Job Description Join Intel and build a better tomorrow. Intel is in the midst of an exciting transformation, with a vision to create and extend computing technology to connect and enrich the lives of every person on Earth. The Ocotillo Technology Fabrication (OTF) Thin Films Module Engineer role is multifaceted. The ideal candidate will have a passion for instrumentation and equipment with the goal of developing a robust manufacturable process module. As an OTF Thin Films Module Engineer you will play an important role in the OTF engineering team. You will be responsible for owning all aspects of one or more of the factory's 300mm toolsets. Your sustaining responsibilities will include the safety and cleanliness of your area and ensuring copy-exact for your toolset. You will also be expected to review the relevant control charts and tool output daily and ensure your toolset and layers remain excursion free. You will be responsible for delivering MOR availability and achieving 100 percent matching for all relevant operations. For new technology start-ups, you will be responsible for tool installations, conversions, qualifications, and sustained matching performance. You will be expected to drive continuous improvement in the health and matching of your toolset(s) by maintaining and driving an improvement roadmap. You will be responsible for leading your tools and area to achieve record tool availability, cycle time, and record low defect densities in support of OTFs factory goals. OTF supports high volume manufacturing. As such, your role may include elements of module-level process development in support of the factory's goal and output. Job responsibilities will include, but are not limited to: Define roadmaps to meet requirements, goals and milestones for a new technology process. Defines and establishes flow, procedures, and equipment configuration for the module. Selects and develops material and equipment for the process to meet quality, yield, reliability, cost, productivity and manufacturability requirements. Plans and conducts experiments to fully characterize the process throughout the development cycle. Drives improvements on quality, yield, reliability, process stability/capability, productivity and safety/ergonomic over variables such as material, method, equipment, environment and operating personnel. Develops solutions to problems utilizing formal education, statistical knowledge, and problem-solving tools. Establishes process control systems for the process module and sustains the module through volume ramp. Trains production/receiving process engineers for transfer to other factories. Transfers process to high volume manufacturing and provide support in new factory start-up as well as install and qualification of the new production lines. Position may require working on a day or night shift as an OSE (on-shift engineer) to support toolset needs and may require a flexible schedule. Qualifications You must possess the below minimum qualifications to be initially considered for this position. Relevant experience can be obtained through schoolwork, classes and project work, internships, military training, and/or work experience. Minimum Requirements: Bachelor's degree with 4+ years of experience OR Master's degree with 2+ years of experience, OR PhD degree with 6+ months of experience in Electrical Engineering, Chemistry, Chemical Engineering, Mechanical or related engineering STEM field. 2+ years of experience in a semiconductor manufacturing or advanced technology development environment. Experience conducting process characterization, data analysis, and statistical problem-solving in a manufacturing environment. Knowledge of equipment matching, qualification, maintenance optimization, and copy-exact manufacturing principles. Preferred qualifications: Semiconductor Foundry experience is a plus. Experience with semiconductor thin film deposition technologies such as CVD, PVD, ALD, PECVD, LPCVD, HDP, or Epitaxy. Demonstrate strong technical and troubleshooting skills. Clean room experience. Demonstrate exceptional customer orientation. Have a strong knowledge of statistics and experimental design; and the ability to apply that knowledge to tool matching, tool qualification, and process development. Demonstrate the ability to work across organizational boundaries including process engineering, integration and yield. Good communication skills with a high tolerance to ambiguous and changing situations Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. Annual Salary Range for jobs which could be performed in the US $116,100.00-$163,800.00 Salary range dependent on a number of factors including location and experience Working Model This role will require an on-site presence. Job posting details (such as work model, location or time type) are subject to change.
08/08/2026
Full time
Job Description Join Intel and build a better tomorrow. Intel is in the midst of an exciting transformation, with a vision to create and extend computing technology to connect and enrich the lives of every person on Earth. The Ocotillo Technology Fabrication (OTF) Thin Films Module Engineer role is multifaceted. The ideal candidate will have a passion for instrumentation and equipment with the goal of developing a robust manufacturable process module. As an OTF Thin Films Module Engineer you will play an important role in the OTF engineering team. You will be responsible for owning all aspects of one or more of the factory's 300mm toolsets. Your sustaining responsibilities will include the safety and cleanliness of your area and ensuring copy-exact for your toolset. You will also be expected to review the relevant control charts and tool output daily and ensure your toolset and layers remain excursion free. You will be responsible for delivering MOR availability and achieving 100 percent matching for all relevant operations. For new technology start-ups, you will be responsible for tool installations, conversions, qualifications, and sustained matching performance. You will be expected to drive continuous improvement in the health and matching of your toolset(s) by maintaining and driving an improvement roadmap. You will be responsible for leading your tools and area to achieve record tool availability, cycle time, and record low defect densities in support of OTFs factory goals. OTF supports high volume manufacturing. As such, your role may include elements of module-level process development in support of the factory's goal and output. Job responsibilities will include, but are not limited to: Define roadmaps to meet requirements, goals and milestones for a new technology process. Defines and establishes flow, procedures, and equipment configuration for the module. Selects and develops material and equipment for the process to meet quality, yield, reliability, cost, productivity and manufacturability requirements. Plans and conducts experiments to fully characterize the process throughout the development cycle. Drives improvements on quality, yield, reliability, process stability/capability, productivity and safety/ergonomic over variables such as material, method, equipment, environment and operating personnel. Develops solutions to problems utilizing formal education, statistical knowledge, and problem-solving tools. Establishes process control systems for the process module and sustains the module through volume ramp. Trains production/receiving process engineers for transfer to other factories. Transfers process to high volume manufacturing and provide support in new factory start-up as well as install and qualification of the new production lines. Position may require working on a day or night shift as an OSE (on-shift engineer) to support toolset needs and may require a flexible schedule. Qualifications You must possess the below minimum qualifications to be initially considered for this position. Relevant experience can be obtained through schoolwork, classes and project work, internships, military training, and/or work experience. Minimum Requirements: Bachelor's degree with 4+ years of experience OR Master's degree with 2+ years of experience, OR PhD degree with 6+ months of experience in Electrical Engineering, Chemistry, Chemical Engineering, Mechanical or related engineering STEM field. 2+ years of experience in a semiconductor manufacturing or advanced technology development environment. Experience conducting process characterization, data analysis, and statistical problem-solving in a manufacturing environment. Knowledge of equipment matching, qualification, maintenance optimization, and copy-exact manufacturing principles. Preferred qualifications: Semiconductor Foundry experience is a plus. Experience with semiconductor thin film deposition technologies such as CVD, PVD, ALD, PECVD, LPCVD, HDP, or Epitaxy. Demonstrate strong technical and troubleshooting skills. Clean room experience. Demonstrate exceptional customer orientation. Have a strong knowledge of statistics and experimental design; and the ability to apply that knowledge to tool matching, tool qualification, and process development. Demonstrate the ability to work across organizational boundaries including process engineering, integration and yield. Good communication skills with a high tolerance to ambiguous and changing situations Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. Annual Salary Range for jobs which could be performed in the US $116,100.00-$163,800.00 Salary range dependent on a number of factors including location and experience Working Model This role will require an on-site presence. Job posting details (such as work model, location or time type) are subject to change.
