Intel

Job Description Drives technology development and enablement for both high volume manufacturing and future technology, provides process integration and equipment solutions, and performs feasibility studies to meet desired device specifications Leads design and development of technically sophisticated manufacturing processes and/or repair reverse engineering including material selection, parameter optimization, equipment metrology, and system design to enable new product designs and functional requirements Performs pathfinding activities in support of process and hardware development enabling manufacturing of innovative device architectures, and develops roadmaps for technologies enabling future roadmap Recommends and implements modifications for operating equipment to improve production efficiency, manufacturing techniques, and optimizing production output for existing products Partners with key equipment and materials suppliers to develop and implement enabling elements of the technology Performs process technology feasibility studies through theoretical simulations and/or practical engineering methods Remains updated on relevant industrial process and material manufacturing technical trends and develops view of inherent future Intel process technology needs to push industry forward by partnering with vendor ecosystem to build cost sensitive roadmap Qualifications Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research. Minimum Qualifications: PhD in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field with 4+ years of relevant experience OR Master's degree in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field with 6+ years of relevant experience OR Bachelor's degree in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field with 9+ years of relevant experience Relevant recent experience includes, but is not limited to: Hands-on experience in dry etch semiconductor manufacturing, including ownership of complex process development and optimization in a foundry or high volume manufacturing environment Strong command of plasma etch fundamentals, including plasma generation, plasma-surface interactions, selectivity, profile control, and defect mechanisms Demonstrated record of delivering dry etch process solutions that improved yield, reliability, performance, or manufacturability for advanced technology nodes Proven ability to lead technical problem solving across projects or sub modules, influencing peers and stakeholders without formal people management responsibility Expertise in statistical analysis and DOE methodologies, using tools such as JMP, Python, or MATLAB to drive data based decisions Experience working with and troubleshooting advanced semiconductor manufacturing equipment in a cleanroom environment Preferred Qualifications: 5+ years of direct experience developing and deploying dry etch processes for advanced logic or foundry technologies, including technology node transitions or major process changes Experience with advanced dry etch technologies such as: ICP / CCP plasma etch o High aspect ratio etch (HARC) o Atomic Layer Etch (ALE) o Radical and Vapor phase isotropic etching o Ash and surface treatments o EUV patterned layer etch integration Demonstrated impact on cross module or integration level challenges, such as pattern fidelity, CD control, defectivity, variability reduction, or process window expansion Strong understanding of advanced device architectures (e.g., FinFET, GAA, nanosheet) and their etch integration requirements Experience with materials and device characterization techniques, including SEM, TEM, CD SEM, AFM, XPS, or electrical correlation Ability to define technical approaches, de risk options, and guide less senior engineers through complex problem solving Track record of effective collaboration with integration, lithography, device, yield, and equipment partner teams to deliver robust manufacturing solutions Evidence of broader technical influence, such as internal technology disclosures, patents, publications, or recognized subject matter expertise within the organization For information on Intel's immigration sponsorship guidelines, please see Intel U.S. Immigration Sponsorship Information Other Locations US, AZ, Phoenix; US, CA, Santa Clara Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. Annual Salary Range for jobs which could be performed in the US $172,200.00-$243,000.00 Salary range dependent on a number of factors including location and experience Working Model This role will require an on-site presence. Job posting details (such as work model, location or time type) are subject to change.

Job Description The Role and Impact We are seeking a Senior Strategic Program Leader to drive the next generation of Yield and Defect Engineering transformation within a high-volume semiconductor manufacturing environment. This role goes beyond traditional engineering leadership serving as a catalyst for AI-driven innovation, enterprise scale program execution, and cross-functional alignment. You will lead a multidisciplinary organization responsible for advancing defect metrology, yield engineering systems, and AI-enabled decision intelligence, ensuring the factory operates with predictive, adaptive, and scalable capabilities. Your leadership will directly shape how data, automation, and artificial intelligence are embedded into daily operations to accelerate yield learning, improve cycle time, and increase productivity. As a key member of the technology and manufacturing leadership team, you will define long-term strategy, influence roadmaps across process integration and metrology, and drive execution of complex, high-impact programs that position the organization for future technology nodes and advanced packaging innovations. Key Responsibilities Strategic Leadership and Transformation: Define and execute a multi-year strategy for Yield and Defect Engineering, integrating AI/ML, automation, and digital transformation into core workflows. Lead enterprise-level programs to transition from reactive analysis to predictive and prescriptive yield management systems. Serve as a thought leader in AI adoption for semiconductor manufacturing, identifying high-value use cases and scaling solutions across sites. AI-Driven Productivity and Decision Intelligence: Champion the deployment of AI/Agentic AI solutions to enhance defect detection, classification, excursion prevention, and root cause analysis. Drive integration of data platforms, digital twins, and advanced analytics into yield and defect systems. Partner with data science, IT, and automation teams to embed real-time decision intelligence into fab operations. Operational Excellence and Yield Performance: Oversee yield performance across development and high-volume manufacturing, ensuring alignment to aggressive yield, quality, and delivery targets. Lead cross-functional efforts to resolve complex yield limiters and defect excursions, minimizing impact to supply. Institutionalize closed-loop learning systems that accelerate yield ramp and improve defect pareto convergence. Defect Metrology and Systems Leadership: Define and evolve defect metrology strategy, including tool selection, capability roadmaps, and system architecture. Lead development of scalable defect management systems that enable early detection, excursion containment, and predictive risk mitigation. Ensure alignment of inspection, review, classification, and analytics ecosystems with future technology requirements Program Execution and Stakeholder Influence: Drive large-scale, cross-site programs requiring alignment across process integration, manufacturing, equipment, and corporate strategy teams. Operate across multiple disciplines translating executive vision into clear roadmaps, measurable milestones, and disciplined execution. Influence senior stakeholders and executives to align investments, priorities, and organizational focus. Organization and Talent Leadership: Build and lead a high-performing, diverse organization, fostering a culture of innovation, accountability, and continuous learning. Develop next-generation leaders with capabilities spanning engineering depth, data science, and AI fluency. Champion a shift from individual based to scalable, system-driven excellence. Qualifications Minimum Qualifications • Bachelor's degree in Engineering, Physics, Materials Science, Data Science, or related field (advanced degree preferred). • 12+ years of experience in semiconductor manufacturing with deep expertise in yield engineering, defect metrology, or process integration. • Proven track record leading complex, cross-functional programs in high-volume manufacturing environments. • Demonstrated experience driving yield improvement and defect reduction at scale, including ramp and HVM phases. • Strong domain expertise in defect metrology tools, inspection systems, and yield analysis methodologies. • Experience integrating data analytics, machine learning, or AI solutions into engineering workflows. • Exceptional leadership and communication skills with ability to influence across organizational boundaries. Preferred Qualifications • Advanced degree (MS/PhD) in a relevant technical or data-centric discipline. • Experience leading AI/ML transformation initiatives in semiconductor or adjacent high-tech industries. • Familiarity with digital manufacturing ecosystems (data platforms, MES integration, advanced analytics tools). • Track record of defining and scaling enterprise-level engineering systems or platforms. • Strong business acumen with ability to connect technical outcomes to cost, cycle time, and revenue impact. • Experience in advanced packaging technologies (e.g., Foveros, EMIB, heterogeneous integration) is a plus. Join our team and be part of shaping the future of technology through your leadership and expertise. Apply today to make an impact. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research. Other Locations US, Phoenix Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. Annual Salary Range for jobs which could be performed in the US $252,840.00-$356,950.00 Salary range dependent on a number of factors including location and experience Working Model This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. Job posting details (such as work model, location or time type) are subject to change.Position of TrustThis role is a Position of Trust. Should you accept this position, you must consent to and pass an extended Background Investigation, which includes (subject to country law), extended education, SEC sanctions, and additional criminal and civil checks. For internals, this investigation may or may not be completed prior to starting the position. For additional questions, please contact your Recruiter.

