Seek Thermal
Santa Barbara, California
Description: SUMMARY Under the direct supervision of the Wafer Management Director, the MEMS Semiconductor and Assembly Process Engineer is responsible for the MEMS sensor die from wafer fabrication through wafer-level packaged and tested die. This fab-less role involves working with multiple external suppliers and spans front-end MEMS processes (thin-film deposition, lithography, metallization, etch, and release) and back-end assembly (wafer-level hermetic vacuum sealing/bonding, wafer probing, dicing, die attach, and wire bonding). Working with suppliers, the engineer will sustain and improve yield on production processes, develop new processes and tools, and qualify them for production manufacturing. The position operates in both cleanroom and non-cleanroom manufacturing environments, supporting Production and Engineering. RESPONSIBILITIES • Own and sustain MEMS fabrication processes (PECVD/sputter deposition, photolithography, DRIE and wet etch, sacrificial release) to yield, Cpk, and cost targets. • Develop and qualify assembly and packaging processes: wafer-to-wafer bonding, getter activation and vacuum sealing, dicing, die attach, and wire bonding. • Characterize bond interfaces and package hermeticity using SAM, IR microscopy, SEM/FIB cross-sections, and long-term vacuum-integrity monitoring. • Design and run DOEs; use SPC and statistical analysis (JMP, Python) to identify drivers of yield loss and drive corrective and preventive actions. • Manage outsourced process steps at external suppliers: define specifications, review vendor data, run qualification lots, and disposition non-conforming material. • Perform root-cause failure analysis; drive containment and permanent fixes through the MRB/CCB process. • Partner with device design, test, reliability, quality, and engineering functions on new-product introduction and design-for-manufacturability reviews. Requirements: BS in Electrical/Mechanical Engineering, Materials Science, Physics, or related field; MS preferred. 5+ years of hands-on process engineering in MEMS or semiconductor wafer fab, with at least 2 years covering assembly/packaging (wafer bonding, die attach, wire bond, or hermetic sealing). Working knowledge of thin-film and etch processes and their interaction with downstream packaging (stress, outgassing, surface preparation for bonding). Demonstrated use of DOE, SPC, and FMEA in a production environment. Comfortable in a cleanroom (gowning required); able to read metrology and failure-analysis data and act on it. Clear written and verbal communication with suppliers, vendors, operators, and cross-functional engineers. Occasional travel to suppliers and contract manufacturers. U.S. Person status as defined by ITAR (if required by product line). PREFERRED QUALIFICATIONS • Experience with microbolometers or other vacuum-packaged MEMS infrared sensors. • Wafer-level packaging experience. • Knowledge of and experience with anti-reflective coatings. • Wafer defect identification and corrective action to improve yield. • Familiarity with MEMS reliability test methods. • Experience managing external foundry and supplier relationships. • Python or LabVIEW scripting for data handling; ISO 9001 quality-system experience. PM18 Compensation details: 00 Yearly Salary PI855c34d6-
Description: SUMMARY Under the direct supervision of the Wafer Management Director, the MEMS Semiconductor and Assembly Process Engineer is responsible for the MEMS sensor die from wafer fabrication through wafer-level packaged and tested die. This fab-less role involves working with multiple external suppliers and spans front-end MEMS processes (thin-film deposition, lithography, metallization, etch, and release) and back-end assembly (wafer-level hermetic vacuum sealing/bonding, wafer probing, dicing, die attach, and wire bonding). Working with suppliers, the engineer will sustain and improve yield on production processes, develop new processes and tools, and qualify them for production manufacturing. The position operates in both cleanroom and non-cleanroom manufacturing environments, supporting Production and Engineering. RESPONSIBILITIES • Own and sustain MEMS fabrication processes (PECVD/sputter deposition, photolithography, DRIE and wet etch, sacrificial release) to yield, Cpk, and cost targets. • Develop and qualify assembly and packaging processes: wafer-to-wafer bonding, getter activation and vacuum sealing, dicing, die attach, and wire bonding. • Characterize bond interfaces and package hermeticity using SAM, IR microscopy, SEM/FIB cross-sections, and long-term vacuum-integrity monitoring. • Design and run DOEs; use SPC and statistical analysis (JMP, Python) to identify drivers of yield loss and drive corrective and preventive actions. • Manage outsourced process steps at external suppliers: define specifications, review vendor data, run qualification lots, and disposition non-conforming material. • Perform root-cause failure analysis; drive containment and permanent fixes through the MRB/CCB process. • Partner with device design, test, reliability, quality, and engineering functions on new-product introduction and design-for-manufacturability reviews. Requirements: BS in Electrical/Mechanical Engineering, Materials Science, Physics, or related field; MS preferred. 