Job Description Join Intel and build a better tomorrow. Intel is in the midst of an exciting transformation, with a vision to create and extend computing technology to connect and enrich the lives of every person on Earth. The Ocotillo Technology Fabrication (OTF) Module Engineer role is multifaceted. The ideal candidate will have a passion for instrumentation and equipment with the goal of developing a robust manufacturable process module. As an OTF Module Engineer you will play an important role in the OTF engineering team. You will be responsible for owning all aspects of one or more of the factory's 300mm toolsets. Your sustaining responsibilities will include the safety and cleanliness of your area and ensuring copy-exact for your toolset. You will also be expected to review the relevant control charts and tool output daily and ensure your toolset and layers remain excursion free. You will be responsible for delivering MOR availability and achieving 100 percent matching for all relevant operations. For new technology start-ups, you will be responsible for tool installations, conversions, qualifications, and sustained matching performance. You will be expected to drive continuous improvement in the health and matching of your toolset(s) by maintaining and driving an improvement roadmap. You will be responsible for leading your tools and area to achieve record tool availability, cycle time, and record low defect densities in support of OTFs factory goals. OTF supports high volume manufacturing. As such, your role may include elements of module-level process development in support of the factory's goal and output. Job responsibilities will include, but are not limited to: Define roadmaps to meet requirements, goals and milestones for a new technology process. Defines and establishes flow, procedures, and equipment configuration for the module. Selects and develops material and equipment for the process to meet quality, yield, reliability, cost, productivity and manufacturability requirements. Plans and conducts experiments to fully characterize the process throughout the development cycle. Drives improvements on quality, yield, reliability, process stability/capability, productivity and safety/ergonomic over variables such as material, method, equipment, environment and operating personnel. Develops solutions to problems utilizing formal education, statistical knowledge, and problem-solving tools. Establishes process control systems for the process module and sustains the module through volume ramp. Trains production/receiving process engineers for transfer to other factories. Transfers process to high volume manufacturing and provide support in new factory start-up as well as install and qualification of the new production lines. Position may require working on a day or night shift as an OSE (on-shift engineer) to support toolset needs and may require a flexible schedule. Qualifications You must possess the below minimum qualifications to be initially considered for this position. Relevant experience can be obtained through schoolwork, classes and project work, internships, military training, and/or work experience. Minimum Requirements: Bachelor's degree with 5+ years of experience OR Master's degree with 3+ years of experience, OR PhD degree with 6+ months of experience in Electrical Engineering, Chemistry, Chemical Engineering, Mechanical or related engineering STEM field. 2+ years of experience in a manufacturing environment. Preferred qualifications: Semiconductor Foundry experience is a plus. Demonstrate strong technical and troubleshooting skills. Clean room experience. Demonstrate exceptional customer orientation. Have a strong knowledge of statistics and experimental design; and the ability to apply that knowledge to tool matching, tool qualification, and process development. Demonstrate the ability to work across organizational boundaries including process engineering, integration and yield. Good communication skills with a high tolerance to ambiguous and changing situations Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. Annual Salary Range for jobs which could be performed in the US $116,100.00-$163,800.00 Salary range dependent on a number of factors including location and experience Working Model This role will require an on-site presence. Job posting details (such as work model, location or time type) are subject to change.
08/08/2026
Full time
Job Description Join Intel and build a better tomorrow. Intel is in the midst of an exciting transformation, with a vision to create and extend computing technology to connect and enrich the lives of every person on Earth. The Ocotillo Technology Fabrication (OTF) Module Engineer role is multifaceted. The ideal candidate will have a passion for instrumentation and equipment with the goal of developing a robust manufacturable process module. As an OTF Module Engineer you will play an important role in the OTF engineering team. You will be responsible for owning all aspects of one or more of the factory's 300mm toolsets. Your sustaining responsibilities will include the safety and cleanliness of your area and ensuring copy-exact for your toolset. You will also be expected to review the relevant control charts and tool output daily and ensure your toolset and layers remain excursion free. You will be responsible for delivering MOR availability and achieving 100 percent matching for all relevant operations. For new technology start-ups, you will be responsible for tool installations, conversions, qualifications, and sustained matching performance. You will be expected to drive continuous improvement in the health and matching of your toolset(s) by maintaining and driving an improvement roadmap. You will be responsible for leading your tools and area to achieve record tool availability, cycle time, and record low defect densities in support of OTFs factory goals. OTF supports high volume manufacturing. As such, your role may include elements of module-level process development in support of the factory's goal and output. Job responsibilities will include, but are not limited to: Define roadmaps to meet requirements, goals and milestones for a new technology process. Defines and establishes flow, procedures, and equipment configuration for the module. Selects and develops material and equipment for the process to meet quality, yield, reliability, cost, productivity and manufacturability requirements. Plans and conducts experiments to fully characterize the process throughout the development cycle. Drives improvements on quality, yield, reliability, process stability/capability, productivity and safety/ergonomic over variables such as material, method, equipment, environment and operating personnel. Develops solutions to problems utilizing formal education, statistical knowledge, and problem-solving tools. Establishes process control systems for the process module and sustains the module through volume ramp. Trains production/receiving process engineers for transfer to other factories. Transfers process to high volume manufacturing and provide support in new factory start-up as well as install and qualification of the new production lines. Position may require working on a day or night shift as an OSE (on-shift engineer) to support toolset needs and may require a flexible schedule. Qualifications You must possess the below minimum qualifications to be initially considered for this position. Relevant experience can be obtained through schoolwork, classes and project work, internships, military training, and/or work experience. Minimum Requirements: Bachelor's degree with 5+ years of experience OR Master's degree with 3+ years of experience, OR PhD degree with 6+ months of experience in Electrical Engineering, Chemistry, Chemical Engineering, Mechanical or related engineering STEM field. 2+ years of experience in a manufacturing environment. Preferred qualifications: Semiconductor Foundry experience is a plus. Demonstrate strong technical and troubleshooting skills. Clean room experience. Demonstrate exceptional customer orientation. Have a strong knowledge of statistics and experimental design; and the ability to apply that knowledge to tool matching, tool qualification, and process development. Demonstrate the ability to work across organizational boundaries including process engineering, integration and yield. Good communication skills with a high tolerance to ambiguous and changing situations Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. Annual Salary Range for jobs which could be performed in the US $116,100.00-$163,800.00 Salary range dependent on a number of factors including location and experience Working Model This role will require an on-site presence. Job posting details (such as work model, location or time type) are subject to change.
Job Description Shift 5: (Day s hift c ompressed w ork w eek) 6 A M-6 P M ( Sun day - Tues day and alternating Wednesday s ). Shift 7: (Day shift compressed work week) 6 A M-6 P M (Thursday- Satur day and alternating Wednesdays ). About the Role Join Intel's Foundry Technology Manufacturing business unit and play a key role in shaping the future of semiconductor packaging. As a Module Engineer , you will develop and optimize assembly processes and equipment, applying innovative concepts to enable Intel's next-generation foundry packaging platform technologies. You will work at the intersection of engineering, manufacturing, and technology development to deliver world-class packaging solutions for our foundry customers. What You Will Do Design and develop assembly processes and equipment, applying novel engineering concepts to advance Intel's foundry packaging roadmap and platform technologies. Optimize manufacturing efficiency for foundry packages, developing processes that meet rigorous quality, reliability, cost, yield, productivity, and manufacturability requirements specific to foundry customer needs. Define process and equipment specifications using Design of Experiments (DOE) and data analysis principles, documenting innovations and improvements through technical white papers. Develop and maintain equipment used to evaluate silicon and package technologies under simulated field conditions, including thermal cycling, heat, humidity, and dynamic mechanical stress testing. Ensure physical package designs are manufacturable within foundry process flows, and oversee the full cycle of package manufacturing processes, procedures, and production flows. Establish material specifications for contract assemblers and raw material vendors, partnering closely with supplier quality and procurement teams to enforce process compliance and vendor performance standards. Create new reliability screening techniques, acceleration methods, and quality tools to enable early detection of potential packaging quality and reliability risks within the foundry manufacturing environment. Define reliability requirements aligned to foundry customer needs, and influence design decisions, material selection , and process development based on a fundamental understanding of failure mechanisms. Lead continuous improvement initiatives using statistical methods and experimental design to innovate, troubleshoot, and enhance equipment and process performance. Serve as a technical resource for foundry packaging challenges, responding to customer and partner requests and providing consultation on process improvements. Drive standardization across product qualification frameworks, manufacturing quality systems, and methodologies, while actively engaging with packaging technology development and partner engineering teams to assess process maturity and mitigate risks to key product milestones. Qualifications The Minimum qualifications are required to be initially considered for this position . Minimum qualifications listed below would be obtained through a combination of industry relevant job experience, internship experience and / or schoolwork/classes/research. The preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Minimum Qualifications US Citizenship required . Bachelor's degree with 1+ years of experience in one of the following fields: Mechanical Engineering, Materials Science Engineering, Chemical Engineering, Electrical Engineering, or in a STEM related field of study . -OR - Master's degree in Mechanical Engineering, Materials Science Engineering, Chemical Engineering, Electrical Engineering, or in a STEM related field of study . - OR - Associate degree in Mechanical Engineering, Materials Science Engineering, Chemical Engineering, Electrical Engineering, or in a STEM related field of study with 12 + years of experience in an engineering role. 6+ months of experience with Statistical Process Control (SPC) and/or Design of Experiments (DOE) principles. Preferred Qualifications Prior experience working in a technology or semiconductor manufacturing environment. Experience in semiconductor packaging processes, including assembly, materials, or reliability engineering within a foundry context. Why Intel Foundry Technology Manufacturing? Intel's Foundry Technology Manufacturing business unit is at the forefront of delivering advanced packaging solutions for a broad ecosystem of customers. You will collaborate with world-class engineers, contribute to cutting-edge technology development, and directly impact the quality and performance of products that power the global technology industry. This is your opportunity to grow your career while helping define the future of foundry manufacturing. Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. Annual Salary Range for jobs which could be performed in the US $94,300.00-$133,200.00 Salary range dependent on a number of factors including location and experience Working Model This role will require an on-site presence. Job posting details (such as work model, location or time type) are subject to change.