Job Description Drives technology development and enablement for both high volume manufacturing and future technology, provides process integration and equipment solutions, and performs feasibility studies to meet desired device specifications Leads design and development of technically sophisticated manufacturing processes and/or repair reverse engineering including material selection, parameter optimization, equipment metrology, and system design to enable new product designs and functional requirements Performs pathfinding activities in support of process and hardware development enabling manufacturing of innovative device architectures, and develops roadmaps for technologies enabling future roadmap Recommends and implements modifications for operating equipment to improve production efficiency, manufacturing techniques, and optimizing production output for existing products Partners with key equipment and materials suppliers to develop and implement enabling elements of the technology Performs process technology feasibility studies through theoretical simulations and/or practical engineering methods Remains updated on relevant industrial process and material manufacturing technical trends and develops view of inherent future Intel process technology needs to push industry forward by partnering with vendor ecosystem to build cost sensitive roadmap Qualifications Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research. Minimum Qualifications: PhD in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field with 4+ years of relevant experience OR Master's degree in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field with 6+ years of relevant experience OR Bachelor's degree in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field with 9+ years of relevant experience Relevant recent experience includes, but is not limited to: Hands-on experience in dry etch semiconductor manufacturing, including ownership of complex process development and optimization in a foundry or high volume manufacturing environment Strong command of plasma etch fundamentals, including plasma generation, plasma-surface interactions, selectivity, profile control, and defect mechanisms Demonstrated record of delivering dry etch process solutions that improved yield, reliability, performance, or manufacturability for advanced technology nodes Proven ability to lead technical problem solving across projects or sub modules, influencing peers and stakeholders without formal people management responsibility Expertise in statistical analysis and DOE methodologies, using tools such as JMP, Python, or MATLAB to drive data based decisions Experience working with and troubleshooting advanced semiconductor manufacturing equipment in a cleanroom environment Preferred Qualifications: 5+ years of direct experience developing and deploying dry etch processes for advanced logic or foundry technologies, including technology node transitions or major process changes Experience with advanced dry etch technologies such as: ICP / CCP plasma etch o High aspect ratio etch (HARC) o Atomic Layer Etch (ALE) o Radical and Vapor phase isotropic etching o Ash and surface treatments o EUV patterned layer etch integration Demonstrated impact on cross module or integration level challenges, such as pattern fidelity, CD control, defectivity, variability reduction, or process window expansion Strong understanding of advanced device architectures (e.g., FinFET, GAA, nanosheet) and their etch integration requirements Experience with materials and device characterization techniques, including SEM, TEM, CD SEM, AFM, XPS, or electrical correlation Ability to define technical approaches, de risk options, and guide less senior engineers through complex problem solving Track record of effective collaboration with integration, lithography, device, yield, and equipment partner teams to deliver robust manufacturing solutions Evidence of broader technical influence, such as internal technology disclosures, patents, publications, or recognized subject matter expertise within the organization For information on Intel's immigration sponsorship guidelines, please see Intel U.S. Immigration Sponsorship Information Other Locations US, AZ, Phoenix; US, CA, Santa Clara Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. Annual Salary Range for jobs which could be performed in the US $172,200.00-$243,000.00 Salary range dependent on a number of factors including location and experience Working Model This role will require an on-site presence. Job posting details (such as work model, location or time type) are subject to change.

Job Description Drives technology development and enablement for both high volume manufacturing and future technology, provides process integration and equipment solutions, and performs feasibility studies to meet desired device specifications Leads design and development of technically sophisticated manufacturing processes and/or repair reverse engineering including material selection, parameter optimization, equipment metrology, and system design to enable new product designs and functional requirements Performs pathfinding activities in support of process and hardware development enabling manufacturing of innovative device architectures, and develops roadmaps for technologies enabling future roadmap Recommends and implements modifications for operating equipment to improve production efficiency, manufacturing techniques, and optimizing production output for existing products Partners with key equipment and materials suppliers to develop and implement enabling elements of the technology Performs process technology feasibility studies through theoretical simulations and/or practical engineering methods Remains updated on relevant industrial process and material manufacturing technical trends and develops view of inherent future Intel process technology needs to push industry forward by partnering with vendor ecosystem to build cost sensitive roadmap Qualifications Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research. Minimum Qualifications: PhD in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field with 4+ years of relevant experience OR Master's degree in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field with 6+ years of relevant experience OR Bachelor's degree in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field with 9+ years of relevant experience Relevant recent experience includes, but is not limited to: Hands-on experience in dry etch semiconductor manufacturing, including ownership of complex process development and optimization in a foundry or high volume manufacturing environment Strong command of plasma etch fundamentals, including plasma generation, plasma-surface interactions, selectivity, profile control, and defect mechanisms Demonstrated record of delivering dry etch process solutions that improved yield, reliability, performance, or manufacturability for advanced technology nodes Proven ability to lead technical problem solving across projects or sub modules, influencing peers and stakeholders without formal people management responsibility Expertise in statistical analysis and DOE methodologies, using tools such as JMP, Python, or MATLAB to drive data based decisions Experience working with and troubleshooting advanced semiconductor manufacturing equipment in a cleanroom environment Preferred Qualifications: 5+ years of direct experience developing and deploying dry etch processes for advanced logic or foundry technologies, including technology node transitions or major process changes Experience with advanced dry etch technologies such as: ICP / CCP plasma etch o High aspect ratio etch (HARC) o Atomic Layer Etch (ALE) o Radical and Vapor phase isotropic etching o Ash and surface treatments o EUV patterned layer etch integration Demonstrated impact on cross module or integration level challenges, such as pattern fidelity, CD control, defectivity, variability reduction, or process window expansion Strong understanding of advanced device architectures (e.g., FinFET, GAA, nanosheet) and their etch integration requirements Experience with materials and device characterization techniques, including SEM, TEM, CD SEM, AFM, XPS, or electrical correlation Ability to define technical approaches, de risk options, and guide less senior engineers through complex problem solving Track record of effective collaboration with integration, lithography, device, yield, and equipment partner teams to deliver robust manufacturing solutions Evidence of broader technical influence, such as internal technology disclosures, patents, publications, or recognized subject matter expertise within the organization For information on Intel's immigration sponsorship guidelines, please see Intel U.S. Immigration Sponsorship Information Other Locations US, AZ, Phoenix; US, CA, Santa Clara Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. Annual Salary Range for jobs which could be performed in the US $172,200.00-$243,000.00 Salary range dependent on a number of factors including location and experience Working Model This role will require an on-site presence. Job posting details (such as work model, location or time type) are subject to change.

Job Description The Role and Impact We are seeking a Senior Strategic Program Leader to drive the next generation of Yield and Defect Engineering transformation within a high-volume semiconductor manufacturing environment. This role goes beyond traditional engineering leadership serving as a catalyst for AI-driven innovation, enterprise scale program execution, and cross-functional alignment. You will lead a multidisciplinary organization responsible for advancing defect metrology, yield engineering systems, and AI-enabled decision intelligence, ensuring the factory operates with predictive, adaptive, and scalable capabilities. Your leadership will directly shape how data, automation, and artificial intelligence are embedded into daily operations to accelerate yield learning, improve cycle time, and increase productivity. As a key member of the technology and manufacturing leadership team, you will define long-term strategy, influence roadmaps across process integration and metrology, and drive execution of complex, high-impact programs that position the organization for future technology nodes and advanced packaging innovations. Key Responsibilities Strategic Leadership and Transformation: Define and execute a multi-year strategy for Yield and Defect Engineering, integrating AI/ML, automation, and digital transformation into core workflows. Lead enterprise-level programs to transition from reactive analysis to predictive and prescriptive yield management systems. Serve as a thought leader in AI adoption for semiconductor manufacturing, identifying high-value use cases and scaling solutions across sites. AI-Driven Productivity and Decision Intelligence: Champion the deployment of AI/Agentic AI solutions to enhance defect detection, classification, excursion prevention, and root cause analysis. Drive integration of data platforms, digital twins, and advanced analytics into yield and defect systems. Partner with data science, IT, and automation teams to embed real-time decision intelligence into fab operations. Operational Excellence and Yield Performance: Oversee yield performance across development and high-volume manufacturing, ensuring alignment to aggressive yield, quality, and delivery targets. Lead cross-functional efforts to resolve complex yield limiters and defect excursions, minimizing impact to supply. Institutionalize closed-loop learning systems that accelerate yield ramp and improve defect pareto convergence. Defect Metrology and Systems Leadership: Define and evolve defect metrology strategy, including tool selection, capability roadmaps, and system architecture. Lead development of scalable defect management systems that enable early detection, excursion containment, and predictive risk mitigation. Ensure alignment of inspection, review, classification, and analytics ecosystems with future technology requirements Program Execution and Stakeholder Influence: Drive large-scale, cross-site programs requiring alignment across process integration, manufacturing, equipment, and corporate strategy teams. Operate across multiple disciplines translating executive vision into clear roadmaps, measurable milestones, and disciplined execution. Influence senior stakeholders and executives to align investments, priorities, and organizational focus. Organization and Talent Leadership: Build and lead a high-performing, diverse organization, fostering a culture of innovation, accountability, and continuous learning. Develop next-generation leaders with capabilities spanning engineering depth, data science, and AI fluency. Champion a shift from individual based to scalable, system-driven excellence. Qualifications Minimum Qualifications • Bachelor's degree in Engineering, Physics, Materials Science, Data Science, or related field (advanced degree preferred). • 12+ years of experience in semiconductor manufacturing with deep expertise in yield engineering, defect metrology, or process integration. • Proven track record leading complex, cross-functional programs in high-volume manufacturing environments. • Demonstrated experience driving yield improvement and defect reduction at scale, including ramp and HVM phases. • Strong domain expertise in defect metrology tools, inspection systems, and yield analysis methodologies. • Experience integrating data analytics, machine learning, or AI solutions into engineering workflows. • Exceptional leadership and communication skills with ability to influence across organizational boundaries. Preferred Qualifications • Advanced degree (MS/PhD) in a relevant technical or data-centric discipline. • Experience leading AI/ML transformation initiatives in semiconductor or adjacent high-tech industries. • Familiarity with digital manufacturing ecosystems (data platforms, MES integration, advanced analytics tools). • Track record of defining and scaling enterprise-level engineering systems or platforms. • Strong business acumen with ability to connect technical outcomes to cost, cycle time, and revenue impact. • Experience in advanced packaging technologies (e.g., Foveros, EMIB, heterogeneous integration) is a plus. Join our team and be part of shaping the future of technology through your leadership and expertise. Apply today to make an impact. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research. Other Locations US, Phoenix Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. Annual Salary Range for jobs which could be performed in the US $252,840.00-$356,950.00 Salary range dependent on a number of factors including location and experience Working Model This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. Job posting details (such as work model, location or time type) are subject to change.Position of TrustThis role is a Position of Trust. Should you accept this position, you must consent to and pass an extended Background Investigation, which includes (subject to country law), extended education, SEC sanctions, and additional criminal and civil checks. For internals, this investigation may or may not be completed prior to starting the position. For additional questions, please contact your Recruiter.

