reverse engineering including material selection, parameter optimization, equipment metrology, and system design to enable new product designs and functional requirements Performs pathfinding activities in support of process and hardware development enabling manufacturing of innovative device architectures, and develops roadmaps for technologies enabling future roadmap Recommends and implements modifications for operating equipment to improve production efficiency, manufacturing techniques, and optimizing production output for existing products Partners with key equipment and materials suppliers to develop and implement enabling elements of the technology Performs process technology feasibility studies through theoretical simulations and/or practical engineering methods Remains updated on relevant industrial process and material manufacturing technical trends and develops view of inherent future Intel process technology needs to push industry forward by partnering with vendor ecosystem to build cost sensitive roadmap Qualifications Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research. Minimum Qualifications: PhD in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field with 4+ years of relevant experience OR Master's degree in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field with 6+ years of relevant experience OR Bachelor's degree in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field with 9+ years of relevant experience Relevant recent experience includes, but is not limited to: Hands-on experience in dry etch semiconductor manufacturing, including ownership of complex process development and optimization in a foundry or high volume manufacturing environment Strong command of plasma etch fundamentals, including plasma generation, plasma-surface interactions, selectivity, profile control, and defect mechanisms Demonstrated record of delivering dry etch process solutions that improved yield, reliability, performance, or manufacturability for advanced technology nodes Proven ability to lead technical problem solving across projects or sub modules, influencing peers and stakeholders without formal people management responsibility Expertise in statistical analysis and DOE methodologies, using tools such as JMP, Python, or MATLAB to drive data based decisions Experience working with and troubleshooting advanced semiconductor manufacturing equipment in a cleanroom environment Preferred Qualifications: 5+ years of direct experience developing and deploying dry etch processes for advanced logic or foundry technologies, including technology node transitions or major process changes Experience with advanced dry etch technologies such as: ICP / CCP plasma etch o High aspect ratio etch (HARC) o Atomic Layer Etch (ALE) o Radical and Vapor phase isotropic etching o Ash and surface treatments o EUV patterned layer etch integration Demonstrated impact on cross module or integration level challenges, such as pattern fidelity, CD control, defectivity, variability reduction, or process window expansion Strong understanding of advanced device architectures (e.g., FinFET, GAA, nanosheet) and their etch integration requirements Experience with materials and device characterization techniques, including SEM, TEM, CD SEM, AFM, XPS, or electrical correlation Ability to define technical approaches, de risk options, and guide less senior engineers through complex problem solving Track record of effective collaboration with integration, lithography, device, yield, and equipment partner teams to deliver robust manufacturing solutions Evidence of broader technical influence, such as internal technology disclosures, patents, publications, or recognized subject matter expertise within the organization For information on Intel's immigration sponsorship guidelines, please see Intel U.S. Immigration Sponsorship Information Other Locations US, AZ, Phoenix; US, CA, Santa Clara Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. Annual Salary Range for jobs which could be performed in the US $172,200.00-$243,000.00 Salary range dependent on a number of factors including location and experience Working Model This role will require an on-site presence. Job posting details (such as work model, location or time type) are subject to change.

Job Description Note: This role requires regular onsite presence to fulfill essential job responsibilities. Drives technology development and enablement for both high volume manufacturing and future technology, provides process integration and equipment solutions, and performs feasibility studies to meet desired device specifications. Leads design and development of technically sophisticated manufacturing processes and/or repair reverse engineering including material selection, parameter optimization, equipment metrology, and system design to enable new product designs and functional requirements. Performs pathfinding activities in support of process and hardware development enabling manufacturing of innovative device architectures and develops roadmaps for technologies enabling future roadmap. Recommends and implements modifications for operating equipment to improve production efficiency, manufacturing techniques, and optimizing production output for existing products. Partners with key equipment and materials suppliers to develop and implement enabling elements of the technology. Performs process technology feasibility studies through theoretical simulations and/or practical engineering methods. Remains updated on relevant industrial process and material manufacturing technical trends and develops view of inherent future Intel process technology needs to push industry forward by partnering with vendor ecosystem to build cost sensitive roadmap. Required Skills and Experience Proven track record of technical ownership and delivery of dry etch process innovations that enabled high volume manufacturing, yield improvement, reliability, or technology node transitions. Expert level understanding of plasma physics, plasma-surface interactions, pattern fidelity, selectivity, defectivity, and profile control for advanced device structures. Demonstrated ability to define long term technical direction and translate research concepts into manufacturable solutions at scale. Extensive experience with advanced data analytics, statistical modeling, and design of experiments (DOE) applied to complex semiconductor process problems. Recognized technical authority who influences decisions across modules, organizations, or technology programs without formal management authority. Preferred Skills and Experience Sustained leadership in developing and deploying next generation dry etch solutions for advanced logic or foundry technologies (e.g., FinFET, GAA, nanosheet architectures). Deep experience with advanced etch technologies, such as: High aspect ratio plasma etch (HARC); Atomic Layer Etch (ALE), EUV patterned layer etch integration; Radical and Vapor phase isotropic etching; Ash and surface treatments; Novel patterning or materials specific etch solutions Demonstrated history of breaking technical bottlenecks that materially impacted product ramp success, cost, or yield across multiple process nodes or product generations. Expertise in advanced materials and device characterization, including SEM, TEM, CD SEM, AFM, XPS, and electrical correlation. Strong publication, patent, or internal technology disclosure record that evidences field level or industry recognized contributions. Ability to mentor senior engineers, set technical standards, and elevate organizational capability across the dry etch discipline. Proven effectiveness in influencing cross functional and external stakeholders, including integration, device, yield, and equipment suppliers, to align on long term technical strategies. Experience shaping multiyear roadmaps for process platforms, tooling strategies, or foundational etch capabilities. Qualifications PhD with 10+ years of directly relevant experience, or Master's degree with 15+ years of experience, in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field. Deep, authoritative expertise in dry etch semiconductor manufacturing, with demonstrated leadership over complex process development or platform level solutions. Experience working in dry etch in a foundry Other Locations US, TX, Austin; US, AZ, Phoenix; US, CA, Folsom; US, CA, Santa Clara Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. Annual Salary Range for jobs which could be performed in the US $201,330.00-$284,230.00 Salary range dependent on a number of factors including location and experience Working Model This role will require an on-site presence. Job posting details (such as work model, location or time type) are subject to change.Position of TrustThis role is a Position of Trust. Should you accept this position, you must consent to and pass an extended Background Investigation, which includes (subject to country law), extended education, SEC sanctions, and additional criminal and civil checks. For internals, this investigation may or may not be completed prior to starting the position. For additional questions, please contact your Recruiter.

Job Description Intel is shaping the future of technology to help create a better future for the entire world. Our work in pushing forward fields like AI, analytics, and cloud-to-edge technology is at the heart of countless innovations. With a career at Intel, you'll have the opportunity to use technology to power major breakthroughs and create enhancements that improve our everyday quality of life. We're looking to hire a highly motivated mechanical engineer to join Advanced Packaging Mechanical Analysis team located in Chandler AZ. This role is focused on developing Multiphysics thermo-mechanical simulations to support design, definition, development and qualifications of advanced semiconductor packaging led by Intel Foundry. This position offers the opportunity to work at the forefront of semiconductor packaging innovation, collaborating with engineers and researchers across multiple business groups such as design, technology integration, reliability, yield and manufacturing. This role requires regular onsite presence to fulfill essential job responsibilities. Key Responsibilities. Develop and validate finite element analysis (FEA) models to simulate thermal and mechanical behavior of advanced semiconductor packages. Perform simulations to evaluate stress, strain, warpage, delamination, thermal cycling, and reliability risks across a wide range of package architectures. Collaborate with cross-functional teams to define simulation requirements, interpret results, and provide actionable design and process recommendations. Design and coordinate lab tests and research on basic materials and properties to understand material behavior and reliability failure mechanisms. The ideal candidate will have to drive strategic development activities and work closely with internal and external customer organizations to plan, execute and communicate development activities and programs. The team leverages both experimental and numerical methods across a broad range of areas, including thermal, mechanical, and fluids. The team typically uses a combination of simulations and experiments, as needed, to help solve practical engineering problems. The team frequently leverages advanced analysis methods (statistical, AI/ML) to supplement modeling and experimental approaches. The ideal candidate should exhibit the following skills or behavioral traits: Demonstrated ability to work seamlessly between experiments and simulations. Qualifications You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research. Minimum Qualifications: PhD Degree in Mechanical Engineering, Chemical Engineering or Material Sciences or a related field with emphasis in solid mechanics. 3+ years of Thermal-mechanical work/research experience with emphasis on silicon reliability 3+ years of experience with Finite Element Analysis tools 3+ years of experience with experimental material characterization metrologies such as DMA/TMA and nano-indentation. Preferred Qualifications: Experience with multi-physics simulations, including coupled electro-thermal-mechanical analysis, free surface two phase flows, electroplating and plasma. Experience with co-packaging optics, optical coupling, fiber pigtail attachment, free space optics. Experience with designing, planning and executing experiments, along with interpretation of results. Experience with scripting and automation (e.g., Python, TCL, MATLAB) to streamline simulation workflows. Knowledge in advanced packaging technologies, familiarity with semiconductor packaging processes, including die attach, underfill, molding, bumping, surface mount and reflow. Programming/script development with artificial intelligence and machine learning concepts. Previous related work experience in a semiconductor foundry preferred. Join us at Intel and be part of a team that values innovation, collaboration, and making a meaningful impact. Apply today to embark on a rewarding career journey with us! Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. Annual Salary Range for jobs which could be performed in the US $148,100.00-$209,100.00 Salary range dependent on a number of factors including location and experience Working Model This role will require an on-site presence. Job posting details (such as work model, location or time type) are subject to change.