08/04/2026
Full time
Job Description Shift 5: (Day s hift c ompressed w ork w eek) 6 A M-6 P M ( Sun day - Tues day and alternating Wednesday s ). Shift 7: (Day shift compressed work week) 6 A M-6 P M (Thursday- Satur day and alternating Wednesdays ). About the Role Join Intel's Foundry Technology Manufacturing business unit and play a key role in shaping the future of semiconductor packaging. As a Module Engineer , you will develop and optimize assembly processes and equipment, applying innovative concepts to enable Intel's next-generation foundry packaging platform technologies. You will work at the intersection of engineering, manufacturing, and technology development to deliver world-class packaging solutions for our foundry customers. What You Will Do Design and develop assembly processes and equipment, applying novel engineering concepts to advance Intel's foundry packaging roadmap and platform technologies. Optimize manufacturing efficiency for foundry packages, developing processes that meet rigorous quality, reliability, cost, yield, productivity, and manufacturability requirements specific to foundry customer needs. Define process and equipment specifications using Design of Experiments (DOE) and data analysis principles, documenting innovations and improvements through technical white papers. Develop and maintain equipment used to evaluate silicon and package technologies under simulated field conditions, including thermal cycling, heat, humidity, and dynamic mechanical stress testing. Ensure physical package designs are manufacturable within foundry process flows, and oversee the full cycle of package manufacturing processes, procedures, and production flows. Establish material specifications for contract assemblers and raw material vendors, partnering closely with supplier quality and procurement teams to enforce process compliance and vendor performance standards. Create new reliability screening techniques, acceleration methods, and quality tools to enable early detection of potential packaging quality and reliability risks within the foundry manufacturing environment. Define reliability requirements aligned to foundry customer needs, and influence design decisions, material selection , and process development based on a fundamental understanding of failure mechanisms. Lead continuous improvement initiatives using statistical methods and experimental design to innovate, troubleshoot, and enhance equipment and process performance. Serve as a technical resource for foundry packaging challenges, responding to customer and partner requests and providing consultation on process improvements. Drive standardization across product qualification frameworks, manufacturing quality systems, and methodologies, while actively engaging with packaging technology development and partner engineering teams to assess process maturity and mitigate risks to key product milestones. Qualifications The Minimum qualifications are required to be initially considered for this position . Minimum qualifications listed below would be obtained through a combination of industry relevant job experience, internship experience and / or schoolwork/classes/research. The preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Minimum Qualifications US Citizenship required . Bachelor's degree with 1+ years of experience in one of the following fields: Mechanical Engineering, Materials Science Engineering, Chemical Engineering, Electrical Engineering, or in a STEM related field of study . -OR - Master's degree in Mechanical Engineering, Materials Science Engineering, Chemical Engineering, Electrical Engineering, or in a STEM related field of study . - OR - Associate degree in Mechanical Engineering, Materials Science Engineering, Chemical Engineering, Electrical Engineering, or in a STEM related field of study with 12 + years of experience in an engineering role. 6+ months of experience with Statistical Process Control (SPC) and/or Design of Experiments (DOE) principles. Preferred Qualifications Prior experience working in a technology or semiconductor manufacturing environment. Experience in semiconductor packaging processes, including assembly, materials, or reliability engineering within a foundry context. Why Intel Foundry Technology Manufacturing? Intel's Foundry Technology Manufacturing business unit is at the forefront of delivering advanced packaging solutions for a broad ecosystem of customers. You will collaborate with world-class engineers, contribute to cutting-edge technology development, and directly impact the quality and performance of products that power the global technology industry. This is your opportunity to grow your career while helping define the future of foundry manufacturing. Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. Annual Salary Range for jobs which could be performed in the US $94,300.00-$133,200.00 Salary range dependent on a number of factors including location and experience Working Model This role will require an on-site presence. Job posting details (such as work model, location or time type) are subject to change.
Job Description Note: This role requires regular onsite presence to fulfill essential job responsibilities. Drives technology development and enablement for both high volume manufacturing and future technology, provides process integration and equipment solutions, and performs feasibility studies to meet desired device specifications. Leads design and development of technically sophisticated manufacturing processes and/or repair reverse engineering including material selection, parameter optimization, equipment metrology, and system design to enable new product designs and functional requirements. Performs pathfinding activities in support of process and hardware development enabling manufacturing of innovative device architectures and develops roadmaps for technologies enabling future roadmap. Recommends and implements modifications for operating equipment to improve production efficiency, manufacturing techniques, and optimizing production output for existing products. Partners with key equipment and materials suppliers to develop and implement enabling elements of the technology. Performs process technology feasibility studies through theoretical simulations and/or practical engineering methods. Remains updated on relevant industrial process and material manufacturing technical trends and develops view of inherent future Intel process technology needs to push industry forward by partnering with vendor ecosystem to build cost sensitive roadmap. Required Skills and Experience Proven track record of technical ownership and delivery of dry etch process innovations that enabled high volume manufacturing, yield improvement, reliability, or technology node transitions. Expert level understanding of plasma physics, plasma-surface interactions, pattern fidelity, selectivity, defectivity, and profile control for advanced device structures. Demonstrated ability to define long term technical direction and translate research concepts into manufacturable solutions at scale. Extensive experience with advanced data analytics, statistical modeling, and design of experiments (DOE) applied to complex semiconductor process problems. Recognized technical authority who influences decisions across modules, organizations, or technology programs without formal management authority. Preferred Skills and Experience Sustained leadership in developing and deploying next generation dry etch solutions for advanced logic or foundry technologies (e.g., FinFET, GAA, nanosheet architectures). Deep experience with advanced etch technologies, such as: High aspect ratio plasma etch (HARC); Atomic Layer Etch (ALE), EUV patterned layer etch integration; Radical and Vapor phase isotropic etching; Ash and surface treatments; Novel patterning or materials specific etch solutions Demonstrated history of breaking technical bottlenecks that materially impacted product ramp success, cost, or yield across multiple process nodes or product generations. Expertise in advanced materials and device characterization, including SEM, TEM, CD SEM, AFM, XPS, and electrical correlation. Strong publication, patent, or internal technology disclosure record that evidences field level or industry recognized contributions. Ability to mentor senior engineers, set technical standards, and elevate organizational capability across the dry etch discipline. Proven effectiveness in influencing cross functional and external stakeholders, including integration, device, yield, and equipment suppliers, to align on long term technical strategies. Experience shaping multiyear roadmaps for process platforms, tooling strategies, or foundational etch capabilities. Qualifications PhD with 10+ years of directly relevant experience, or Master's degree with 15+ years of experience, in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field. Deep, authoritative expertise in dry etch semiconductor manufacturing, with demonstrated leadership over complex process development or platform level solutions. Experience working in dry etch in a foundry Other Locations US, TX, Austin; US, AZ, Phoenix; US, CA, Folsom; US, CA, Santa Clara Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. Annual Salary Range for jobs which could be performed in the US $201,330.00-$284,230.00 Salary range dependent on a number of factors including location and experience Working Model This role will require an on-site presence. Job posting details (such as work model, location or time type) are subject to change.Position of TrustThis role is a Position of Trust. Should you accept this position, you must consent to and pass an extended Background Investigation, which includes (subject to country law), extended education, SEC sanctions, and additional criminal and civil checks. For internals, this investigation may or may not be completed prior to starting the position. For additional questions, please contact your Recruiter.