Job Description This is a central requisition for all Ocotillo Technology Fabrication (OTF) functional areas. Successful candidates will be aligned to the areas that match best with factory needs. Join Intel and build a better tomorrow. Intel is in the midst of an exciting transformation, with a vision to create and extend computing technology to connect and enrich the lives of every person on Earth. Our high-volume manufacturing facility in Chandler, Arizona is looking for amazing talent. Join and help us create the next generation of technologies that will shape the future for decades to come. The Ocotillo Technology Fabrication (OTF) Module Engineer role is multifaceted. The ideal candidate will have a passion for instrumentation and equipment with the goal of developing a robust manufacturable process module. Responsibilities will include but are not limited to: Define roadmaps to meet requirements, goals and milestones for a new technology process. Defines and establishes flow, procedures, and equipment configuration for the module. Selects and develops material and equipment for the process to meet quality, yield, reliability, cost, productivity and manufacturability requirements. Plans and conducts experiments to fully characterize the process throughout the development cycle. Drives improvements on quality, yield, reliability, process stability, productivity and safety/ergonomic over variables such as material, method, equipment, environment and operating personnel. Develop solutions to problems utilizing formal education, statistical knowledge, and problem-solving tools. Establishes process control systems for the process module and sustains the module through volume ramp. Develops strategy to resolve difficult problems and establishes systems to deal with these problems in the future. Trains production/receiving process engineers for transfer to other factories. Transfers process to high volume manufacturing and provide support in new factory start-up as well as install and qualification of the new production lines. Position may require working on a day or night shift as an OSE (on-shift engineer) to support toolset needs. In addition to the qualifications a successful candidate will demonstrate: Working in a high performing team culture which includes setting high expectations. Driving accountability to those expectations with a high sense of urgency. Role modeling the desired culture. Possess teamwork and leadership skills. Problem solving and prioritization skills. Driving high performance maintenance goals for the group. Use data to influence factory and virtual factory direction. Listening, written and verbal communication. Deal with ambiguity in defining activities and direction. Commitment to tasks. Work across organizational boundaries including process engineering, integration and yield. What we offer: We give you opportunities to transform technology and create a better future, by delivering products that touch the lives of every person on earth. As a global leader in innovation and new technology, we foster a collaborative, supportive, and exciting environment where the brightest minds in the world come together to achieve exceptional results. We offer a competitive salary and financial benefits such as bonuses, life and disability insurance, and opportunities to buy Intel stock at a discounted rate. We provide benefits that promote a healthy, enjoyable life: excellent medical plans, wellness programs, and amenities, time off, recreational activities, discounts on various products and services, and much more creative perks that make Intel a Great Place to Work. We're constantly working on making a more connected and intelligent future, and we need your help. Change tomorrow. Start today. Qualifications You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research. Minimum Qualifications: - Bachelor's degree with 8+ years of experience OR Master's degree with 6+ years of experience, OR PhD degree with 2+ years of experience in Electrical Engineering, Chemistry, Chemical Engineering, Mechanical or related engineering STEM field. The experience mentioned above should be in the following: Semiconductor Engineering experience. Experience supporting high-volume manufacturing ramps and technology transfers. Preferred Qualifications: Experience working in a semiconductor factory as a technician or engineer prior to Engineering role. Statistics and experimental design; and the skills to apply that knowledge to tool matching, tool qualification, and process development. Technical and troubleshooting experience. Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. Annual Salary Range for jobs which could be performed in the US $135,000.00-$190,600.00 Salary range dependent on a number of factors including location and experience Working Model This role will require an on-site presence. Job posting details (such as work model, location or time type) are subject to change.

Job Description The Role and Impact We are seeking a Senior Strategic Program Leader to drive the next generation of Yield and Defect Engineering transformation within a high-volume semiconductor manufacturing environment. This role goes beyond traditional engineering leadership serving as a catalyst for AI-driven innovation, enterprise scale program execution, and cross-functional alignment. You will lead a multidisciplinary organization responsible for advancing defect metrology, yield engineering systems, and AI-enabled decision intelligence, ensuring the factory operates with predictive, adaptive, and scalable capabilities. Your leadership will directly shape how data, automation, and artificial intelligence are embedded into daily operations to accelerate yield learning, improve cycle time, and increase productivity. As a key member of the technology and manufacturing leadership team, you will define long-term strategy, influence roadmaps across process integration and metrology, and drive execution of complex, high-impact programs that position the organization for future technology nodes and advanced packaging innovations. Key Responsibilities Strategic Leadership and Transformation: Define and execute a multi-year strategy for Yield and Defect Engineering, integrating AI/ML, automation, and digital transformation into core workflows. Lead enterprise-level programs to transition from reactive analysis to predictive and prescriptive yield management systems. Serve as a thought leader in AI adoption for semiconductor manufacturing, identifying high-value use cases and scaling solutions across sites. AI-Driven Productivity and Decision Intelligence: Champion the deployment of AI/Agentic AI solutions to enhance defect detection, classification, excursion prevention, and root cause analysis. Drive integration of data platforms, digital twins, and advanced analytics into yield and defect systems. Partner with data science, IT, and automation teams to embed real-time decision intelligence into fab operations. Operational Excellence and Yield Performance: Oversee yield performance across development and high-volume manufacturing, ensuring alignment to aggressive yield, quality, and delivery targets. Lead cross-functional efforts to resolve complex yield limiters and defect excursions, minimizing impact to supply. Institutionalize closed-loop learning systems that accelerate yield ramp and improve defect pareto convergence. Defect Metrology and Systems Leadership: Define and evolve defect metrology strategy, including tool selection, capability roadmaps, and system architecture. Lead development of scalable defect management systems that enable early detection, excursion containment, and predictive risk mitigation. Ensure alignment of inspection, review, classification, and analytics ecosystems with future technology requirements Program Execution and Stakeholder Influence: Drive large-scale, cross-site programs requiring alignment across process integration, manufacturing, equipment, and corporate strategy teams. Operate across multiple disciplines translating executive vision into clear roadmaps, measurable milestones, and disciplined execution. Influence senior stakeholders and executives to align investments, priorities, and organizational focus. Organization and Talent Leadership: Build and lead a high-performing, diverse organization, fostering a culture of innovation, accountability, and continuous learning. Develop next-generation leaders with capabilities spanning engineering depth, data science, and AI fluency. Champion a shift from individual based to scalable, system-driven excellence. Qualifications Minimum Qualifications • Bachelor's degree in Engineering, Physics, Materials Science, Data Science, or related field (advanced degree preferred). • 12+ years of experience in semiconductor manufacturing with deep expertise in yield engineering, defect metrology, or process integration. • Proven track record leading complex, cross-functional programs in high-volume manufacturing environments. • Demonstrated experience driving yield improvement and defect reduction at scale, including ramp and HVM phases. • Strong domain expertise in defect metrology tools, inspection systems, and yield analysis methodologies. • Experience integrating data analytics, machine learning, or AI solutions into engineering workflows. • Exceptional leadership and communication skills with ability to influence across organizational boundaries. Preferred Qualifications • Advanced degree (MS/PhD) in a relevant technical or data-centric discipline. • Experience leading AI/ML transformation initiatives in semiconductor or adjacent high-tech industries. • Familiarity with digital manufacturing ecosystems (data platforms, MES integration, advanced analytics tools). • Track record of defining and scaling enterprise-level engineering systems or platforms. • Strong business acumen with ability to connect technical outcomes to cost, cycle time, and revenue impact. • Experience in advanced packaging technologies (e.g., Foveros, EMIB, heterogeneous integration) is a plus. Join our team and be part of shaping the future of technology through your leadership and expertise. Apply today to make an impact. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research. Other Locations US, Phoenix Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. Annual Salary Range for jobs which could be performed in the US $252,840.00-$356,950.00 Salary range dependent on a number of factors including location and experience Working Model This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. Job posting details (such as work model, location or time type) are subject to change.Position of TrustThis role is a Position of Trust. Should you accept this position, you must consent to and pass an extended Background Investigation, which includes (subject to country law), extended education, SEC sanctions, and additional criminal and civil checks. For internals, this investigation may or may not be completed prior to starting the position. For additional questions, please contact your Recruiter.