5+ years of hands-on process engineering in MEMS or semiconductor wafer fab, with at least 2 years covering assembly/packaging (wafer bonding, die attach, wire bond, or hermetic sealing). Working knowledge of thin-film and etch processes and their interaction with downstream packaging (stress, outgassing, surface preparation for bonding). Demonstrated use of DOE, SPC, and FMEA in a production environment. Comfortable in a cleanroom (gowning required); able to read metrology and failure-analysis data and act on it. Clear written and verbal communication with suppliers, vendors, operators, and cross-functional engineers. Occasional travel to suppliers and contract manufacturers. U.S. Person status as defined by ITAR (if required by product line). PREFERRED QUALIFICATIONS • Experience with microbolometers or other vacuum-packaged MEMS infrared sensors. • Wafer-level packaging experience. • Knowledge of and experience with anti-reflective coatings. • Wafer defect identification and corrective action to improve yield. • Familiarity with MEMS reliability test methods. • Experience managing external foundry and supplier relationships. • Python or LabVIEW scripting for data handling; ISO 9001 quality-system experience. PM18 Compensation details: 00 Yearly Salary PI855c34d6-
Seek Thermal
Santa Barbara, California
Description: SUMMARY Under the direct supervision of the Wafer Management Director, the MEMS Semiconductor and Assembly Process Engineer is responsible for the MEMS sensor die from wafer fabrication through wafer-level packaged and tested die. This fab-less role involves working with multiple external suppliers and spans front-end MEMS processes (thin-film deposition, lithography, metallization, etch, and release) and back-end assembly (wafer-level hermetic vacuum sealing/bonding, wafer probing, dicing, die attach, and wire bonding). Working with suppliers, the engineer will sustain and improve yield on production processes, develop new processes and tools, and qualify them for production manufacturing. The position operates in both cleanroom and non-cleanroom manufacturing environments, supporting Production and Engineering. RESPONSIBILITIES • Own and sustain MEMS fabrication processes (PECVD/sputter deposition, photolithography, DRIE and wet etch, sacrificial release) to yield, Cpk, and cost targets. • Develop and qualify assembly and packaging processes: wafer-to-wafer bonding, getter activation and vacuum sealing, dicing, die attach, and wire bonding. • Characterize bond interfaces and package hermeticity using SAM, IR microscopy, SEM/FIB cross-sections, and long-term vacuum-integrity monitoring. • Design and run DOEs; use SPC and statistical analysis (JMP, Python) to identify drivers of yield loss and drive corrective and preventive actions. • Manage outsourced process steps at external suppliers: define specifications, review vendor data, run qualification lots, and disposition non-conforming material. • Perform root-cause failure analysis; drive containment and permanent fixes through the MRB/CCB process. • Partner with device design, test, reliability, quality, and engineering functions on new-product introduction and design-for-manufacturability reviews. Requirements: BS in Electrical/Mechanical Engineering, Materials Science, Physics, or related field; MS preferred. 5+ years of hands-on process engineering in MEMS or semiconductor wafer fab, with at least 2 years covering assembly/packaging (wafer bonding, die attach, wire bond, or hermetic sealing). Working knowledge of thin-film and etch processes and their interaction with downstream packaging (stress, outgassing, surface preparation for bonding). Demonstrated use of DOE, SPC, and FMEA in a production environment. Comfortable in a cleanroom (gowning required); able to read metrology and failure-analysis data and act on it. Clear written and verbal communication with suppliers, vendors, operators, and cross-functional engineers. Occasional travel to suppliers and contract manufacturers. U.S. Person status as defined by ITAR (if required by product line). PREFERRED QUALIFICATIONS • Experience with microbolometers or other vacuum-packaged MEMS infrared sensors. • Wafer-level packaging experience. • Knowledge of and experience with anti-reflective coatings. • Wafer defect identification and corrective action to improve yield. • Familiarity with MEMS reliability test methods. • Experience managing external foundry and supplier relationships. • Python or LabVIEW scripting for data handling; ISO 9001 quality-system experience. PM18 Compensation details: 00 Yearly Salary PI855c34d6-