08/04/2026
Full time
Job Description Note: This role requires regular onsite presence to fulfill essential job responsibilities. Drives technology development and enablement for both high volume manufacturing and future technology, provides process integration and equipment solutions, and performs feasibility studies to meet desired device specifications. Leads design and development of technically sophisticated manufacturing processes and/or repair reverse engineering including material selection, parameter optimization, equipment metrology, and system design to enable new product designs and functional requirements. Performs pathfinding activities in support of process and hardware development enabling manufacturing of innovative device architectures and develops roadmaps for technologies enabling future roadmap. Recommends and implements modifications for operating equipment to improve production efficiency, manufacturing techniques, and optimizing production output for existing products. Partners with key equipment and materials suppliers to develop and implement enabling elements of the technology. Performs process technology feasibility studies through theoretical simulations and/or practical engineering methods. Remains updated on relevant industrial process and material manufacturing technical trends and develops view of inherent future Intel process technology needs to push industry forward by partnering with vendor ecosystem to build cost sensitive roadmap. Required Skills and Experience Proven track record of technical ownership and delivery of dry etch process innovations that enabled high volume manufacturing, yield improvement, reliability, or technology node transitions. Expert level understanding of plasma physics, plasma-surface interactions, pattern fidelity, selectivity, defectivity, and profile control for advanced device structures. Demonstrated ability to define long term technical direction and translate research concepts into manufacturable solutions at scale. Extensive experience with advanced data analytics, statistical modeling, and design of experiments (DOE) applied to complex semiconductor process problems. Recognized technical authority who influences decisions across modules, organizations, or technology programs without formal management authority. Preferred Skills and Experience Sustained leadership in developing and deploying next generation dry etch solutions for advanced logic or foundry technologies (e.g., FinFET, GAA, nanosheet architectures). Deep experience with advanced etch technologies, such as: High aspect ratio plasma etch (HARC); Atomic Layer Etch (ALE), EUV patterned layer etch integration; Radical and Vapor phase isotropic etching; Ash and surface treatments; Novel patterning or materials specific etch solutions Demonstrated history of breaking technical bottlenecks that materially impacted product ramp success, cost, or yield across multiple process nodes or product generations. Expertise in advanced materials and device characterization, including SEM, TEM, CD SEM, AFM, XPS, and electrical correlation. Strong publication, patent, or internal technology disclosure record that evidences field level or industry recognized contributions. Ability to mentor senior engineers, set technical standards, and elevate organizational capability across the dry etch discipline. Proven effectiveness in influencing cross functional and external stakeholders, including integration, device, yield, and equipment suppliers, to align on long term technical strategies. Experience shaping multiyear roadmaps for process platforms, tooling strategies, or foundational etch capabilities. Qualifications PhD with 10+ years of directly relevant experience, or Master's degree with 15+ years of experience, in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field. Deep, authoritative expertise in dry etch semiconductor manufacturing, with demonstrated leadership over complex process development or platform level solutions. Experience working in dry etch in a foundry Other Locations US, TX, Austin; US, AZ, Phoenix; US, CA, Folsom; US, CA, Santa Clara Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. Annual Salary Range for jobs which could be performed in the US $201,330.00-$284,230.00 Salary range dependent on a number of factors including location and experience Working Model This role will require an on-site presence. Job posting details (such as work model, location or time type) are subject to change.Position of TrustThis role is a Position of Trust. Should you accept this position, you must consent to and pass an extended Background Investigation, which includes (subject to country law), extended education, SEC sanctions, and additional criminal and civil checks. For internals, this investigation may or may not be completed prior to starting the position. For additional questions, please contact your Recruiter.
Job Description Note: This role requires regular onsite presence to fulfill essential job responsibilities. Drives technology development and enablement for both high volume manufacturing and future technology, provides process integration and equipment solutions, and performs feasibility studies to meet desired device specifications. Leads design and development of technically sophisticated manufacturing processes and/or repair reverse engineering including material selection, parameter optimization, equipment metrology, and system design to enable new product designs and functional requirements. Performs pathfinding activities in support of process and hardware development enabling manufacturing of innovative device architectures and develops roadmaps for technologies enabling future roadmap. Recommends and implements modifications for operating equipment to improve production efficiency, manufacturing techniques, and optimizing production output for existing products. Partners with key equipment and materials suppliers to develop and implement enabling elements of the technology. Performs process technology feasibility studies through theoretical simulations and/or practical engineering methods. Remains updated on relevant industrial process and material manufacturing technical trends and develops view of inherent future Intel process technology needs to push industry forward by partnering with vendor ecosystem to build cost sensitive roadmap. Required Skills and Experience Proven track record of technical ownership and delivery of dry etch process innovations that enabled high volume manufacturing, yield improvement, reliability, or technology node transitions. Expert level understanding of plasma physics, plasma-surface interactions, pattern fidelity, selectivity, defectivity, and profile control for advanced device structures. Demonstrated ability to define long term technical direction and translate research concepts into manufacturable solutions at scale. Extensive experience with advanced data analytics, statistical modeling, and design of experiments (DOE) applied to complex semiconductor process problems. Recognized technical authority who influences decisions across modules, organizations, or technology programs without formal management authority. Preferred Skills and Experience Sustained leadership in developing and deploying next generation dry etch solutions for advanced logic or foundry technologies (e.g., FinFET, GAA, nanosheet architectures). Deep experience with advanced etch technologies, such as: High aspect ratio plasma etch (HARC); Atomic Layer Etch (ALE), EUV patterned layer etch integration; Radical and Vapor phase isotropic etching; Ash and surface treatments; Novel patterning or materials specific etch solutions Demonstrated history of breaking technical bottlenecks that materially impacted product ramp success, cost, or yield across multiple process nodes or product generations. Expertise in advanced materials and device characterization, including SEM, TEM, CD SEM, AFM, XPS, and electrical correlation. Strong publication, patent, or internal technology disclosure record that evidences field level or industry recognized contributions. Ability to mentor senior engineers, set technical standards, and elevate organizational capability across the dry etch discipline. Proven effectiveness in influencing cross functional and external stakeholders, including integration, device, yield, and equipment suppliers, to align on long term technical strategies. Experience shaping multiyear roadmaps for process platforms, tooling strategies, or foundational etch capabilities. Qualifications PhD with 10+ years of directly relevant experience, or Master's degree with 15+ years of experience, in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field. Deep, authoritative expertise in dry etch semiconductor manufacturing, with demonstrated leadership over complex process development or platform level solutions. Experience working in dry etch in a foundry Other Locations US, TX, Austin; US, AZ, Phoenix; US, CA, Folsom; US, CA, Santa Clara Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. Annual Salary Range for jobs which could be performed in the US $201,330.00-$284,230.00 Salary range dependent on a number of factors including location and experience Working Model This role will require an on-site presence. Job posting details (such as work model, location or time type) are subject to change.Position of TrustThis role is a Position of Trust. Should you accept this position, you must consent to and pass an extended Background Investigation, which includes (subject to country law), extended education, SEC sanctions, and additional criminal and civil checks. For internals, this investigation may or may not be completed prior to starting the position. For additional questions, please contact your Recruiter.
08/04/2026
Full time
Job Description Note: This role requires regular onsite presence to fulfill essential job responsibilities. Drives technology development and enablement for both high volume manufacturing and future technology, provides process integration and equipment solutions, and performs feasibility studies to meet desired device specifications. Leads design and development of technically sophisticated manufacturing processes and/or repair reverse engineering including material selection, parameter optimization, equipment metrology, and system design to enable new product designs and functional requirements. Performs pathfinding activities in support of process and hardware development enabling manufacturing of innovative device architectures and develops roadmaps for technologies enabling future roadmap. Recommends and implements modifications for operating equipment to improve production efficiency, manufacturing techniques, and optimizing production output for existing products. Partners with key equipment and materials suppliers to develop and implement enabling elements of the technology. Performs process technology feasibility studies through theoretical simulations and/or practical engineering methods. Remains updated on relevant industrial process and material manufacturing technical trends and develops view of inherent future Intel process technology needs to push industry forward by partnering with vendor ecosystem to build cost sensitive roadmap. Required Skills and Experience Proven track record of technical ownership and delivery of dry etch process innovations that enabled high volume manufacturing, yield improvement, reliability, or technology node transitions. Expert level understanding of plasma physics, plasma-surface interactions, pattern fidelity, selectivity, defectivity, and profile control for advanced device structures. Demonstrated ability to define long term technical direction and translate research concepts into manufacturable solutions at scale. Extensive experience with advanced data analytics, statistical modeling, and design of experiments (DOE) applied to complex semiconductor process problems. Recognized technical authority who influences decisions across modules, organizations, or technology programs without formal management authority. Preferred Skills and Experience Sustained leadership in developing and deploying next generation dry etch solutions for advanced logic or foundry technologies (e.g., FinFET, GAA, nanosheet architectures). Deep experience with advanced etch technologies, such as: High aspect ratio plasma etch (HARC); Atomic Layer Etch (ALE), EUV patterned layer etch integration; Radical and Vapor phase isotropic etching; Ash and surface treatments; Novel patterning or materials specific etch solutions Demonstrated history of breaking technical bottlenecks that materially impacted product ramp success, cost, or yield across multiple process nodes or product generations. Expertise in advanced materials and device characterization, including SEM, TEM, CD SEM, AFM, XPS, and electrical correlation. Strong publication, patent, or internal technology disclosure record that evidences field level or industry recognized contributions. Ability to mentor senior engineers, set technical standards, and elevate organizational capability across the dry etch discipline. Proven effectiveness in influencing cross functional and external stakeholders, including integration, device, yield, and equipment suppliers, to align on long term technical strategies. Experience shaping multiyear roadmaps for process platforms, tooling strategies, or foundational etch capabilities. Qualifications PhD with 10+ years of directly relevant experience, or Master's degree with 15+ years of experience, in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field. Deep, authoritative expertise in dry etch semiconductor manufacturing, with demonstrated leadership over complex process development or platform level solutions. Experience working in dry etch in a foundry Other Locations US, TX, Austin; US, AZ, Phoenix; US, CA, Folsom; US, CA, Santa Clara Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. Annual Salary Range for jobs which could be performed in the US $201,330.00-$284,230.00 Salary range dependent on a number of factors including location and experience Working Model This role will require an on-site presence. Job posting details (such as work model, location or time type) are subject to change.Position of TrustThis role is a Position of Trust. Should you accept this position, you must consent to and pass an extended Background Investigation, which includes (subject to country law), extended education, SEC sanctions, and additional criminal and civil checks. For internals, this investigation may or may not be completed prior to starting the position. For additional questions, please contact your Recruiter.