Job Description Note: This role requires regular onsite presence to fulfill essential job responsibilities. Drives technology development and enablement for both high volume manufacturing and future technology, provides process integration and equipment solutions, and performs feasibility studies to meet desired device specifications. Leads design and development of technically sophisticated manufacturing processes and/or repair reverse engineering including material selection, parameter optimization, equipment metrology, and system design to enable new product designs and functional requirements. Performs pathfinding activities in support of process and hardware development enabling manufacturing of innovative device architectures and develops roadmaps for technologies enabling future roadmap. Recommends and implements modifications for operating equipment to improve production efficiency, manufacturing techniques, and optimizing production output for existing products. Partners with key equipment and materials suppliers to develop and implement enabling elements of the technology. Performs process technology feasibility studies through theoretical simulations and/or practical engineering methods. Remains updated on relevant industrial process and material manufacturing technical trends and develops view of inherent future Intel process technology needs to push industry forward by partnering with vendor ecosystem to build cost sensitive roadmap. Required Skills and Experience Proven track record of technical ownership and delivery of dry etch process innovations that enabled high volume manufacturing, yield improvement, reliability, or technology node transitions. Expert level understanding of plasma physics, plasma-surface interactions, pattern fidelity, selectivity, defectivity, and profile control for advanced device structures. Demonstrated ability to define long term technical direction and translate research concepts into manufacturable solutions at scale. Extensive experience with advanced data analytics, statistical modeling, and design of experiments (DOE) applied to complex semiconductor process problems. Recognized technical authority who influences decisions across modules, organizations, or technology programs without formal management authority. Preferred Skills and Experience Sustained leadership in developing and deploying next generation dry etch solutions for advanced logic or foundry technologies (e.g., FinFET, GAA, nanosheet architectures). Deep experience with advanced etch technologies, such as: High aspect ratio plasma etch (HARC); Atomic Layer Etch (ALE), EUV patterned layer etch integration; Radical and Vapor phase isotropic etching; Ash and surface treatments; Novel patterning or materials specific etch solutions Demonstrated history of breaking technical bottlenecks that materially impacted product ramp success, cost, or yield across multiple process nodes or product generations. Expertise in advanced materials and device characterization, including SEM, TEM, CD SEM, AFM, XPS, and electrical correlation. Strong publication, patent, or internal technology disclosure record that evidences field level or industry recognized contributions. Ability to mentor senior engineers, set technical standards, and elevate organizational capability across the dry etch discipline. Proven effectiveness in influencing cross functional and external stakeholders, including integration, device, yield, and equipment suppliers, to align on long term technical strategies. Experience shaping multiyear roadmaps for process platforms, tooling strategies, or foundational etch capabilities. Qualifications PhD with 10+ years of directly relevant experience, or Master's degree with 15+ years of experience, in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field. Deep, authoritative expertise in dry etch semiconductor manufacturing, with demonstrated leadership over complex process development or platform level solutions. Experience working in dry etch in a foundry Other Locations US, TX, Austin; US, AZ, Phoenix; US, CA, Folsom; US, CA, Santa Clara Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. Annual Salary Range for jobs which could be performed in the US $201,330.00-$284,230.00 Salary range dependent on a number of factors including location and experience Working Model This role will require an on-site presence. Job posting details (such as work model, location or time type) are subject to change.Position of TrustThis role is a Position of Trust. Should you accept this position, you must consent to and pass an extended Background Investigation, which includes (subject to country law), extended education, SEC sanctions, and additional criminal and civil checks. For internals, this investigation may or may not be completed prior to starting the position. For additional questions, please contact your Recruiter.

Job Description Note: This role requires regular onsite presence to fulfill essential job responsibilities. Drives technology development and enablement for both high volume manufacturing and future technology, provides process integration and equipment solutions, and performs feasibility studies to meet desired device specifications. Leads design and development of technically sophisticated manufacturing processes and/or repair reverse engineering including material selection, parameter optimization, equipment metrology, and system design to enable new product designs and functional requirements. Performs pathfinding activities in support of process and hardware development enabling manufacturing of innovative device architectures and develops roadmaps for technologies enabling future roadmap. Recommends and implements modifications for operating equipment to improve production efficiency, manufacturing techniques, and optimizing production output for existing products. Partners with key equipment and materials suppliers to develop and implement enabling elements of the technology. Performs process technology feasibility studies through theoretical simulations and/or practical engineering methods. Remains updated on relevant industrial process and material manufacturing technical trends and develops view of inherent future Intel process technology needs to push industry forward by partnering with vendor ecosystem to build cost sensitive roadmap. Required Skills and Experience Proven track record of technical ownership and delivery of dry etch process innovations that enabled high volume manufacturing, yield improvement, reliability, or technology node transitions. Expert level understanding of plasma physics, plasma-surface interactions, pattern fidelity, selectivity, defectivity, and profile control for advanced device structures. Demonstrated ability to define long term technical direction and translate research concepts into manufacturable solutions at scale. Extensive experience with advanced data analytics, statistical modeling, and design of experiments (DOE) applied to complex semiconductor process problems. Recognized technical authority who influences decisions across modules, organizations, or technology programs without formal management authority. Preferred Skills and Experience Sustained leadership in developing and deploying next generation dry etch solutions for advanced logic or foundry technologies (e.g., FinFET, GAA, nanosheet architectures). Deep experience with advanced etch technologies, such as: High aspect ratio plasma etch (HARC); Atomic Layer Etch (ALE), EUV patterned layer etch integration; Radical and Vapor phase isotropic etching; Ash and surface treatments; Novel patterning or materials specific etch solutions Demonstrated history of breaking technical bottlenecks that materially impacted product ramp success, cost, or yield across multiple process nodes or product generations. Expertise in advanced materials and device characterization, including SEM, TEM, CD SEM, AFM, XPS, and electrical correlation. Strong publication, patent, or internal technology disclosure record that evidences field level or industry recognized contributions. Ability to mentor senior engineers, set technical standards, and elevate organizational capability across the dry etch discipline. Proven effectiveness in influencing cross functional and external stakeholders, including integration, device, yield, and equipment suppliers, to align on long term technical strategies. Experience shaping multiyear roadmaps for process platforms, tooling strategies, or foundational etch capabilities. Qualifications PhD with 10+ years of directly relevant experience, or Master's degree with 15+ years of experience, in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field. Deep, authoritative expertise in dry etch semiconductor manufacturing, with demonstrated leadership over complex process development or platform level solutions. Experience working in dry etch in a foundry Other Locations US, TX, Austin; US, AZ, Phoenix; US, CA, Folsom; US, CA, Santa Clara Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. Annual Salary Range for jobs which could be performed in the US $201,330.00-$284,230.00 Salary range dependent on a number of factors including location and experience Working Model This role will require an on-site presence. Job posting details (such as work model, location or time type) are subject to change.Position of TrustThis role is a Position of Trust. Should you accept this position, you must consent to and pass an extended Background Investigation, which includes (subject to country law), extended education, SEC sanctions, and additional criminal and civil checks. For internals, this investigation may or may not be completed prior to starting the position. For additional questions, please contact your Recruiter.

Job Description Intel is shaping the future of technology to help create a better future for the entire world. Our work in pushing forward fields like AI, analytics, and cloud-to-edge technology is at the heart of countless innovations. With a career at Intel, you'll have the opportunity to use technology to power major breakthroughs and create enhancements that improve our everyday quality of life. We're looking to hire a highly motivated mechanical engineer to join Advanced Packaging Mechanical Analysis team located in Chandler AZ. This role is focused on developing Multiphysics thermo-mechanical simulations to support design, definition, development and qualifications of advanced semiconductor packaging led by Intel Foundry. This position offers the opportunity to work at the forefront of semiconductor packaging innovation, collaborating with engineers and researchers across multiple business groups such as design, technology integration, reliability, yield and manufacturing. This role requires regular onsite presence to fulfill essential job responsibilities. Key Responsibilities. Develop and validate finite element analysis (FEA) models to simulate thermal and mechanical behavior of advanced semiconductor packages. Perform simulations to evaluate stress, strain, warpage, delamination, thermal cycling, and reliability risks across a wide range of package architectures. Collaborate with cross-functional teams to define simulation requirements, interpret results, and provide actionable design and process recommendations. Design and coordinate lab tests and research on basic materials and properties to understand material behavior and reliability failure mechanisms. The ideal candidate will have to drive strategic development activities and work closely with internal and external customer organizations to plan, execute and communicate development activities and programs. The team leverages both experimental and numerical methods across a broad range of areas, including thermal, mechanical, and fluids. The team typically uses a combination of simulations and experiments, as needed, to help solve practical engineering problems. The team frequently leverages advanced analysis methods (statistical, AI/ML) to supplement modeling and experimental approaches. The ideal candidate should exhibit the following skills or behavioral traits: Demonstrated ability to work seamlessly between experiments and simulations. Qualifications You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research. Minimum Qualifications: PhD Degree in Mechanical Engineering, Chemical Engineering or Material Sciences or a related field with emphasis in solid mechanics. 3+ years of Thermal-mechanical work/research experience with emphasis on silicon reliability 3+ years of experience with Finite Element Analysis tools 3+ years of experience with experimental material characterization metrologies such as DMA/TMA and nano-indentation. Preferred Qualifications: Experience with multi-physics simulations, including coupled electro-thermal-mechanical analysis, free surface two phase flows, electroplating and plasma. Experience with co-packaging optics, optical coupling, fiber pigtail attachment, free space optics. Experience with designing, planning and executing experiments, along with interpretation of results. Experience with scripting and automation (e.g., Python, TCL, MATLAB) to streamline simulation workflows. Knowledge in advanced packaging technologies, familiarity with semiconductor packaging processes, including die attach, underfill, molding, bumping, surface mount and reflow. Programming/script development with artificial intelligence and machine learning concepts. Previous related work experience in a semiconductor foundry preferred. Join us at Intel and be part of a team that values innovation, collaboration, and making a meaningful impact. Apply today to embark on a rewarding career journey with us! Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. Annual Salary Range for jobs which could be performed in the US $148,100.00-$209,100.00 Salary range dependent on a number of factors including location and experience Working Model This role will require an on-site presence. Job posting details (such as work model, location or time type) are subject to change.