Job Description Note: This role requires regular onsite presence to fulfill essential job responsibilities. Drives technology development and enablement for both high volume manufacturing and future technology, provides process integration and equipment solutions, and performs feasibility studies to meet desired device specifications. Leads design and development of technically sophisticated manufacturing processes and/or repair reverse engineering including material selection, parameter optimization, equipment metrology, and system design to enable new product designs and functional requirements. Performs pathfinding activities in support of process and hardware development enabling manufacturing of innovative device architectures and develops roadmaps for technologies enabling future roadmap. Recommends and implements modifications for operating equipment to improve production efficiency, manufacturing techniques, and optimizing production output for existing products. Partners with key equipment and materials suppliers to develop and implement enabling elements of the technology. Performs process technology feasibility studies through theoretical simulations and/or practical engineering methods. Remains updated on relevant industrial process and material manufacturing technical trends and develops view of inherent future Intel process technology needs to push industry forward by partnering with vendor ecosystem to build cost sensitive roadmap. Required Skills and Experience Proven track record of technical ownership and delivery of dry etch process innovations that enabled high volume manufacturing, yield improvement, reliability, or technology node transitions. Expert level understanding of plasma physics, plasma-surface interactions, pattern fidelity, selectivity, defectivity, and profile control for advanced device structures. Demonstrated ability to define long term technical direction and translate research concepts into manufacturable solutions at scale. Extensive experience with advanced data analytics, statistical modeling, and design of experiments (DOE) applied to complex semiconductor process problems. Recognized technical authority who influences decisions across modules, organizations, or technology programs without formal management authority. Preferred Skills and Experience Sustained leadership in developing and deploying next generation dry etch solutions for advanced logic or foundry technologies (e.g., FinFET, GAA, nanosheet architectures). Deep experience with advanced etch technologies, such as: High aspect ratio plasma etch (HARC); Atomic Layer Etch (ALE), EUV patterned layer etch integration; Radical and Vapor phase isotropic etching; Ash and surface treatments; Novel patterning or materials specific etch solutions Demonstrated history of breaking technical bottlenecks that materially impacted product ramp success, cost, or yield across multiple process nodes or product generations. Expertise in advanced materials and device characterization, including SEM, TEM, CD SEM, AFM, XPS, and electrical correlation. Strong publication, patent, or internal technology disclosure record that evidences field level or industry recognized contributions. Ability to mentor senior engineers, set technical standards, and elevate organizational capability across the dry etch discipline. Proven effectiveness in influencing cross functional and external stakeholders, including integration, device, yield, and equipment suppliers, to align on long term technical strategies. Experience shaping multiyear roadmaps for process platforms, tooling strategies, or foundational etch capabilities. Qualifications PhD with 10+ years of directly relevant experience, or Master's degree with 15+ years of experience, in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field. Deep, authoritative expertise in dry etch semiconductor manufacturing, with demonstrated leadership over complex process development or platform level solutions. Experience working in dry etch in a foundry Other Locations US, TX, Austin; US, AZ, Phoenix; US, CA, Folsom; US, CA, Santa Clara Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. Annual Salary Range for jobs which could be performed in the US $201,330.00-$284,230.00 Salary range dependent on a number of factors including location and experience Working Model This role will require an on-site presence. Job posting details (such as work model, location or time type) are subject to change.Position of TrustThis role is a Position of Trust. Should you accept this position, you must consent to and pass an extended Background Investigation, which includes (subject to country law), extended education, SEC sanctions, and additional criminal and civil checks. For internals, this investigation may or may not be completed prior to starting the position. For additional questions, please contact your Recruiter.