Job Description Note: This role requires regular onsite presence to fulfill essential job responsibilities. Drives technology development and enablement for both high volume manufacturing and future technology, provides process integration and equipment solutions, and performs feasibility studies to meet desired device specifications. Leads design and development of technically sophisticated manufacturing processes and/or repair reverse engineering including material selection, parameter optimization, equipment metrology, and system design to enable new product designs and functional requirements. Performs pathfinding activities in support of process and hardware development enabling manufacturing of innovative device architectures and develops roadmaps for technologies enabling future roadmap. Recommends and implements modifications for operating equipment to improve production efficiency, manufacturing techniques, and optimizing production output for existing products. Partners with key equipment and materials suppliers to develop and implement enabling elements of the technology. Performs process technology feasibility studies through theoretical simulations and/or practical engineering methods. Remains updated on relevant industrial process and material manufacturing technical trends and develops view of inherent future Intel process technology needs to push industry forward by partnering with vendor ecosystem to build cost sensitive roadmap. Required Skills and Experience Proven track record of technical ownership and delivery of dry etch process innovations that enabled high volume manufacturing, yield improvement, reliability, or technology node transitions. Expert level understanding of plasma physics, plasma-surface interactions, pattern fidelity, selectivity, defectivity, and profile control for advanced device structures. Demonstrated ability to define long term technical direction and translate research concepts into manufacturable solutions at scale. Extensive experience with advanced data analytics, statistical modeling, and design of experiments (DOE) applied to complex semiconductor process problems. Recognized technical authority who influences decisions across modules, organizations, or technology programs without formal management authority. Preferred Skills and Experience Sustained leadership in developing and deploying next generation dry etch solutions for advanced logic or foundry technologies (e.g., FinFET, GAA, nanosheet architectures). Deep experience with advanced etch technologies, such as: High aspect ratio plasma etch (HARC); Atomic Layer Etch (ALE), EUV patterned layer etch integration; Radical and Vapor phase isotropic etching; Ash and surface treatments; Novel patterning or materials specific etch solutions Demonstrated history of breaking technical bottlenecks that materially impacted product ramp success, cost, or yield across multiple process nodes or product generations. Expertise in advanced materials and device characterization, including SEM, TEM, CD SEM, AFM, XPS, and electrical correlation. Strong publication, patent, or internal technology disclosure record that evidences field level or industry recognized contributions. Ability to mentor senior engineers, set technical standards, and elevate organizational capability across the dry etch discipline. Proven effectiveness in influencing cross functional and external stakeholders, including integration, device, yield, and equipment suppliers, to align on long term technical strategies. Experience shaping multiyear roadmaps for process platforms, tooling strategies, or foundational etch capabilities. Qualifications PhD with 10+ years of directly relevant experience, or Master's degree with 15+ years of experience, in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field. Deep, authoritative expertise in dry etch semiconductor manufacturing, with demonstrated leadership over complex process development or platform level solutions. Experience working in dry etch in a foundry Other Locations US, TX, Austin; US, AZ, Phoenix; US, CA, Folsom; US, CA, Santa Clara Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. Annual Salary Range for jobs which could be performed in the US $201,330.00-$284,230.00 Salary range dependent on a number of factors including location and experience Working Model This role will require an on-site presence. Job posting details (such as work model, location or time type) are subject to change.Position of TrustThis role is a Position of Trust. Should you accept this position, you must consent to and pass an extended Background Investigation, which includes (subject to country law), extended education, SEC sanctions, and additional criminal and civil checks. For internals, this investigation may or may not be completed prior to starting the position. For additional questions, please contact your Recruiter.
08/04/2026
Full time
Job Description Note: This role requires regular onsite presence to fulfill essential job responsibilities. Drives technology development and enablement for both high volume manufacturing and future technology, provides process integration and equipment solutions, and performs feasibility studies to meet desired device specifications. Leads design and development of technically sophisticated manufacturing processes and/or repair reverse engineering including material selection, parameter optimization, equipment metrology, and system design to enable new product designs and functional requirements. Performs pathfinding activities in support of process and hardware development enabling manufacturing of innovative device architectures and develops roadmaps for technologies enabling future roadmap. Recommends and implements modifications for operating equipment to improve production efficiency, manufacturing techniques, and optimizing production output for existing products. Partners with key equipment and materials suppliers to develop and implement enabling elements of the technology. Performs process technology feasibility studies through theoretical simulations and/or practical engineering methods. Remains updated on relevant industrial process and material manufacturing technical trends and develops view of inherent future Intel process technology needs to push industry forward by partnering with vendor ecosystem to build cost sensitive roadmap. Required Skills and Experience Proven track record of technical ownership and delivery of dry etch process innovations that enabled high volume manufacturing, yield improvement, reliability, or technology node transitions. Expert level understanding of plasma physics, plasma-surface interactions, pattern fidelity, selectivity, defectivity, and profile control for advanced device structures. Demonstrated ability to define long term technical direction and translate research concepts into manufacturable solutions at scale. Extensive experience with advanced data analytics, statistical modeling, and design of experiments (DOE) applied to complex semiconductor process problems. Recognized technical authority who influences decisions across modules, organizations, or technology programs without formal management authority. Preferred Skills and Experience Sustained leadership in developing and deploying next generation dry etch solutions for advanced logic or foundry technologies (e.g., FinFET, GAA, nanosheet architectures). Deep experience with advanced etch technologies, such as: High aspect ratio plasma etch (HARC); Atomic Layer Etch (ALE), EUV patterned layer etch integration; Radical and Vapor phase isotropic etching; Ash and surface treatments; Novel patterning or materials specific etch solutions Demonstrated history of breaking technical bottlenecks that materially impacted product ramp success, cost, or yield across multiple process nodes or product generations. Expertise in advanced materials and device characterization, including SEM, TEM, CD SEM, AFM, XPS, and electrical correlation. Strong publication, patent, or internal technology disclosure record that evidences field level or industry recognized contributions. Ability to mentor senior engineers, set technical standards, and elevate organizational capability across the dry etch discipline. Proven effectiveness in influencing cross functional and external stakeholders, including integration, device, yield, and equipment suppliers, to align on long term technical strategies. Experience shaping multiyear roadmaps for process platforms, tooling strategies, or foundational etch capabilities. Qualifications PhD with 10+ years of directly relevant experience, or Master's degree with 15+ years of experience, in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field. Deep, authoritative expertise in dry etch semiconductor manufacturing, with demonstrated leadership over complex process development or platform level solutions. Experience working in dry etch in a foundry Other Locations US, TX, Austin; US, AZ, Phoenix; US, CA, Folsom; US, CA, Santa Clara Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. Annual Salary Range for jobs which could be performed in the US $201,330.00-$284,230.00 Salary range dependent on a number of factors including location and experience Working Model This role will require an on-site presence. Job posting details (such as work model, location or time type) are subject to change.Position of TrustThis role is a Position of Trust. Should you accept this position, you must consent to and pass an extended Background Investigation, which includes (subject to country law), extended education, SEC sanctions, and additional criminal and civil checks. For internals, this investigation may or may not be completed prior to starting the position. For additional questions, please contact your Recruiter.