Job Description The Role and Impact We are seeking a Senior Strategic Program Leader to drive the next generation of Yield and Defect Engineering transformation within a high-volume semiconductor manufacturing environment. This role goes beyond traditional engineering leadership serving as a catalyst for AI-driven innovation, enterprise scale program execution, and cross-functional alignment. You will lead a multidisciplinary organization responsible for advancing defect metrology, yield engineering systems, and AI-enabled decision intelligence, ensuring the factory operates with predictive, adaptive, and scalable capabilities. Your leadership will directly shape how data, automation, and artificial intelligence are embedded into daily operations to accelerate yield learning, improve cycle time, and increase productivity. As a key member of the technology and manufacturing leadership team, you will define long-term strategy, influence roadmaps across process integration and metrology, and drive execution of complex, high-impact programs that position the organization for future technology nodes and advanced packaging innovations. Key Responsibilities Strategic Leadership and Transformation: Define and execute a multi-year strategy for Yield and Defect Engineering, integrating AI/ML, automation, and digital transformation into core workflows. Lead enterprise-level programs to transition from reactive analysis to predictive and prescriptive yield management systems. Serve as a thought leader in AI adoption for semiconductor manufacturing, identifying high-value use cases and scaling solutions across sites. AI-Driven Productivity and Decision Intelligence: Champion the deployment of AI/Agentic AI solutions to enhance defect detection, classification, excursion prevention, and root cause analysis. Drive integration of data platforms, digital twins, and advanced analytics into yield and defect systems. Partner with data science, IT, and automation teams to embed real-time decision intelligence into fab operations. Operational Excellence and Yield Performance: Oversee yield performance across development and high-volume manufacturing, ensuring alignment to aggressive yield, quality, and delivery targets. Lead cross-functional efforts to resolve complex yield limiters and defect excursions, minimizing impact to supply. Institutionalize closed-loop learning systems that accelerate yield ramp and improve defect pareto convergence. Defect Metrology and Systems Leadership: Define and evolve defect metrology strategy, including tool selection, capability roadmaps, and system architecture. Lead development of scalable defect management systems that enable early detection, excursion containment, and predictive risk mitigation. Ensure alignment of inspection, review, classification, and analytics ecosystems with future technology requirements Program Execution and Stakeholder Influence: Drive large-scale, cross-site programs requiring alignment across process integration, manufacturing, equipment, and corporate strategy teams. Operate across multiple disciplines translating executive vision into clear roadmaps, measurable milestones, and disciplined execution. Influence senior stakeholders and executives to align investments, priorities, and organizational focus. Organization and Talent Leadership: Build and lead a high-performing, diverse organization, fostering a culture of innovation, accountability, and continuous learning. Develop next-generation leaders with capabilities spanning engineering depth, data science, and AI fluency. Champion a shift from individual based to scalable, system-driven excellence. Qualifications Minimum Qualifications • Bachelor's degree in Engineering, Physics, Materials Science, Data Science, or related field (advanced degree preferred). • 12+ years of experience in semiconductor manufacturing with deep expertise in yield engineering, defect metrology, or process integration. • Proven track record leading complex, cross-functional programs in high-volume manufacturing environments. • Demonstrated experience driving yield improvement and defect reduction at scale, including ramp and HVM phases. • Strong domain expertise in defect metrology tools, inspection systems, and yield analysis methodologies. • Experience integrating data analytics, machine learning, or AI solutions into engineering workflows. • Exceptional leadership and communication skills with ability to influence across organizational boundaries. Preferred Qualifications • Advanced degree (MS/PhD) in a relevant technical or data-centric discipline. • Experience leading AI/ML transformation initiatives in semiconductor or adjacent high-tech industries. • Familiarity with digital manufacturing ecosystems (data platforms, MES integration, advanced analytics tools). • Track record of defining and scaling enterprise-level engineering systems or platforms. • Strong business acumen with ability to connect technical outcomes to cost, cycle time, and revenue impact. • Experience in advanced packaging technologies (e.g., Foveros, EMIB, heterogeneous integration) is a plus. Join our team and be part of shaping the future of technology through your leadership and expertise. Apply today to make an impact. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research. Other Locations US, Phoenix Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. Annual Salary Range for jobs which could be performed in the US $252,840.00-$356,950.00 Salary range dependent on a number of factors including location and experience Working Model This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. Job posting details (such as work model, location or time type) are subject to change.Position of TrustThis role is a Position of Trust. Should you accept this position, you must consent to and pass an extended Background Investigation, which includes (subject to country law), extended education, SEC sanctions, and additional criminal and civil checks. For internals, this investigation may or may not be completed prior to starting the position. For additional questions, please contact your Recruiter.

Job Description The Role and Impact As a Yield Development Engineer, you will play a vital role in Intel's process development lifecycle, directly influencing product quality and driving technological innovation. Your contributions will shape the next generation of semiconductor technologies by identifying root cause yield limiters and driving yield and manufacturability improvements. This position offers the opportunity to collaborate across teams and disciplines, providing impactful solutions that enhance Intel's manufacturing processes and product reliability. Join us and help shape the future of computing technology. Key Responsibilities - The candidate will be part of the assembly technology development labs in support of advanced electronic assembly manufacturing process development. This is an entry level position and compensation will be given accordingly. - Perform ToF-SIMS, XPS, mIRage, nano IR and Raman spectroscopy analysis. - Provide direct customer support, participating in safety initiatives, lab sustaining and development, process transfer, tool ownership and training on other techniques. - Assist in routine instrument maintenance. - Provide flexible surface analysis and materials analysis support when needed. - Analyze complex ToF-SIMS/Auger/XPS/IR data. - Apply fundamental problem solving to electronic packaging manufacturing issues. - Strong communication skills, organizational and/or prioritization skills. - Willingness to work both independently and successfully interface with peers, engineers, technicians and other analytical groups in a team. Environment. Qualifications Minimum Qualifications: - Must possess a PHD degree in Materials science, Chemistry, Chemical Engineering, Applied physics, or STEM related fields with 1+ years experience or Master degree with 4+ years working experience in operating UHV-based analytical equipment including one of these: ToF-SIMS, Auger/XPS, dynamic SIMS, mIRage, FTIR, Nano-IR, Raman, AFM, SEM/EDS etc. - Must have the required Ph.D degree or expect the required Ph.D degree by Aug. 2026. Preferred: - Proficiency in statistical data analysis tools such as JMP, Python is a plus. - Experience in semiconductor processing, packaging, and failure analysis techniques is a plus. - Familiarity with design of experiments (DOE) methodologies and big data visualization is a plus. - Strong problem-solving skills, with demonstrated ability to collaborate across interdisciplinary teams. If you are excited about making a meaningful impact, driving technological advancements, and thriving in a collaborative environment, we invite you to apply for this opportunity. Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. Annual Salary Range for jobs which could be performed in the US $127,400.00-$179,900.00 Salary range dependent on a number of factors including location and experience Working Model This role will require an on-site presence. Job posting details (such as work model, location or time type) are subject to change.