Job Description Drives technology development and enablement for both high volume manufacturing and future technology, provides process integration and equipment solutions, and performs feasibility studies to meet desired device specifications Leads design and development of technically sophisticated manufacturing processes and/or repair reverse engineering including material selection, parameter optimization, equipment metrology, and system design to enable new product designs and functional requirements Performs pathfinding activities in support of process and hardware development enabling manufacturing of innovative device architectures, and develops roadmaps for technologies enabling future roadmap Recommends and implements modifications for operating equipment to improve production efficiency, manufacturing techniques, and optimizing production output for existing products Partners with key equipment and materials suppliers to develop and implement enabling elements of the technology Performs process technology feasibility studies through theoretical simulations and/or practical engineering methods Remains updated on relevant industrial process and material manufacturing technical trends and develops view of inherent future Intel process technology needs to push industry forward by partnering with vendor ecosystem to build cost sensitive roadmap Qualifications Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research. Minimum Qualifications: PhD in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field with 4+ years of relevant experience OR Master's degree in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field with 6+ years of relevant experience OR Bachelor's degree in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field with 9+ years of relevant experience Relevant recent experience includes, but is not limited to: Hands-on experience in dry etch semiconductor manufacturing, including ownership of complex process development and optimization in a foundry or high volume manufacturing environment Strong command of plasma etch fundamentals, including plasma generation, plasma-surface interactions, selectivity, profile control, and defect mechanisms Demonstrated record of delivering dry etch process solutions that improved yield, reliability, performance, or manufacturability for advanced technology nodes Proven ability to lead technical problem solving across projects or sub modules, influencing peers and stakeholders without formal people management responsibility Expertise in statistical analysis and DOE methodologies, using tools such as JMP, Python, or MATLAB to drive data based decisions Experience working with and troubleshooting advanced semiconductor manufacturing equipment in a cleanroom environment Preferred Qualifications: 5+ years of direct experience developing and deploying dry etch processes for advanced logic or foundry technologies, including technology node transitions or major process changes Experience with advanced dry etch technologies such as: ICP / CCP plasma etch o High aspect ratio etch (HARC) o Atomic Layer Etch (ALE) o Radical and Vapor phase isotropic etching o Ash and surface treatments o EUV patterned layer etch integration Demonstrated impact on cross module or integration level challenges, such as pattern fidelity, CD control, defectivity, variability reduction, or process window expansion Strong understanding of advanced device architectures (e.g., FinFET, GAA, nanosheet) and their etch integration requirements Experience with materials and device characterization techniques, including SEM, TEM, CD SEM, AFM, XPS, or electrical correlation Ability to define technical approaches, de risk options, and guide less senior engineers through complex problem solving Track record of effective collaboration with integration, lithography, device, yield, and equipment partner teams to deliver robust manufacturing solutions Evidence of broader technical influence, such as internal technology disclosures, patents, publications, or recognized subject matter expertise within the organization For information on Intel's immigration sponsorship guidelines, please see Intel U.S. Immigration Sponsorship Information Other Locations US, AZ, Phoenix; US, CA, Santa Clara Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. Annual Salary Range for jobs which could be performed in the US $172,200.00-$243,000.00 Salary range dependent on a number of factors including location and experience Working Model This role will require an on-site presence. Job posting details (such as work model, location or time type) are subject to change.

Job Description Note: This role requires regular onsite presence to fulfill essential job responsibilities. Drives technology development and enablement for both high volume manufacturing and future technology, provides process integration and equipment solutions, and performs feasibility studies to meet desired device specifications. Leads design and development of technically sophisticated manufacturing processes and/or repair reverse engineering including material selection, parameter optimization, equipment metrology, and system design to enable new product designs and functional requirements. Performs pathfinding activities in support of process and hardware development enabling manufacturing of innovative device architectures and develops roadmaps for technologies enabling future roadmap. Recommends and implements modifications for operating equipment to improve production efficiency, manufacturing techniques, and optimizing production output for existing products. Partners with key equipment and materials suppliers to develop and implement enabling elements of the technology. Performs process technology feasibility studies through theoretical simulations and/or practical engineering methods. Remains updated on relevant industrial process and material manufacturing technical trends and develops view of inherent future Intel process technology needs to push industry forward by partnering with vendor ecosystem to build cost sensitive roadmap. Required Skills and Experience Proven track record of technical ownership and delivery of dry etch process innovations that enabled high volume manufacturing, yield improvement, reliability, or technology node transitions. Expert level understanding of plasma physics, plasma-surface interactions, pattern fidelity, selectivity, defectivity, and profile control for advanced device structures. Demonstrated ability to define long term technical direction and translate research concepts into manufacturable solutions at scale. Extensive experience with advanced data analytics, statistical modeling, and design of experiments (DOE) applied to complex semiconductor process problems. Recognized technical authority who influences decisions across modules, organizations, or technology programs without formal management authority. Preferred Skills and Experience Sustained leadership in developing and deploying next generation dry etch solutions for advanced logic or foundry technologies (e.g., FinFET, GAA, nanosheet architectures). Deep experience with advanced etch technologies, such as: High aspect ratio plasma etch (HARC); Atomic Layer Etch (ALE), EUV patterned layer etch integration; Radical and Vapor phase isotropic etching; Ash and surface treatments; Novel patterning or materials specific etch solutions Demonstrated history of breaking technical bottlenecks that materially impacted product ramp success, cost, or yield across multiple process nodes or product generations. Expertise in advanced materials and device characterization, including SEM, TEM, CD SEM, AFM, XPS, and electrical correlation. Strong publication, patent, or internal technology disclosure record that evidences field level or industry recognized contributions. Ability to mentor senior engineers, set technical standards, and elevate organizational capability across the dry etch discipline. Proven effectiveness in influencing cross functional and external stakeholders, including integration, device, yield, and equipment suppliers, to align on long term technical strategies. Experience shaping multiyear roadmaps for process platforms, tooling strategies, or foundational etch capabilities. Qualifications PhD with 10+ years of directly relevant experience, or Master's degree with 15+ years of experience, in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field. Deep, authoritative expertise in dry etch semiconductor manufacturing, with demonstrated leadership over complex process development or platform level solutions. Experience working in dry etch in a foundry Other Locations US, TX, Austin; US, AZ, Phoenix; US, CA, Folsom; US, CA, Santa Clara Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. Annual Salary Range for jobs which could be performed in the US $201,330.00-$284,230.00 Salary range dependent on a number of factors including location and experience Working Model This role will require an on-site presence. Job posting details (such as work model, location or time type) are subject to change.Position of TrustThis role is a Position of Trust. Should you accept this position, you must consent to and pass an extended Background Investigation, which includes (subject to country law), extended education, SEC sanctions, and additional criminal and civil checks. For internals, this investigation may or may not be completed prior to starting the position. For additional questions, please contact your Recruiter.