Job Description At the heart of Intel's groundbreaking product advancements, the Logic Technology Development (LTD) organization is a powerhouse of process technology innovation. Our relentless pursuit of excellence and innovation propels Intel's Foundry strategy, ensuring that we not only meet but exceed the aspirations of our global customers. As we continue to lead the semiconductor industry, we are enhancing our technological capabilities to guarantee the triumph of our customers' diverse and ambitious projects. Your Role in Intel's Foundry Revolution: As a Foundry Technology Development - Staff Yield Engineer, you will be at the forefront of Intel's collaborative journey with our foundry partners. Your expertise will be pivotal in guiding our customers through the intricate journey of product development, starting from testing and validation to New Product Introduction (NPI) phase to the High Volume Manufacturing (HVM). You will play a vital role in overseeing the wafer manufacturing process and ensuring a seamless transition into volume production. This is a unique opportunity to be part of a team that is not just participating in the industry but actively shaping its future. We are seeking a broad range of semiconductor expertise across the range of foundry technology development. Based on experience, potential areas may include: Serve as the yield point of contact through the cycle of foundry product development, from design to initial High Volume Manufacturing (HVM) Define yield goal and roadmap for foundry customer silicon by collaborating with Intel Foundry Services (IFS), Technology Development (TD), and Product Integration Collaborate with TD Process Integration, Device, Defect Metro, and Lab to identify yield detractors and yield enhancement opportunities, specifically for foundry customer silicon Provide yield / defect density projection for different types of customer silicon, including test chips, shuttles, and products Track inline process and non-process changes to incorporate the changepoints into yield prediction model Develop yield models to identify potential parametric and defective loss components and support Process Integration, Device and Module teams to develop projects to eliminate systematic yield losses Support yield analysis of logic, SRAM, and other types of devices on foundry customer silicon Establish correlations between critical inline metrics and yield for better inline control and end of line projection Engage side-by-side with Product Integration and Device teams in customer silicon execution, such as skew split planning and DOE Lead investigations and root-causing on yield signals for foundry customer silicon Identify opportunities to optimize foundry product development operational systems and methodologies to improve efficiency and standardization Work as the technical interface between foundry and both internal stakeholders and external customers Qualifications Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research. Minimum Qualifications: Bachelor's Degree in Electrical Engineering, Materials Science, Physics, Chemical Engineering or other relevant engineering or physical science discipline with 6+ years of relevant work experience OR Master's Degree in Electrical Engineering, Materials Science, Physics, Chemical Engineering or other relevant engineering or physical science with 4+ years of relevant work experience OR PhD Degree in Electrical Engineering, Materials Science, Physics, Chemical Engineering or other relevant engineering or physical science discipline with 2+ years of industry experience The years of relevant work experience listed above must be in the field in at least one of the following areas: Semiconductor yield engineering Analysis of yield post silicon yield signal and root-causing Preferred Qualifications: 3+ years of semiconductor direct yield analysis and engineering experience 3+ direct experience in yield pareto, projection and yield roadmap construction 3+ years of experience within a foundry team, or foundry customer yield collaboration 3+ years of experience interpreting product data including inline, e-test and SORT data, finding failure root cause and inline indicator and driving for solutions Knowledge on inline inspection method, electrical test structures and SORT programs Exposure to fabless design house product development Foundry customer service experience and evidence of strong customer orientation. For information on Intel's immigration sponsorship guidelines, please see Intel U.S. Immigration Sponsorship Information Other Locations US, TX, Austin; US, AZ, Phoenix; US, CA, Folsom; US, CA, Santa Clara Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. Annual Salary Range for jobs which could be performed in the US $148,100.00-$209,100.00 Salary range dependent on a number of factors including location and experience Working Model This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. Job posting details (such as work model, location or time type) are subject to change.
08/03/2026
Full time
Job Description At the heart of Intel's groundbreaking product advancements, the Logic Technology Development (LTD) organization is a powerhouse of process technology innovation. Our relentless pursuit of excellence and innovation propels Intel's Foundry strategy, ensuring that we not only meet but exceed the aspirations of our global customers. As we continue to lead the semiconductor industry, we are enhancing our technological capabilities to guarantee the triumph of our customers' diverse and ambitious projects. Your Role in Intel's Foundry Revolution: As a Foundry Technology Development - Staff Yield Engineer, you will be at the forefront of Intel's collaborative journey with our foundry partners. Your expertise will be pivotal in guiding our customers through the intricate journey of product development, starting from testing and validation to New Product Introduction (NPI) phase to the High Volume Manufacturing (HVM). You will play a vital role in overseeing the wafer manufacturing process and ensuring a seamless transition into volume production. This is a unique opportunity to be part of a team that is not just participating in the industry but actively shaping its future. We are seeking a broad range of semiconductor expertise across the range of foundry technology development. Based on experience, potential areas may include: Serve as the yield point of contact through the cycle of foundry product development, from design to initial High Volume Manufacturing (HVM) Define yield goal and roadmap for foundry customer silicon by collaborating with Intel Foundry Services (IFS), Technology Development (TD), and Product Integration Collaborate with TD Process Integration, Device, Defect Metro, and Lab to identify yield detractors and yield enhancement opportunities, specifically for foundry customer silicon Provide yield / defect density projection for different types of customer silicon, including test chips, shuttles, and products Track inline process and non-process changes to incorporate the changepoints into yield prediction model Develop yield models to identify potential parametric and defective loss components and support Process Integration, Device and Module teams to develop projects to eliminate systematic yield losses Support yield analysis of logic, SRAM, and other types of devices on foundry customer silicon Establish correlations between critical inline metrics and yield for better inline control and end of line projection Engage side-by-side with Product Integration and Device teams in customer silicon execution, such as skew split planning and DOE Lead investigations and root-causing on yield signals for foundry customer silicon Identify opportunities to optimize foundry product development operational systems and methodologies to improve efficiency and standardization Work as the technical interface between foundry and both internal stakeholders and external customers Qualifications Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research. Minimum Qualifications: Bachelor's Degree in Electrical Engineering, Materials Science, Physics, Chemical Engineering or other relevant engineering or physical science discipline with 6+ years of relevant work experience OR Master's Degree in Electrical Engineering, Materials Science, Physics, Chemical Engineering or other relevant engineering or physical science with 4+ years of relevant work experience OR PhD Degree in Electrical Engineering, Materials Science, Physics, Chemical Engineering or other relevant engineering or physical science discipline with 2+ years of industry experience The years of relevant work experience listed above must be in the field in at least one of the following areas: Semiconductor yield engineering Analysis of yield post silicon yield signal and root-causing Preferred Qualifications: 3+ years of semiconductor direct yield analysis and engineering experience 3+ direct experience in yield pareto, projection and yield roadmap construction 3+ years of experience within a foundry team, or foundry customer yield collaboration 3+ years of experience interpreting product data including inline, e-test and SORT data, finding failure root cause and inline indicator and driving for solutions Knowledge on inline inspection method, electrical test structures and SORT programs Exposure to fabless design house product development Foundry customer service experience and evidence of strong customer orientation. For information on Intel's immigration sponsorship guidelines, please see Intel U.S. Immigration Sponsorship Information Other Locations US, TX, Austin; US, AZ, Phoenix; US, CA, Folsom; US, CA, Santa Clara Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. Annual Salary Range for jobs which could be performed in the US $148,100.00-$209,100.00 Salary range dependent on a number of factors including location and experience Working Model This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. Job posting details (such as work model, location or time type) are subject to change.
Job Description At the heart of Intel's groundbreaking product advancements, the Logic Technology Development (LTD) organization is a powerhouse of process technology innovation. Our relentless pursuit of excellence and innovation propels Intel's Foundry strategy, ensuring that we not only meet but exceed the aspirations of our global customers. As we continue to lead the semiconductor industry, we are enhancing our technological capabilities to guarantee the triumph of our customers' diverse and ambitious projects. Your Role in Intel's Foundry Revolution: As a Foundry Technology Development - Staff Yield Engineer, you will be at the forefront of Intel's collaborative journey with our foundry partners. Your expertise will be pivotal in guiding our customers through the intricate journey of product development, starting from testing and validation to New Product Introduction (NPI) phase to the High Volume Manufacturing (HVM). You will play a vital role in overseeing the wafer manufacturing process and ensuring a seamless transition into volume production. This is a unique opportunity to be part of a team that is not just participating in the industry but actively shaping its future. We are seeking a broad range of semiconductor expertise across the range of foundry technology development. Based on experience, potential areas may include: Serve as the yield point of contact through the cycle of foundry product development, from design to initial High Volume Manufacturing (HVM) Define yield goal and roadmap for foundry customer silicon by collaborating with Intel Foundry Services (IFS), Technology Development (TD), and Product Integration Collaborate with TD Process Integration, Device, Defect Metro, and Lab to identify yield detractors and yield enhancement opportunities, specifically for foundry customer silicon Provide yield / defect density projection for different types of customer silicon, including test chips, shuttles, and products Track inline process and non-process changes to incorporate the changepoints into yield prediction model Develop yield models to identify potential parametric and defective loss components and support Process Integration, Device and Module teams to develop projects to eliminate systematic yield losses Support yield analysis of logic, SRAM, and other types of devices on foundry customer silicon Establish correlations between critical inline metrics and yield for better inline control and end of line projection Engage side-by-side with Product Integration and Device teams in customer silicon execution, such as skew split planning and DOE Lead investigations and root-causing on yield signals for foundry customer silicon Identify opportunities to optimize foundry product development operational systems and methodologies to improve efficiency and standardization Work as the technical interface between foundry and both internal stakeholders and external customers Qualifications Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research. Minimum Qualifications: Bachelor's Degree in Electrical Engineering, Materials Science, Physics, Chemical Engineering or other relevant engineering or physical science discipline with 6+ years of relevant work experience OR Master's Degree in Electrical Engineering, Materials Science, Physics, Chemical Engineering or other relevant engineering or physical science with 4+ years of relevant work experience OR PhD Degree in Electrical Engineering, Materials Science, Physics, Chemical Engineering or other relevant engineering or physical science discipline with 2+ years of industry experience The years of relevant work experience listed above must be in the field in at least one of the following areas: Semiconductor yield engineering Analysis of yield post silicon yield signal and root-causing Preferred Qualifications: 3+ years of semiconductor direct yield analysis and engineering experience 3+ direct experience in yield pareto, projection and yield roadmap construction 3+ years of experience within a foundry team, or foundry customer yield collaboration 3+ years of experience interpreting product data including inline, e-test and SORT data, finding failure root cause and inline indicator and driving for solutions Knowledge on inline inspection method, electrical test structures and SORT programs Exposure to fabless design house product development Foundry customer service experience and evidence of strong customer orientation. For information on Intel's immigration sponsorship guidelines, please see Intel U.S. Immigration Sponsorship Information Other Locations US, TX, Austin; US, AZ, Phoenix; US, CA, Folsom; US, CA, Santa Clara Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. Annual Salary Range for jobs which could be performed in the US $148,100.00-$209,100.00 Salary range dependent on a number of factors including location and experience Working Model This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. Job posting details (such as work model, location or time type) are subject to change.