Description: SUMMARY Under the direct supervision of the Wafer Management Director, the MEMS Semiconductor and Assembly Process Engineer is responsible for the MEMS sensor die from wafer fabrication through wafer-level packaged and tested die. This fab-less role involves working with multiple external suppliers and spans front-end MEMS processes (thin-film deposition, lithography, metallization, etch, and release) and back-end assembly (wafer-level hermetic vacuum sealing/bonding, wafer probing, dicing, die attach, and wire bonding). Working with suppliers, the engineer will sustain and improve yield on production processes, develop new processes and tools, and qualify them for production manufacturing. The position operates in both cleanroom and non-cleanroom manufacturing environments, supporting Production and Engineering. RESPONSIBILITIES • Own and sustain MEMS fabrication processes (PECVD/sputter deposition, photolithography, DRIE and wet etch, sacrificial release) to yield, Cpk, and cost targets. • Develop and qualify assembly and packaging processes: wafer-to-wafer bonding, getter activation and vacuum sealing, dicing, die attach, and wire bonding. • Characterize bond interfaces and package hermeticity using SAM, IR microscopy, SEM/FIB cross-sections, and long-term vacuum-integrity monitoring. • Design and run DOEs; use SPC and statistical analysis (JMP, Python) to identify drivers of yield loss and drive corrective and preventive actions. • Manage outsourced process steps at external suppliers: define specifications, review vendor data, run qualification lots, and disposition non-conforming material. • Perform root-cause failure analysis; drive containment and permanent fixes through the MRB/CCB process. • Partner with device design, test, reliability, quality, and engineering functions on new-product introduction and design-for-manufacturability reviews. Requirements: BS in Electrical/Mechanical Engineering, Materials Science, Physics, or related field; MS preferred. 5+ years of hands-on process engineering in MEMS or semiconductor wafer fab, with at least 2 years covering assembly/packaging (wafer bonding, die attach, wire bond, or hermetic sealing). Working knowledge of thin-film and etch processes and their interaction with downstream packaging (stress, outgassing, surface preparation for bonding). Demonstrated use of DOE, SPC, and FMEA in a production environment. Comfortable in a cleanroom (gowning required); able to read metrology and failure-analysis data and act on it. Clear written and verbal communication with suppliers, vendors, operators, and cross-functional engineers. Occasional travel to suppliers and contract manufacturers. U.S. Person status as defined by ITAR (if required by product line). PREFERRED QUALIFICATIONS • Experience with microbolometers or other vacuum-packaged MEMS infrared sensors. • Wafer-level packaging experience. • Knowledge of and experience with anti-reflective coatings. • Wafer defect identification and corrective action to improve yield. • Familiarity with MEMS reliability test methods. • Experience managing external foundry and supplier relationships. • Python or LabVIEW scripting for data handling; ISO 9001 quality-system experience. PM18 Compensation details: 00 Yearly Salary PI855c34d6-
Seek Thermal
Santa Barbara, California
Description: SUMMARY Under the general supervision of the Vice President of Product & Marketing, the Product Manager, Fire Products will own product strategy, roadmap planning, lifecycle management, and cross-functional execution for Seek Thermal products serving the fire market. This role translates firefighter, department, channel, and market needs into differentiated product requirements and business priorities, partnering closely with Engineering, Design, Sales, Marketing, Operations, Quality, Customer Service, and Finance from concept through launch and sustaining activities RESPONSIBILITIES • Own the product strategy and roadmap for Seek Thermal fire products, balancing customer needs, market opportunities, competitive dynamics, technical capabilities, cost, and business objectives. • Conduct market assessments and identify opportunities for new products, product innovation, and enhancements across hardware, software, accessories, and the overall user experience. • Build a deep understanding