Job Description Note: This role requires regular onsite presence to fulfill essential job responsibilities. Drives technology development and enablement for both high volume manufacturing and future technology, provides process integration and equipment solutions, and performs feasibility studies to meet desired device specifications. Leads design and development of technically sophisticated manufacturing processes and/or repair reverse engineering including material selection, parameter optimization, equipment metrology, and system design to enable new product designs and functional requirements. Performs pathfinding activities in support of process and hardware development enabling manufacturing of innovative device architectures and develops roadmaps for technologies enabling future roadmap. Recommends and implements modifications for operating equipment to improve production efficiency, manufacturing techniques, and optimizing production output for existing products. Partners with key equipment and materials suppliers to develop and implement enabling elements of the technology. Performs process technology feasibility studies through theoretical simulations and/or practical engineering methods. Remains updated on relevant industrial process and material manufacturing technical trends and develops view of inherent future Intel process technology needs to push industry forward by partnering with vendor ecosystem to build cost sensitive roadmap. Required Skills and Experience Proven track record of technical ownership and delivery of dry etch process innovations that enabled high volume manufacturing, yield improvement, reliability, or technology node transitions. Expert level understanding of plasma physics, plasma-surface interactions, pattern fidelity, selectivity, defectivity, and profile control for advanced device structures. Demonstrated ability to define long term technical direction and translate research concepts into manufacturable solutions at scale. Extensive experience with advanced data analytics, statistical modeling, and design of experiments (DOE) applied to complex semiconductor process problems. Recognized technical authority who influences decisions across modules, organizations, or technology programs without formal management authority. Preferred Skills and Experience Sustained leadership in developing and deploying next generation dry etch solutions for advanced logic or foundry technologies (e.g., FinFET, GAA, nanosheet architectures). Deep experience with advanced etch technologies, such as: High aspect ratio plasma etch (HARC); Atomic Layer Etch (ALE), EUV patterned layer etch integration; Radical and Vapor phase isotropic etching; Ash and surface treatments; Novel patterning or materials specific etch solutions Demonstrated history of breaking technical bottlenecks that materially impacted product ramp success, cost, or yield across multiple process nodes or product generations. Expertise in advanced materials and device characterization, including SEM, TEM, CD SEM, AFM, XPS, and electrical correlation. Strong publication, patent, or internal technology disclosure record that evidences field level or industry recognized contributions. Ability to mentor senior engineers, set technical standards, and elevate organizational capability across the dry etch discipline. Proven effectiveness in influencing cross functional and external stakeholders, including integration, device, yield, and equipment suppliers, to align on long term technical strategies. Experience shaping multiyear roadmaps for process platforms, tooling strategies, or foundational etch capabilities. Qualifications PhD with 10+ years of directly relevant experience, or Master's degree with 15+ years of experience, in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field. Deep, authoritative expertise in dry etch semiconductor manufacturing, with demonstrated leadership over complex process development or platform level solutions. Experience working in dry etch in a foundry Other Locations US, TX, Austin; US, AZ, Phoenix; US, CA, Folsom; US, CA, Santa Clara Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. Annual Salary Range for jobs which could be performed in the US $201,330.00-$284,230.00 Salary range dependent on a number of factors including location and experience Working Model This role will require an on-site presence. Job posting details (such as work model, location or time type) are subject to change.Position of TrustThis role is a Position of Trust. Should you accept this position, you must consent to and pass an extended Background Investigation, which includes (subject to country law), extended education, SEC sanctions, and additional criminal and civil checks. For internals, this investigation may or may not be completed prior to starting the position. For additional questions, please contact your Recruiter.