08/03/2026
Full time
Job Description At the heart of Intel's groundbreaking product advancements, the Logic Technology Development (LTD) organization is a powerhouse of process technology innovation. Our relentless pursuit of excellence and innovation propels Intel's Foundry strategy, ensuring that we not only meet but exceed the aspirations of our global customers. As we continue to lead the semiconductor industry, we are enhancing our technological capabilities to guarantee the triumph of our customers' diverse and ambitious projects. Your Role in Intel's Foundry Revolution: As a Foundry Technology Development - Staff Yield Engineer, you will be at the forefront of Intel's collaborative journey with our foundry partners. Your expertise will be pivotal in guiding our customers through the intricate journey of product development, starting from testing and validation to New Product Introduction (NPI) phase to the High Volume Manufacturing (HVM). You will play a vital role in overseeing the wafer manufacturing process and ensuring a seamless transition into volume production. This is a unique opportunity to be part of a team that is not just participating in the industry but actively shaping its future. We are seeking a broad range of semiconductor expertise across the range of foundry technology development. Based on experience, potential areas may include: Serve as the yield point of contact through the cycle of foundry product development, from design to initial High Volume Manufacturing (HVM) Define yield goal and roadmap for foundry customer silicon by collaborating with Intel Foundry Services (IFS), Technology Development (TD), and Product Integration Collaborate with TD Process Integration, Device, Defect Metro, and Lab to identify yield detractors and yield enhancement opportunities, specifically for foundry customer silicon Provide yield / defect density projection for different types of customer silicon, including test chips, shuttles, and products Track inline process and non-process changes to incorporate the changepoints into yield prediction model Develop yield models to identify potential parametric and defective loss components and support Process Integration, Device and Module teams to develop projects to eliminate systematic yield losses Support yield analysis of logic, SRAM, and other types of devices on foundry customer silicon Establish correlations between critical inline metrics and yield for better inline control and end of line projection Engage side-by-side with Product Integration and Device teams in customer silicon execution, such as skew split planning and DOE Lead investigations and root-causing on yield signals for foundry customer silicon Identify opportunities to optimize foundry product development operational systems and methodologies to improve efficiency and standardization Work as the technical interface between foundry and both internal stakeholders and external customers Qualifications Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research. Minimum Qualifications: Bachelor's Degree in Electrical Engineering, Materials Science, Physics, Chemical Engineering or other relevant engineering or physical science discipline with 6+ years of relevant work experience OR Master's Degree in Electrical Engineering, Materials Science, Physics, Chemical Engineering or other relevant engineering or physical science with 4+ years of relevant work experience OR PhD Degree in Electrical Engineering, Materials Science, Physics, Chemical Engineering or other relevant engineering or physical science discipline with 2+ years of industry experience The years of relevant work experience listed above must be in the field in at least one of the following areas: Semiconductor yield engineering Analysis of yield post silicon yield signal and root-causing Preferred Qualifications: 3+ years of semiconductor direct yield analysis and engineering experience 3+ direct experience in yield pareto, projection and yield roadmap construction 3+ years of experience within a foundry team, or foundry customer yield collaboration 3+ years of experience interpreting product data including inline, e-test and SORT data, finding failure root cause and inline indicator and driving for solutions Knowledge on inline inspection method, electrical test structures and SORT programs Exposure to fabless design house product development Foundry customer service experience and evidence of strong customer orientation. For information on Intel's immigration sponsorship guidelines, please see Intel U.S. Immigration Sponsorship Information Other Locations US, TX, Austin; US, AZ, Phoenix; US, CA, Folsom; US, CA, Santa Clara Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. Annual Salary Range for jobs which could be performed in the US $148,100.00-$209,100.00 Salary range dependent on a number of factors including location and experience Working Model This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. Job posting details (such as work model, location or time type) are subject to change.
Job Description At the heart of Intel's groundbreaking product advancements, the Logic Technology Development (LTD) organization is a powerhouse of process technology innovation. Our relentless pursuit of excellence and innovation propels Intel's Foundry strategy, ensuring that we not only meet but exceed the aspirations of our global customers. As we continue to lead the semiconductor industry, we are enhancing our technological capabilities to guarantee the triumph of our customers' diverse and ambitious projects. Your Role in Intel's Foundry Revolution: As a Foundry Technology Development - Staff Yield Engineer, you will be at the forefront of Intel's collaborative journey with our foundry partners. Your expertise will be pivotal in guiding our customers through the intricate journey of product development, starting from testing and validation to New Product Introduction (NPI) phase to the High Volume Manufacturing (HVM). You will play a vital role in overseeing the wafer manufacturing process and ensuring a seamless transition into volume production. This is a unique opportunity to be part of a team that is not just participating in the industry but actively shaping its future. We are seeking a broad range of semiconductor expertise across the range of foundry technology development. Based on experience, potential areas may include: Serve as the yield point of contact through the cycle of foundry product development, from design to initial High Volume Manufacturing (HVM) Define yield goal and roadmap for foundry customer silicon by collaborating with Intel Foundry Services (IFS), Technology Development (TD), and Product Integration Collaborate with TD Process Integration, Device, Defect Metro, and Lab to identify yield detractors and yield enhancement opportunities, specifically for foundry customer silicon Provide yield / defect density projection for different types of customer silicon, including test chips, shuttles, and products Track inline process and non-process changes to incorporate the changepoints into yield prediction model Develop yield models to identify potential parametric and defective loss components and support Process Integration, Device and Module teams to develop projects to eliminate systematic yield losses Support yield analysis of logic, SRAM, and other types of devices on foundry customer silicon Establish correlations between critical inline metrics and yield for better inline control and end of line projection Engage side-by-side with Product Integration and Device teams in customer silicon execution, such as skew split planning and DOE Lead investigations and root-causing on yield signals for foundry customer silicon Identify opportunities to optimize foundry product development operational systems and methodologies to improve efficiency and standardization Work as the technical interface between foundry and both internal stakeholders and external customers Qualifications Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research. Minimum Qualifications: Bachelor's Degree in Electrical Engineering, Materials Science, Physics, Chemical Engineering or other relevant engineering or physical science discipline with 6+ years of relevant work experience OR Master's Degree in Electrical Engineering, Materials Science, Physics, Chemical Engineering or other relevant engineering or physical science with 4+ years of relevant work experience OR PhD Degree in Electrical Engineering, Materials Science, Physics, Chemical Engineering or other relevant engineering or physical science discipline with 2+ years of industry experience The years of relevant work experience listed above must be in the field in at least one of the following areas: Semiconductor yield engineering Analysis of yield post silicon yield signal and root-causing Preferred Qualifications: 3+ years of semiconductor direct yield analysis and engineering experience 3+ direct experience in yield pareto, projection and yield roadmap construction 3+ years of experience within a foundry team, or foundry customer yield collaboration 3+ years of experience interpreting product data including inline, e-test and SORT data, finding failure root cause and inline indicator and driving for solutions Knowledge on inline inspection method, electrical test structures and SORT programs Exposure to fabless design house product development Foundry customer service experience and evidence of strong customer orientation. For information on Intel's immigration sponsorship guidelines, please see Intel U.S. Immigration Sponsorship Information Other Locations US, TX, Austin; US, AZ, Phoenix; US, CA, Folsom; US, CA, Santa Clara Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. Annual Salary Range for jobs which could be performed in the US $148,100.00-$209,100.00 Salary range dependent on a number of factors including location and experience Working Model This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. Job posting details (such as work model, location or time type) are subject to change.