of firefighters, fire departments, distributors, and other fire-market stakeholders through voice-of-customer research, field observation, surveys, prototype evaluations, field testing, and ongoing customer engagement. • Define target users, use cases, value propositions, features, performance requirements, user experience, and packaging in partnership with cross-functional teams. • Drive product planning documentation, including business cases, ROI analyses, MRDs, PRDs, competitive analyses, and launch recommendations. • Partner with Engineering and Design to translate market and user needs into clear product requirements, make informed feature/cost/schedule tradeoffs, and maintain alignment throughout development. • Lead cross-functional product execution for new product development and sustaining initiatives, helping teams deliver to agreed scope, schedule, quality, and cost targets. • Prioritize product requirements and development work across multiple projects and lifecycle stages based on customer impact, strategic value, technical risk, and business priorities. • Monitor competitive fire-market offerings, technology trends, customer feedback, field performance, and market changes; use insights to inform roadmap and product decisions. • Act as the voice of the customer and market in product decisions and work with Engineering, Quality, Operations, and Customer Service to understand and prioritize field issues and sustaining improvements. • Collaborate with Sales and Marketing to develop go-to-market strategies, product messaging, training, sales tools, launch plans, and demand-generation activities for fire products. • Support launches and post-launch performance by defining success metrics, tracking business and product performance, gathering market feedback, and recommending corrective actions or follow-on investments. • Engage directly with customers, channel partners, and the sales team to support product discussions, demonstrations, field evaluations, and market-development activities. • Maintain effective communication with executive leadership and cross-functional stakeholders regarding roadmap priorities, product decisions, risks, tradeoffs, schedules, and performance. • Approximately 20-25% travel may be required for customer visits, field research, industry events, product testing, and internal collaboration. SKILLS, KNOWLEDGE AND ABILITIES • Product management experience with physical products, preferably technically complex hardware/software products or professional-use electronics. • Success managing products through the full lifecycle, from market discovery and definition through development, launch, sustaining, and end-of-life. • Strong customer orientation and ability to convert user needs, behaviors, workflows, and motivations into actionable requirements. • Strong strategic thinking, market analysis, organization, planning, and attention to detail. • Ability to understand technical tradeoffs and risks and work effectively with engineering counterparts. • Ability to develop product and go-to-market strategies and communicate recommendations to technical, commercial, and executive audiences. • Strong analytical and financial acumen, including business cases, ROI, cost tradeoffs, dashboards, and performance metrics. • Ability to lead through influence and collaborate across Engineering, Design, Sales, Marketing, Operations, Quality, Customer Service, and Finance. • Excellent written, verbal, presentation, interpersonal, and problem-solving skills. • Ability to manage multiple concurrent projects and priorities in a fast-paced environment. • Proficient in Microsoft Office tools. Requirements: • Bachelor's degree in Engineering, Business, Marketing, Product Management, or a related technical field; technical degree preferred. • 5+ years of product management or closely related product development experience; hardware and integrated software experience strongly preferred. • Experience in thermal imaging, fire service products, public safety, rugged professional equipment, or adjacent markets is preferred. • Proven product launch experience; global manufacturing, supply chain, or procurement experience is preferred. PM18 Compensation details: 00 Yearly Salary PIc23411f2f6-