Job Description Drives technology development and enablement for both high volume manufacturing and future technology, provides process integration and equipment solutions, and performs feasibility studies to meet desired device specifications Leads design and development of technically sophisticated manufacturing processes and/or repair reverse engineering including material selection, parameter optimization, equipment metrology, and system design to enable new product designs and functional requirements Performs pathfinding activities in support of process and hardware development enabling manufacturing of innovative device architectures, and develops roadmaps for technologies enabling future roadmap Recommends and implements modifications for operating equipment to improve production efficiency, manufacturing techniques, and optimizing production output for existing products Partners with key equipment and materials suppliers to develop and implement enabling elements of the technology Performs process technology feasibility studies through theoretical simulations and/or practical engineering methods Remains updated on relevant industrial process and material manufacturing technical trends and develops view of inherent future Intel process technology needs to push industry forward by partnering with vendor ecosystem to build cost sensitive roadmap Qualifications Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research. Minimum Qualifications: PhD in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field with 4+ years of relevant experience OR Master's degree in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field with 6+ years of relevant experience OR Bachelor's degree in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field with 9+ years of relevant experience Relevant recent experience includes, but is not limited to: Hands-on experience in dry etch semiconductor manufacturing, including ownership of complex process development and optimization in a foundry or high volume manufacturing environment Strong command of plasma etch fundamentals, including plasma generation, plasma-surface interactions, selectivity, profile control, and defect mechanisms Demonstrated record of delivering dry etch process solutions that improved yield, reliability, performance, or manufacturability for advanced technology nodes Proven ability to lead technical problem solving across projects or sub modules, influencing peers and stakeholders without formal people management responsibility Expertise in statistical analysis and DOE methodologies, using tools such as JMP, Python, or MATLAB to drive data based decisions Experience working with and troubleshooting advanced semiconductor manufacturing equipment in a cleanroom environment Preferred Qualifications: 5+ years of direct experience developing and deploying dry etch processes for advanced logic or foundry technologies, including technology node transitions or major process changes Experience with advanced dry etch technologies such as: ICP / CCP plasma etch o High aspect ratio etch (HARC) o Atomic Layer Etch (ALE) o Radical and Vapor phase isotropic etching o Ash and surface treatments o EUV patterned layer etch integration Demonstrated impact on cross module or integration level challenges, such as pattern fidelity, CD control, defectivity, variability reduction, or process window expansion Strong understanding of advanced device architectures (e.g., FinFET, GAA, nanosheet) and their etch integration requirements Experience with materials and device characterization techniques, including SEM, TEM, CD SEM, AFM, XPS, or electrical correlation Ability to define technical approaches, de risk options, and guide less senior engineers through complex problem solving Track record of effective collaboration with integration, lithography, device, yield, and equipment partner teams to deliver robust manufacturing solutions Evidence of broader technical influence, such as internal technology disclosures, patents, publications, or recognized subject matter expertise within the organization For information on Intel's immigration sponsorship guidelines, please see Intel U.S. Immigration Sponsorship Information Other Locations US, AZ, Phoenix; US, CA, Santa Clara Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. Annual Salary Range for jobs which could be performed in the US $172,200.00-$243,000.00 Salary range dependent on a number of factors including location and experience Working Model This role will require an on-site presence. Job posting details (such as work model, location or time type) are subject to change.