Job Description Intel is shaping the future of technology to help create a better future for the entire world. Our work in pushing forward fields like AI, analytics, and cloud-to-edge technology is at the heart of countless innovations. With a career at Intel, you'll have the opportunity to use technology to power major breakthroughs and create enhancements that improve our everyday quality of life. Join us and help make the future more wonderful for everyone. Want to learn more? Visit our YouTube Channel or the link below. Life at Intel Shape the Future of Technology at Intel and Transform Tomorrow's Technology Today Join Intel as a Yield Development Engineer and play a pivotal role in advancing semiconductor process technology. In this position, you'll drive yield improvements across next-generation technology nodes, directly contributing to Intel's market leadership in high-performance, reliable semiconductor products. Working with cross-functional teams, you'll tackle complex engineering challenges and develop breakthrough methodologies that define the future of semiconductor manufacturing. Core Responsibilities Process Optimization & Problem Solving Identify and resolve yield-limiting factors throughout technology node lifecycles Develop innovative solutions for complex yield challenges Design measurement protocols for rapid, accurate product integrity assessment Data Analysis & Strategic Planning Conduct advanced statistical analysis and create data visualizations Build comprehensive process development roadmaps aligned with yield milestones Transform manufacturing and experimental data into actionable yield improvement strategies Cross-Functional Collaboration Partner with design, test, and process development teams to debug yield issues Lead new product introductions and design-technology co-optimization initiatives Participate in factory task forces and design of experiments programs Technology Development Develop and optimize equipment and methodologies for advanced logic nodes Ensure manufacturability through comprehensive process analysis Support manufacturing ramp readiness through proactive yield issue resolution Core Competencies Collaborative Leadership: Proven success working across diverse, interdisciplinary teams Technical Communication: Ability to translate complex concepts for varied technical and business audiences Project Management: Experience managing multiple concurrent projects while meeting critical deadlines Innovation Focus: Passion for creative problem-solving in dynamic, fast-paced environments Adaptability: Thrives in ambiguous situations and evolving technical landscapes What We're Looking For: We welcome candidates who bring: • Collaborative Excellence: Demonstrated success working with diverse teams and stakeholders • Communication Impact: Strong ability to translate complex technical concepts for varied audiences and backgrounds • Cross-Functional Partnership: Proven experience building relationships and driving results across different disciplines and organizational levels • Project Leadership: Ability to manage multiple concurrent projects while maintaining high standards and meeting critical deadlines. • Innovation Mindset: Passion for creative problem-solving and driving meaningful results in dynamic environments • Adaptability: Comfort with ambiguity and ability to thrive in fast-paced, evolving technical landscapes Qualifications You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your school work/classes/research and/or relevant previous job and/or internship experiences. Minimum Qualifications Master's degree in Electrical Engineering, Materials Science, Mechanical Engineering, Semiconductor Technology, or in a STEM related field 3+ years of experience in yield development or process technology Experience with yield projection using EOL signals and in-line parameters Experience with advanced semiconductor devices and process flows Preferred Qualifications 2+ years of external customer advanced node semiconductor devices and process flow concepts Ph.D. degree in Electrical Engineering, Materials Science, Mechanical Engineering, Semiconductor Technology, or in a STEM related field Experience with data analysis systems and advanced semiconductor equipment Experience with semiconductor process development and defect density analysis Experience with data analytics methodologies and process innovation Project/program management background with self-direction capabilities Experience driving strategic objectives across matrix organizations Experience managing competing priorities and continuous improvement initiatives Benefits at Intel Our total rewards package goes above and beyond just a paycheck. Whether you're looking to build your career, improve your health, or protect your wealth, we offer generous benefits to help you achieve your goals. Go to Intel Benefits Intel Careers for details of benefits available to you. Intel reserves the right to modify, change or discontinue benefit plans at any time in its sole discretion. Other Locations US, Phoenix Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. Annual Salary Range for jobs which could be performed in the US $148,100.00-$209,100.00 Salary range dependent on a number of factors including location and experience Working Model This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. Job posting details (such as work model, location or time type) are subject to change.

Job Description Drives technology development and enablement for both high volume manufacturing and future technology, provides process integration and equipment solutions, and performs feasibility studies to meet desired device specifications Leads design and development of technically sophisticated manufacturing processes and/or repair reverse engineering including material selection, parameter optimization, equipment metrology, and system design to enable new product designs and functional requirements Performs pathfinding activities in support of process and hardware development enabling manufacturing of innovative device architectures, and develops roadmaps for technologies enabling future roadmap Recommends and implements modifications for operating equipment to improve production efficiency, manufacturing techniques, and optimizing production output for existing products Partners with key equipment and materials suppliers to develop and implement enabling elements of the technology Performs process technology feasibility studies through theoretical simulations and/or practical engineering methods Remains updated on relevant industrial process and material manufacturing technical trends and develops view of inherent future Intel process technology needs to push industry forward by partnering with vendor ecosystem to build cost sensitive roadmap Qualifications Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research. Minimum Qualifications: PhD in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field with 4+ years of relevant experience OR Master's degree in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field with 6+ years of relevant experience OR Bachelor's degree in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field with 9+ years of relevant experience Relevant recent experience includes, but is not limited to: Hands-on experience in dry etch semiconductor manufacturing, including ownership of complex process development and optimization in a foundry or high volume manufacturing environment Strong command of plasma etch fundamentals, including plasma generation, plasma-surface interactions, selectivity, profile control, and defect mechanisms Demonstrated record of delivering dry etch process solutions that improved yield, reliability, performance, or manufacturability for advanced technology nodes Proven ability to lead technical problem solving across projects or sub modules, influencing peers and stakeholders without formal people management responsibility Expertise in statistical analysis and DOE methodologies, using tools such as JMP, Python, or MATLAB to drive data based decisions Experience working with and troubleshooting advanced semiconductor manufacturing equipment in a cleanroom environment Preferred Qualifications: 5+ years of direct experience developing and deploying dry etch processes for advanced logic or foundry technologies, including technology node transitions or major process changes Experience with advanced dry etch technologies such as: ICP / CCP plasma etch o High aspect ratio etch (HARC) o Atomic Layer Etch (ALE) o Radical and Vapor phase isotropic etching o Ash and surface treatments o EUV patterned layer etch integration Demonstrated impact on cross module or integration level challenges, such as pattern fidelity, CD control, defectivity, variability reduction, or process window expansion Strong understanding of advanced device architectures (e.g., FinFET, GAA, nanosheet) and their etch integration requirements Experience with materials and device characterization techniques, including SEM, TEM, CD SEM, AFM, XPS, or electrical correlation Ability to define technical approaches, de risk options, and guide less senior engineers through complex problem solving Track record of effective collaboration with integration, lithography, device, yield, and equipment partner teams to deliver robust manufacturing solutions Evidence of broader technical influence, such as internal technology disclosures, patents, publications, or recognized subject matter expertise within the organization For information on Intel's immigration sponsorship guidelines, please see Intel U.S. Immigration Sponsorship Information Other Locations US, AZ, Phoenix; US, CA, Santa Clara Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. Annual Salary Range for jobs which could be performed in the US $172,200.00-$243,000.00 Salary range dependent on a number of factors including location and experience Working Model This role will require an on-site presence. Job posting details (such as work model, location or time type) are subject to change.

Job Description Intel is shaping the future of technology to help create a better future for the entire world. Our work in pushing forward fields like AI, analytics, and cloud-to-edge technology is at the heart of countless innovations. With a career at Intel, you'll have the opportunity to use technology to power major breakthroughs and create enhancements that improve our everyday quality of life. Join us and help make the future more wonderful for everyone. Want to learn more? Visit our YouTube Channel or the link below. Life at Intel Shape the Future of Technology at Intel and Transform Tomorrow's Technology Today Join Intel as a Yield Development Engineer and play a pivotal role in advancing semiconductor process technology. In this position, you'll drive yield improvements across next-generation technology nodes, directly contributing to Intel's market leadership in high-performance, reliable semiconductor products. Working with cross-functional teams, you'll tackle complex engineering challenges and develop breakthrough methodologies that define the future of semiconductor manufacturing. Core Responsibilities Process Optimization & Problem Solving Identify and resolve yield-limiting factors throughout technology node lifecycles Develop innovative solutions for complex yield challenges Design measurement protocols for rapid, accurate product integrity assessment Data Analysis & Strategic Planning Conduct advanced statistical analysis and create data visualizations Build comprehensive process development roadmaps aligned with yield milestones Transform manufacturing and experimental data into actionable yield improvement strategies Cross-Functional Collaboration Partner with design, test, and process development teams to debug yield issues Lead new product introductions and design-technology co-optimization initiatives Participate in factory task forces and design of experiments programs Technology Development Develop and optimize equipment and methodologies for advanced logic nodes Ensure manufacturability through comprehensive process analysis Support manufacturing ramp readiness through proactive yield issue resolution Core Competencies Collaborative Leadership: Proven success working across diverse, interdisciplinary teams Technical Communication: Ability to translate complex concepts for varied technical and business audiences Project Management: Experience managing multiple concurrent projects while meeting critical deadlines Innovation Focus: Passion for creative problem-solving in dynamic, fast-paced environments Adaptability: Thrives in ambiguous situations and evolving technical landscapes What We're Looking For: We welcome candidates who bring: • Collaborative Excellence: Demonstrated success working with diverse teams and stakeholders • Communication Impact: Strong ability to translate complex technical concepts for varied audiences and backgrounds • Cross-Functional Partnership: Proven experience building relationships and driving results across different disciplines and organizational levels • Project Leadership: Ability to manage multiple concurrent projects while maintaining high standards and meeting critical deadlines. • Innovation Mindset: Passion for creative problem-solving and driving meaningful results in dynamic environments • Adaptability: Comfort with ambiguity and ability to thrive in fast-paced, evolving technical landscapes Qualifications You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your school work/classes/research and/or relevant previous job and/or internship experiences. Minimum Qualifications Master's degree in Electrical Engineering, Materials Science, Mechanical Engineering, Semiconductor Technology, or in a STEM related field 3+ years of experience in yield development or process technology Experience with yield projection using EOL signals and in-line parameters Experience with advanced semiconductor devices and process flows Preferred Qualifications 2+ years of external customer advanced node semiconductor devices and process flow concepts Ph.D. degree in Electrical Engineering, Materials Science, Mechanical Engineering, Semiconductor Technology, or in a STEM related field Experience with data analysis systems and advanced semiconductor equipment Experience with semiconductor process development and defect density analysis Experience with data analytics methodologies and process innovation Project/program management background with self-direction capabilities Experience driving strategic objectives across matrix organizations Experience managing competing priorities and continuous improvement initiatives Benefits at Intel Our total rewards package goes above and beyond just a paycheck. Whether you're looking to build your career, improve your health, or protect your wealth, we offer generous benefits to help you achieve your goals. Go to Intel Benefits Intel Careers for details of benefits available to you. Intel reserves the right to modify, change or discontinue benefit plans at any time in its sole discretion. Other Locations US, Phoenix Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. Annual Salary Range for jobs which could be performed in the US $148,100.00-$209,100.00 Salary range dependent on a number of factors including location and experience Working Model This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. Job posting details (such as work model, location or time type) are subject to change.