Description: SUMMARY Under the general supervision of the Vice President of Product & Marketing, the Product Manager, Fire Products will own product strategy, roadmap planning, lifecycle management, and cross-functional execution for Seek Thermal products serving the fire market. This role translates firefighter, department, channel, and market needs into differentiated product requirements and business priorities, partnering closely with Engineering, Design, Sales, Marketing, Operations, Quality, Customer Service, and Finance from concept through launch and sustaining activities RESPONSIBILITIES • Own the product strategy and roadmap for Seek Thermal fire products, balancing customer needs, market opportunities, competitive dynamics, technical capabilities, cost, and business objectives. • Conduct market assessments and identify opportunities for new products, product innovation, and enhancements across hardware, software, accessories, and the overall user experience. • Build a deep understanding of firefighters, fire departments, distributors, and other fire-market stakeholders through voice-of-customer research, field observation, surveys, prototype evaluations, field testing, and ongoing customer engagement. • Define target users, use cases, value propositions, features, performance requirements, user experience, and packaging in partnership with cross-functional teams. • Drive product planning documentation, including business cases, ROI analyses, MRDs, PRDs, competitive analyses, and launch recommendations. • Partner with Engineering and Design to translate market and user needs into clear product requirements, make informed feature/cost/schedule tradeoffs, and maintain alignment throughout development. • Lead cross-functional product execution for new product development and sustaining initiatives, helping teams deliver to agreed scope, schedule, quality, and cost targets. • Prioritize product requirements and development work across multiple projects and lifecycle stages based on customer impact, strategic value, technical risk, and business priorities. • Monitor competitive fire-market offerings, technology trends, customer feedback, field performance, and market changes; use insights to inform roadmap and product decisions. • Act as the voice of the customer and market in product decisions and work with Engineering, Quality, Operations, and Customer Service to understand and prioritize field issues and sustaining improvements. • Collaborate with Sales and Marketing to develop go-to-market strategies, product messaging, training, sales tools, launch plans, and demand-generation activities for fire products. • Support launches and post-launch performance by defining success metrics, tracking business and product performance, gathering market feedback, and recommending corrective actions or follow-on investments. • Engage directly with customers, channel partners, and the sales team to support product discussions, demonstrations, field evaluations, and market-development activities. • Maintain effective communication with executive leadership and cross-functional stakeholders regarding roadmap priorities, product decisions, risks, tradeoffs, schedules, and performance. • Approximately 20-25% travel may be required for customer visits, field research, industry events, product testing, and internal collaboration. SKILLS, KNOWLEDGE AND ABILITIES • Product management experience with physical products, preferably technically complex hardware/software products or professional-use electronics. • Success managing products through the full lifecycle, from market discovery and definition through development, launch, sustaining, and end-of-life. • Strong customer orientation and ability to convert user needs, behaviors, workflows, and motivations into actionable requirements. • Strong strategic thinking, market analysis, organization, planning, and attention to detail. • Ability to understand technical tradeoffs and risks and work effectively with engineering counterparts. • Ability to develop product and go-to-market strategies and communicate recommendations to technical, commercial, and executive audiences. • Strong analytical and financial acumen, including business cases, ROI, cost tradeoffs, dashboards, and performance metrics. • Ability to lead through influence and collaborate across Engineering, Design, Sales, Marketing, Operations, Quality, Customer Service, and Finance. • Excellent written, verbal, presentation, interpersonal, and problem-solving skills. • Ability to manage multiple concurrent projects and priorities in a fast-paced environment. • Proficient in Microsoft Office tools. Requirements: • Bachelor's degree in Engineering, Business, Marketing, Product Management, or a related technical field; technical degree preferred. • 5+ years of product management or closely related product development experience; hardware and integrated software experience strongly preferred. • Experience in thermal imaging, fire service products, public safety, rugged professional equipment, or adjacent markets is preferred. • Proven product launch experience; global manufacturing, supply chain, or procurement experience is preferred. PM18 Compensation details: 00 Yearly Salary PIc23411f2f6-