Job Description Note: This role requires regular onsite presence to fulfill essential job responsibilities. Drives technology development and enablement for both high volume manufacturing and future technology, provides process integration and equipment solutions, and performs feasibility studies to meet desired device specifications. Leads design and development of technically sophisticated manufacturing processes and/or repair reverse engineering including material selection, parameter optimization, equipment metrology, and system design to enable new product designs and functional requirements. Performs pathfinding activities in support of process and hardware development enabling manufacturing of innovative device architectures and develops roadmaps for technologies enabling future roadmap. Recommends and implements modifications for operating equipment to improve production efficiency, manufacturing techniques, and optimizing production output for existing products. Partners with key equipment and materials suppliers to develop and implement enabling elements of the technology. Performs process technology feasibility studies through theoretical simulations and/or practical engineering methods. Remains updated on relevant industrial process and material manufacturing technical trends and develops view of inherent future Intel process technology needs to push industry forward by partnering with vendor ecosystem to build cost sensitive roadmap. Required Skills and Experience Proven track record of technical ownership and delivery of dry etch process innovations that enabled high volume manufacturing, yield improvement, reliability, or technology node transitions. Expert level understanding of plasma physics, plasma-surface interactions, pattern fidelity, selectivity, defectivity, and profile control for advanced device structures. Demonstrated ability to define long term technical direction and translate research concepts into manufacturable solutions at scale. Extensive experience with advanced data analytics, statistical modeling, and design of experiments (DOE) applied to complex semiconductor process problems. Recognized technical authority who influences decisions across modules, organizations, or technology programs without formal management authority. Preferred Skills and Experience Sustained leadership in developing and deploying next generation dry etch solutions for advanced logic or foundry technologies (e.g., FinFET, GAA, nanosheet architectures). Deep experience with advanced etch technologies, such as: High aspect ratio plasma etch (HARC); Atomic Layer Etch (ALE), EUV patterned layer etch integration; Radical and Vapor phase isotropic etching; Ash and surface treatments; Novel patterning or materials specific etch solutions Demonstrated history of breaking technical bottlenecks that materially impacted product ramp success, cost, or yield across multiple process nodes or product generations. Expertise in advanced materials and device characterization, including SEM, TEM, CD SEM, AFM, XPS, and electrical correlation. Strong publication, patent, or internal technology disclosure record that evidences field level or industry recognized contributions. Ability to mentor senior engineers, set technical standards, and elevate organizational capability across the dry etch discipline. Proven effectiveness in influencing cross functional and external stakeholders, including integration, device, yield, and equipment suppliers, to align on long term technical strategies. Experience shaping multiyear roadmaps for process platforms, tooling strategies, or foundational etch capabilities. Qualifications PhD with 10+ years of directly relevant experience, or Master's degree with 15+ years of experience, in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field. Deep, authoritative expertise in dry etch semiconductor manufacturing, with demonstrated leadership over complex process development or platform level solutions. Experience working in dry etch in a foundry Other Locations US, TX, Austin; US, AZ, Phoenix; US, CA, Folsom; US, CA, Santa Clara Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. Annual Salary Range for jobs which could be performed in the US $201,330.00-$284,230.00 Salary range dependent on a number of factors including location and experience Working Model This role will require an on-site presence. Job posting details (such as work model, location or time type) are subject to change.Position of TrustThis role is a Position of Trust. Should you accept this position, you must consent to and pass an extended Background Investigation, which includes (subject to country law), extended education, SEC sanctions, and additional criminal and civil checks. For internals, this investigation may or may not be completed prior to starting the position. For additional questions, please contact your Recruiter.

Job Description Note: This role requires regular onsite presence to fulfill essential job responsibilities. Drives technology development and enablement for both high volume manufacturing and future technology, provides process integration and equipment solutions, and performs feasibility studies to meet desired device specifications. Leads design and development of technically sophisticated manufacturing processes and/or repair reverse engineering including material selection, parameter optimization, equipment metrology, and system design to enable new product designs and functional requirements. Performs pathfinding activities in support of process and hardware development enabling manufacturing of innovative device architectures and develops roadmaps for technologies enabling future roadmap. Recommends and implements modifications for operating equipment to improve production efficiency, manufacturing techniques, and optimizing production output for existing products. Partners with key equipment and materials suppliers to develop and implement enabling elements of the technology. Performs process technology feasibility studies through theoretical simulations and/or practical engineering methods. Remains updated on relevant industrial process and material manufacturing technical trends and develops view of inherent future Intel process technology needs to push industry forward by partnering with vendor ecosystem to build cost sensitive roadmap. Required Skills and Experience Proven track record of technical ownership and delivery of dry etch process innovations that enabled high volume manufacturing, yield improvement, reliability, or technology node transitions. Expert level understanding of plasma physics, plasma-surface interactions, pattern fidelity, selectivity, defectivity, and profile control for advanced device structures. Demonstrated ability to define long term technical direction and translate research concepts into manufacturable solutions at scale. Extensive experience with advanced data analytics, statistical modeling, and design of experiments (DOE) applied to complex semiconductor process problems. Recognized technical authority who influences decisions across modules, organizations, or technology programs without formal management authority. Preferred Skills and Experience Sustained leadership in developing and deploying next generation dry etch solutions for advanced logic or foundry technologies (e.g., FinFET, GAA, nanosheet architectures). Deep experience with advanced etch technologies, such as: High aspect ratio plasma etch (HARC); Atomic Layer Etch (ALE), EUV patterned layer etch integration; Radical and Vapor phase isotropic etching; Ash and surface treatments; Novel patterning or materials specific etch solutions Demonstrated history of breaking technical bottlenecks that materially impacted product ramp success, cost, or yield across multiple process nodes or product generations. Expertise in advanced materials and device characterization, including SEM, TEM, CD SEM, AFM, XPS, and electrical correlation. Strong publication, patent, or internal technology disclosure record that evidences field level or industry recognized contributions. Ability to mentor senior engineers, set technical standards, and elevate organizational capability across the dry etch discipline. Proven effectiveness in influencing cross functional and external stakeholders, including integration, device, yield, and equipment suppliers, to align on long term technical strategies. Experience shaping multiyear roadmaps for process platforms, tooling strategies, or foundational etch capabilities. Qualifications PhD with 10+ years of directly relevant experience, or Master's degree with 15+ years of experience, in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field. Deep, authoritative expertise in dry etch semiconductor manufacturing, with demonstrated leadership over complex process development or platform level solutions. Experience working in dry etch in a foundry Other Locations US, TX, Austin; US, AZ, Phoenix; US, CA, Folsom; US, CA, Santa Clara Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. Annual Salary Range for jobs which could be performed in the US $201,330.00-$284,230.00 Salary range dependent on a number of factors including location and experience Working Model This role will require an on-site presence. Job posting details (such as work model, location or time type) are subject to change.Position of TrustThis role is a Position of Trust. Should you accept this position, you must consent to and pass an extended Background Investigation, which includes (subject to country law), extended education, SEC sanctions, and additional criminal and civil checks. For internals, this investigation may or may not be completed prior to starting the position. For additional questions, please contact your Recruiter.