Job Description Join Intel and build a better tomorrow. Intel is in the midst of an exciting transformation, with a vision to create and extend computing technology to connect and enrich the lives of every person on Earth. The Ocotillo Technology Fabrication (OTF) Module Engineer role is multifaceted. The ideal candidate will have a passion for instrumentation and equipment with the goal of developing a robust manufacturable process module. As an OTF Module Engineer you will play an important role in the OTF engineering team. You will be responsible for owning all aspects of one or more of the factory's 300mm toolsets. Your sustaining responsibilities will include the safety and cleanliness of your area and ensuring copy-exact for your toolset. You will also be expected to review the relevant control charts and tool output daily and ensure your toolset and layers remain excursion free. You will be responsible for delivering MOR availability and achieving 100 percent matching for all relevant operations. For new technology start-ups, you will be responsible for tool installations, conversions, qualifications, and sustained matching performance. You will be expected to drive continuous improvement in the health and matching of your toolset(s) by maintaining and driving an improvement roadmap. You will be responsible for leading your tools and area to achieve record tool availability, cycle time, and record low defect densities in support of OTFs factory goals. OTF supports high volume manufacturing. As such, your role may include elements of module-level process development in support of the factory's goal and output. Job responsibilities will include, but are not limited to: Define roadmaps to meet requirements, goals and milestones for a new technology process. Defines and establishes flow, procedures, and equipment configuration for the module. Selects and develops material and equipment for the process to meet quality, yield, reliability, cost, productivity and manufacturability requirements. Plans and conducts experiments to fully characterize the process throughout the development cycle. Drives improvements on quality, yield, reliability, process stability/capability, productivity and safety/ergonomic over variables such as material, method, equipment, environment and operating personnel. Develops solutions to problems utilizing formal education, statistical knowledge, and problem-solving tools. Establishes process control systems for the process module and sustains the module through volume ramp. Trains production/receiving process engineers for transfer to other factories. Transfers process to high volume manufacturing and provide support in new factory start-up as well as install and qualification of the new production lines. Position may require working on a day or night shift as an OSE (on-shift engineer) to support toolset needs and may require a flexible schedule. Qualifications You must possess the below minimum qualifications to be initially considered for this position. Relevant experience can be obtained through schoolwork, classes and project work, internships, military training, and/or work experience. Minimum Requirements: Bachelor's degree with 6+ years of experience OR Master's degree with 4+ years of experience, OR PhD degree with 1+ years of experience in Electrical Engineering, Chemistry, Chemical Engineering, Mechanical or related engineering STEM field. 2+ years of experience in a manufacturing environment. Preferred qualifications: Semiconductor Foundry experience is a plus. Demonstrate strong technical and troubleshooting skills. Clean room experience. Demonstrate exceptional customer orientation. Have a strong knowledge of statistics and experimental design; and the ability to apply that knowledge to tool matching, tool qualification, and process development. Demonstrate the ability to work across organizational boundaries including process engineering, integration and yield. Good communication skills with a high tolerance to ambiguous and changing situations Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. Annual Salary Range for jobs which could be performed in the US $116,100.00-$163,800.00 Salary range dependent on a number of factors including location and experience Working Model This role will require an on-site presence. Job posting details (such as work model, location or time type) are subject to change.

Job Description Note: This role requires regular onsite presence to fulfill essential job responsibilities. Drives technology development and enablement for both high volume manufacturing and future technology, provides process integration and equipment solutions, and performs feasibility studies to meet desired device specifications. Leads design and development of technically sophisticated manufacturing processes and/or repair reverse engineering including material selection, parameter optimization, equipment metrology, and system design to enable new product designs and functional requirements. Performs pathfinding activities in support of process and hardware development enabling manufacturing of innovative device architectures and develops roadmaps for technologies enabling future roadmap. Recommends and implements modifications for operating equipment to improve production efficiency, manufacturing techniques, and optimizing production output for existing products. Partners with key equipment and materials suppliers to develop and implement enabling elements of the technology. Performs process technology feasibility studies through theoretical simulations and/or practical engineering methods. Remains updated on relevant industrial process and material manufacturing technical trends and develops view of inherent future Intel process technology needs to push industry forward by partnering with vendor ecosystem to build cost sensitive roadmap. Required Skills and Experience Proven track record of technical ownership and delivery of dry etch process innovations that enabled high volume manufacturing, yield improvement, reliability, or technology node transitions. Expert level understanding of plasma physics, plasma-surface interactions, pattern fidelity, selectivity, defectivity, and profile control for advanced device structures. Demonstrated ability to define long term technical direction and translate research concepts into manufacturable solutions at scale. Extensive experience with advanced data analytics, statistical modeling, and design of experiments (DOE) applied to complex semiconductor process problems. Recognized technical authority who influences decisions across modules, organizations, or technology programs without formal management authority. Preferred Skills and Experience Sustained leadership in developing and deploying next generation dry etch solutions for advanced logic or foundry technologies (e.g., FinFET, GAA, nanosheet architectures). Deep experience with advanced etch technologies, such as: High aspect ratio plasma etch (HARC); Atomic Layer Etch (ALE), EUV patterned layer etch integration; Radical and Vapor phase isotropic etching; Ash and surface treatments; Novel patterning or materials specific etch solutions Demonstrated history of breaking technical bottlenecks that materially impacted product ramp success, cost, or yield across multiple process nodes or product generations. Expertise in advanced materials and device characterization, including SEM, TEM, CD SEM, AFM, XPS, and electrical correlation. Strong publication, patent, or internal technology disclosure record that evidences field level or industry recognized contributions. Ability to mentor senior engineers, set technical standards, and elevate organizational capability across the dry etch discipline. Proven effectiveness in influencing cross functional and external stakeholders, including integration, device, yield, and equipment suppliers, to align on long term technical strategies. Experience shaping multiyear roadmaps for process platforms, tooling strategies, or foundational etch capabilities. Qualifications PhD with 10+ years of directly relevant experience, or Master's degree with 15+ years of experience, in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field. Deep, authoritative expertise in dry etch semiconductor manufacturing, with demonstrated leadership over complex process development or platform level solutions. Experience working in dry etch in a foundry Other Locations US, TX, Austin; US, AZ, Phoenix; US, CA, Folsom; US, CA, Santa Clara Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. Annual Salary Range for jobs which could be performed in the US $201,330.00-$284,230.00 Salary range dependent on a number of factors including location and experience Working Model This role will require an on-site presence. Job posting details (such as work model, location or time type) are subject to change.Position of TrustThis role is a Position of Trust. Should you accept this position, you must consent to and pass an extended Background Investigation, which includes (subject to country law), extended education, SEC sanctions, and additional criminal and civil checks. For internals, this investigation may or may not be completed prior to starting the position. For additional questions, please contact your Recruiter.