Job Description Note: This role requires regular onsite presence to fulfill essential job responsibilities. Drives technology development and enablement for both high volume manufacturing and future technology, provides process integration and equipment solutions, and performs feasibility studies to meet desired device specifications. Leads design and development of technically sophisticated manufacturing processes and/or repair reverse engineering including material selection, parameter optimization, equipment metrology, and system design to enable new product designs and functional requirements. Performs pathfinding activities in support of process and hardware development enabling manufacturing of innovative device architectures and develops roadmaps for technologies enabling future roadmap. Recommends and implements modifications for operating equipment to improve production efficiency, manufacturing techniques, and optimizing production output for existing products. Partners with key equipment and materials suppliers to develop and implement enabling elements of the technology. Performs process technology feasibility studies through theoretical simulations and/or practical engineering methods. Remains updated on relevant industrial process and material manufacturing technical trends and develops view of inherent future Intel process technology needs to push industry forward by partnering with vendor ecosystem to build cost sensitive roadmap. Required Skills and Experience Proven track record of technical ownership and delivery of dry etch process innovations that enabled high volume manufacturing, yield improvement, reliability, or technology node transitions. Expert level understanding of plasma physics, plasma-surface interactions, pattern fidelity, selectivity, defectivity, and profile control for advanced device structures. Demonstrated ability to define long term technical direction and translate research concepts into manufacturable solutions at scale. Extensive experience with advanced data analytics, statistical modeling, and design of experiments (DOE) applied to complex semiconductor process problems. Recognized technical authority who influences decisions across modules, organizations, or technology programs without formal management authority. Preferred Skills and Experience Sustained leadership in developing and deploying next generation dry etch solutions for advanced logic or foundry technologies (e.g., FinFET, GAA, nanosheet architectures). Deep experience with advanced etch technologies, such as: High aspect ratio plasma etch (HARC); Atomic Layer Etch (ALE), EUV patterned layer etch integration; Radical and Vapor phase isotropic etching; Ash and surface treatments; Novel patterning or materials specific etch solutions Demonstrated history of breaking technical bottlenecks that materially impacted product ramp success, cost, or yield across multiple process nodes or product generations. Expertise in advanced materials and device characterization, including SEM, TEM, CD SEM, AFM, XPS, and electrical correlation. Strong publication, patent, or internal technology disclosure record that evidences field level or industry recognized contributions. Ability to mentor senior engineers, set technical standards, and elevate organizational capability across the dry etch discipline. Proven effectiveness in influencing cross functional and external stakeholders, including integration, device, yield, and equipment suppliers, to align on long term technical strategies. Experience shaping multiyear roadmaps for process platforms, tooling strategies, or foundational etch capabilities. Qualifications PhD with 10+ years of directly relevant experience, or Master's degree with 15+ years of experience, in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field. Deep, authoritative expertise in dry etch semiconductor manufacturing, with demonstrated leadership over complex process development or platform level solutions. Experience working in dry etch in a foundry Other Locations US, TX, Austin; US, AZ, Phoenix; US, CA, Folsom; US, CA, Santa Clara Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. Annual Salary Range for jobs which could be performed in the US $201,330.00-$284,230.00 Salary range dependent on a number of factors including location and experience Working Model This role will require an on-site presence. Job posting details (such as work model, location or time type) are subject to change.Position of TrustThis role is a Position of Trust. Should you accept this position, you must consent to and pass an extended Background Investigation, which includes (subject to country law), extended education, SEC sanctions, and additional criminal and civil checks. For internals, this investigation may or may not be completed prior to starting the position. For additional questions, please contact your Recruiter.