Job Description Join Intel and build a better tomorrow. Intel is in the midst of an exciting transformation, with a vision to create and extend computing technology to connect and enrich the lives of every person on Earth. Our high-volume manufacturing facility in Chandler, Arizona is looking for amazing talent. Join and help us create the next generation of technologies that will shape the future for decades to come. The Ocotillo Technology Fabrication (OTF) Module Engineer role is multifaceted. The ideal candidate will have a passion for instrumentation and equipment with the goal of developing a robust manufacturable process module. Job Responsibilities: Strong understanding of TEL CLEAN TRACK / LITHIUS Pro V coat-develop track operation, including wafer flow, FOUP handling, transfer robotics, spin coat, develop, bake, chill, HMDS, EBR, backside rinse, and dispense modules Working knowledge of lithography track processes such as resist coating, adhesion promotion, post-apply bake, post-exposure bake, development, defect control, CD / uniformity impacts, and process window sensitivity Ability to troubleshoot tool and process issues using alarms, equipment logs, recipe settings, wafer history, SPC charts, metrology feedback, and defect / excursion data Hands-on experience with preventive maintenance, module recovery, nozzle / dispense checks, robot and wafer transfer issues, thermal module performance, exhaust / drain systems, and chemical delivery concerns Familiarity with safety and compliance expectations, including chemical handling, LOTO, gas and liquid line controls, cleanroom protocol, and escalation discipline Demonstrated ability to lead and align a team of senior engineers, set technical direction, prioritize critical issues, mentor others, and drive accountability for timely execution and measurable results Experience with working with chem suppliers and managing supply and demand Owns critical high volume manufacturing equipment and processes that enable rapid device miniaturization and the mass production of integrated circuits Conducts tests and measurements of their operations to ensure control over critical dimensions and defectivity of the process line Recommends and implements modifications for operating the equipment in order to improve production efficiencies, manufacturing techniques and optimizing production output for existing products, to meet safety, quality and cost indicator goals Grows in-situ manufacturing capacity to high volumes to demonstrate the technology capability while simultaneously transferring the technology to counterparts in manufacturing sites across the globe Owns execution of maintenance and repair activities for equipment and relevant module of components Initiates and owns the continuous improvement of equipment and process for key performance indicators (e.g., safety, quality, cost, productivity, defects, and yield) and works with equipment suppliers as required Owns process development line items aligned to high volume process nodes Participates in the transfer of technology to other sites through training and audit of installation and qualification outcomes to ensure matched processing across sites Owns development and optimization of excursion prevention systems for the equipment and process Owns detection of discrepant material or activities of the equipment and process During factory ramps, owns equipment install/conversion and qualification to ensure tools are installed safely and on schedule, while meeting all quality/matching criteria (from design through Safety Level 1 and Safety Level Supplier milestones, Intel qual and manufacturing readiness processes) Qualifications You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research. Minimum Qualifications: Bachelor's degree in Electrical Engineering, Chemistry, Chemical Engineering, Mechanical or related engineering STEM field with 4+ years of experience OR Master's degree in Electrical Engineering, Chemistry, Chemical Engineering, Mechanical or related engineering STEM field with 3+ years of experience OR PhD degree in Electrical Engineering, Chemistry, Chemical Engineering, Mechanical or related engineering STEM field with 6+ months of experience The experience mentioned above should be in the following: Semiconductor Engineering experience Experience supporting high-volume manufacturing ramps and technology transfers Preferred Qualifications: Experience working in a semiconductor Foundry or OSAT (Outsourced Semiconductor Assembly and Test) company preferred Experience working in a semiconductor factory as a technician or engineer prior to Engineering role Statistics and experimental design; and the skills to apply that knowledge to tool matching, tool qualification, and process development Technical and troubleshooting experience For information on Intel's immigration sponsorship guidelines, please see Intel U.S. Immigration Sponsorship Information Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. Annual Salary Range for jobs which could be performed in the US $116,100.00-$163,800.00 Salary range dependent on a number of factors including location and experience Working Model This role will require an on-site presence. Job posting details (such as work model, location or time type) are subject to change.

Job Description Note: This role requires regular onsite presence to fulfill essential job responsibilities. Drives technology development and enablement for both high volume manufacturing and future technology, provides process integration and equipment solutions, and performs feasibility studies to meet desired device specifications. Leads design and development of technically sophisticated manufacturing processes and/or repair reverse engineering including material selection, parameter optimization, equipment metrology, and system design to enable new product designs and functional requirements. Performs pathfinding activities in support of process and hardware development enabling manufacturing of innovative device architectures and develops roadmaps for technologies enabling future roadmap. Recommends and implements modifications for operating equipment to improve production efficiency, manufacturing techniques, and optimizing production output for existing products. Partners with key equipment and materials suppliers to develop and implement enabling elements of the technology. Performs process technology feasibility studies through theoretical simulations and/or practical engineering methods. Remains updated on relevant industrial process and material manufacturing technical trends and develops view of inherent future Intel process technology needs to push industry forward by partnering with vendor ecosystem to build cost sensitive roadmap. Required Skills and Experience Proven track record of technical ownership and delivery of dry etch process innovations that enabled high volume manufacturing, yield improvement, reliability, or technology node transitions. Expert level understanding of plasma physics, plasma-surface interactions, pattern fidelity, selectivity, defectivity, and profile control for advanced device structures. Demonstrated ability to define long term technical direction and translate research concepts into manufacturable solutions at scale. Extensive experience with advanced data analytics, statistical modeling, and design of experiments (DOE) applied to complex semiconductor process problems. Recognized technical authority who influences decisions across modules, organizations, or technology programs without formal management authority. Preferred Skills and Experience Sustained leadership in developing and deploying next generation dry etch solutions for advanced logic or foundry technologies (e.g., FinFET, GAA, nanosheet architectures). Deep experience with advanced etch technologies, such as: High aspect ratio plasma etch (HARC); Atomic Layer Etch (ALE), EUV patterned layer etch integration; Radical and Vapor phase isotropic etching; Ash and surface treatments; Novel patterning or materials specific etch solutions Demonstrated history of breaking technical bottlenecks that materially impacted product ramp success, cost, or yield across multiple process nodes or product generations. Expertise in advanced materials and device characterization, including SEM, TEM, CD SEM, AFM, XPS, and electrical correlation. Strong publication, patent, or internal technology disclosure record that evidences field level or industry recognized contributions. Ability to mentor senior engineers, set technical standards, and elevate organizational capability across the dry etch discipline. Proven effectiveness in influencing cross functional and external stakeholders, including integration, device, yield, and equipment suppliers, to align on long term technical strategies. Experience shaping multiyear roadmaps for process platforms, tooling strategies, or foundational etch capabilities. Qualifications PhD with 10+ years of directly relevant experience, or Master's degree with 15+ years of experience, in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field. Deep, authoritative expertise in dry etch semiconductor manufacturing, with demonstrated leadership over complex process development or platform level solutions. Experience working in dry etch in a foundry Other Locations US, TX, Austin; US, AZ, Phoenix; US, CA, Folsom; US, CA, Santa Clara Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. Annual Salary Range for jobs which could be performed in the US $201,330.00-$284,230.00 Salary range dependent on a number of factors including location and experience Working Model This role will require an on-site presence. Job posting details (such as work model, location or time type) are subject to change.Position of TrustThis role is a Position of Trust. Should you accept this position, you must consent to and pass an extended Background Investigation, which includes (subject to country law), extended education, SEC sanctions, and additional criminal and civil checks. For internals, this investigation may or may not be completed prior to starting the position. For additional questions, please contact your Recruiter.

Job Description Drives technology development and enablement for both high volume manufacturing and future technology, provides process integration and equipment solutions, and performs feasibility studies to meet desired device specifications Leads design and development of technically sophisticated manufacturing processes and/or repair reverse engineering including material selection, parameter optimization, equipment metrology, and system design to enable new product designs and functional requirements Performs pathfinding activities in support of process and hardware development enabling manufacturing of innovative device architectures, and develops roadmaps for technologies enabling future roadmap Recommends and implements modifications for operating equipment to improve production efficiency, manufacturing techniques, and optimizing production output for existing products Partners with key equipment and materials suppliers to develop and implement enabling elements of the technology Performs process technology feasibility studies through theoretical simulations and/or practical engineering methods Remains updated on relevant industrial process and material manufacturing technical trends and develops view of inherent future Intel process technology needs to push industry forward by partnering with vendor ecosystem to build cost sensitive roadmap Qualifications Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research. Minimum Qualifications: PhD in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field with 4+ years of relevant experience OR Master's degree in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field with 6+ years of relevant experience OR Bachelor's degree in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field with 9+ years of relevant experience Relevant recent experience includes, but is not limited to: Hands-on experience in dry etch semiconductor manufacturing, including ownership of complex process development and optimization in a foundry or high volume manufacturing environment Strong command of plasma etch fundamentals, including plasma generation, plasma-surface interactions, selectivity, profile control, and defect mechanisms Demonstrated record of delivering dry etch process solutions that improved yield, reliability, performance, or manufacturability for advanced technology nodes Proven ability to lead technical problem solving across projects or sub modules, influencing peers and stakeholders without formal people management responsibility Expertise in statistical analysis and DOE methodologies, using tools such as JMP, Python, or MATLAB to drive data based decisions Experience working with and troubleshooting advanced semiconductor manufacturing equipment in a cleanroom environment Preferred Qualifications: 5+ years of direct experience developing and deploying dry etch processes for advanced logic or foundry technologies, including technology node transitions or major process changes Experience with advanced dry etch technologies such as: ICP / CCP plasma etch o High aspect ratio etch (HARC) o Atomic Layer Etch (ALE) o Radical and Vapor phase isotropic etching o Ash and surface treatments o EUV patterned layer etch integration Demonstrated impact on cross module or integration level challenges, such as pattern fidelity, CD control, defectivity, variability reduction, or process window expansion Strong understanding of advanced device architectures (e.g., FinFET, GAA, nanosheet) and their etch integration requirements Experience with materials and device characterization techniques, including SEM, TEM, CD SEM, AFM, XPS, or electrical correlation Ability to define technical approaches, de risk options, and guide less senior engineers through complex problem solving Track record of effective collaboration with integration, lithography, device, yield, and equipment partner teams to deliver robust manufacturing solutions Evidence of broader technical influence, such as internal technology disclosures, patents, publications, or recognized subject matter expertise within the organization For information on Intel's immigration sponsorship guidelines, please see Intel U.S. Immigration Sponsorship Information Other Locations US, AZ, Phoenix; US, CA, Santa Clara Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. Annual Salary Range for jobs which could be performed in the US $172,200.00-$243,000.00 Salary range dependent on a number of factors including location and experience Working Model This role will require an on-site presence. Job posting details (such as work model, location or time type) are subject to change.