08/03/2026
Full time
Job Description At the heart of Intel's groundbreaking product advancements, the Logic Technology Development (LTD) organization is a powerhouse of process technology innovation. Our relentless pursuit of excellence and innovation propels Intel's Foundry strategy, ensuring that we not only meet but exceed the aspirations of our global customers. As we continue to lead the semiconductor industry, we are enhancing our technological capabilities to guarantee the triumph of our customers' diverse and ambitious projects. Your Role in Intel's Foundry Revolution: As a Foundry Technology Development - Staff Yield Engineer, you will be at the forefront of Intel's collaborative journey with our foundry partners. Your expertise will be pivotal in guiding our customers through the intricate journey of product development, starting from testing and validation to New Product Introduction (NPI) phase to the High Volume Manufacturing (HVM). You will play a vital role in overseeing the wafer manufacturing process and ensuring a seamless transition into volume production. This is a unique opportunity to be part of a team that is not just participating in the industry but actively shaping its future. We are seeking a broad range of semiconductor expertise across the range of foundry technology development. Based on experience, potential areas may include: Serve as the yield point of contact through the cycle of foundry product development, from design to initial High Volume Manufacturing (HVM) Define yield goal and roadmap for foundry customer silicon by collaborating with Intel Foundry Services (IFS), Technology Development (TD), and Product Integration Collaborate with TD Process Integration, Device, Defect Metro, and Lab to identify yield detractors and yield enhancement opportunities, specifically for foundry customer silicon Provide yield / defect density projection for different types of customer silicon, including test chips, shuttles, and products Track inline process and non-process changes to incorporate the changepoints into yield prediction model Develop yield models to identify potential parametric and defective loss components and support Process Integration, Device and Module teams to develop projects to eliminate systematic yield losses Support yield analysis of logic, SRAM, and other types of devices on foundry customer silicon Establish correlations between critical inline metrics and yield for better inline control and end of line projection Engage side-by-side with Product Integration and Device teams in customer silicon execution, such as skew split planning and DOE Lead investigations and root-causing on yield signals for foundry customer silicon Identify opportunities to optimize foundry product development operational systems and methodologies to improve efficiency and standardization Work as the technical interface between foundry and both internal stakeholders and external customers Qualifications Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research. Minimum Qualifications: Bachelor's Degree in Electrical Engineering, Materials Science, Physics, Chemical Engineering or other relevant engineering or physical science discipline with 6+ years of relevant work experience OR Master's Degree in Electrical Engineering, Materials Science, Physics, Chemical Engineering or other relevant engineering or physical science with 4+ years of relevant work experience OR PhD Degree in Electrical Engineering, Materials Science, Physics, Chemical Engineering or other relevant engineering or physical science discipline with 2+ years of industry experience The years of relevant work experience listed above must be in the field in at least one of the following areas: Semiconductor yield engineering Analysis of yield post silicon yield signal and root-causing Preferred Qualifications: 3+ years of semiconductor direct yield analysis and engineering experience 3+ direct experience in yield pareto, projection and yield roadmap construction 3+ years of experience within a foundry team, or foundry customer yield collaboration 3+ years of experience interpreting product data including inline, e-test and SORT data, finding failure root cause and inline indicator and driving for solutions Knowledge on inline inspection method, electrical test structures and SORT programs Exposure to fabless design house product development Foundry customer service experience and evidence of strong customer orientation. For information on Intel's immigration sponsorship guidelines, please see Intel U.S. Immigration Sponsorship Information Other Locations US, TX, Austin; US, AZ, Phoenix; US, CA, Folsom; US, CA, Santa Clara Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. Annual Salary Range for jobs which could be performed in the US $148,100.00-$209,100.00 Salary range dependent on a number of factors including location and experience Working Model This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. Job posting details (such as work model, location or time type) are subject to change.
Job Description At the heart of Intel's groundbreaking product advancements, the Logic Technology Development (LTD) organization is a powerhouse of process technology innovation. Our relentless pursuit of excellence and innovation propels Intel's Foundry strategy, ensuring that we not only meet but exceed the aspirations of our global customers. As we continue to lead the semiconductor industry, we are enhancing our technological capabilities to guarantee the triumph of our customers' diverse and ambitious projects. Your Role in Intel's Foundry Revolution: As a Foundry Technology Development - Staff Yield Engineer, you will be at the forefront of Intel's collaborative journey with our foundry partners. Your expertise will be pivotal in guiding our customers through the intricate journey of product development, starting from testing and validation to New Product Introduction (NPI) phase to the High Volume Manufacturing (HVM). You will play a vital role in overseeing the wafer manufacturing process and ensuring a seamless transition into volume production. This is a unique opportunity to be part of a team that is not just participating in the industry but actively shaping its future. We are seeking a broad range of semiconductor expertise across the range of foundry technology development. Based on experience, potential areas may include: Serve as the yield point of contact through the cycle of foundry product development, from design to initial High Volume Manufacturing (HVM) Define yield goal and roadmap for foundry customer silicon by collaborating with Intel Foundry Services (IFS), Technology Development (TD), and Product Integration Collaborate with TD Process Integration, Device, Defect Metro, and Lab to identify yield detractors and yield enhancement opportunities, specifically for foundry customer silicon Provide yield / defect density projection for different types of customer silicon, including test chips, shuttles, and products Track inline process and non-process changes to incorporate the changepoints into yield prediction model Develop yield models to identify potential parametric and defective loss components and support Process Integration, Device and Module teams to develop projects to eliminate systematic yield losses Support yield analysis of logic, SRAM, and other types of devices on foundry customer silicon Establish correlations between critical inline metrics and yield for better inline control and end of line projection Engage side-by-side with Product Integration and Device teams in customer silicon execution, such as skew split planning and DOE Lead investigations and root-causing on yield signals for foundry customer silicon Identify opportunities to optimize foundry product development operational systems and methodologies to improve efficiency and standardization Work as the technical interface between foundry and both internal stakeholders and external customers Qualifications Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research. Minimum Qualifications: Bachelor's Degree in Electrical Engineering, Materials Science, Physics, Chemical Engineering or other relevant engineering or physical science discipline with 6+ years of relevant work experience OR Master's Degree in Electrical Engineering, Materials Science, Physics, Chemical Engineering or other relevant engineering or physical science with 4+ years of relevant work experience OR PhD Degree in Electrical Engineering, Materials Science, Physics, Chemical Engineering or other relevant engineering or physical science discipline with 2+ years of industry experience The years of relevant work experience listed above must be in the field in at least one of the following areas: Semiconductor yield engineering Analysis of yield post silicon yield signal and root-causing Preferred Qualifications: 3+ years of semiconductor direct yield analysis and engineering experience 3+ direct experience in yield pareto, projection and yield roadmap construction 3+ years of experience within a foundry team, or foundry customer yield collaboration 3+ years of experience interpreting product data including inline, e-test and SORT data, finding failure root cause and inline indicator and driving for solutions Knowledge on inline inspection method, electrical test structures and SORT programs Exposure to fabless design house product development Foundry customer service experience and evidence of strong customer orientation. For information on Intel's immigration sponsorship guidelines, please see Intel U.S. Immigration Sponsorship Information Other Locations US, TX, Austin; US, AZ, Phoenix; US, CA, Folsom; US, CA, Santa Clara Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. Annual Salary Range for jobs which could be performed in the US $148,100.00-$209,100.00 Salary range dependent on a number of factors including location and experience Working Model This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. Job posting details (such as work model, location or time type) are subject to change.
08/03/2026
Full time
Job Description At the heart of Intel's groundbreaking product advancements, the Logic Technology Development (LTD) organization is a powerhouse of process technology innovation. Our relentless pursuit of excellence and innovation propels Intel's Foundry strategy, ensuring that we not only meet but exceed the aspirations of our global customers. As we continue to lead the semiconductor industry, we are enhancing our technological capabilities to guarantee the triumph of our customers' diverse and ambitious projects. Your Role in Intel's Foundry Revolution: As a Foundry Technology Development - Staff Yield Engineer, you will be at the forefront of Intel's collaborative journey with our foundry partners. Your expertise will be pivotal in guiding our customers through the intricate journey of product development, starting from testing and validation to New Product Introduction (NPI) phase to the High Volume Manufacturing (HVM). You will play a vital role in overseeing the wafer manufacturing process and ensuring a seamless transition into volume production. This is a unique opportunity to be part of a team that is not just participating in the industry but actively shaping its future. We are seeking a broad range of semiconductor expertise across the range of foundry technology development. Based on experience, potential areas may include: Serve as the yield point of contact through the cycle of foundry product development, from design to initial High Volume Manufacturing (HVM) Define yield goal and roadmap for foundry customer silicon by collaborating with Intel Foundry Services (IFS), Technology Development (TD), and Product Integration Collaborate with TD Process Integration, Device, Defect Metro, and Lab to identify yield detractors and yield enhancement opportunities, specifically for foundry customer silicon Provide yield / defect density projection for different types of customer silicon, including test chips, shuttles, and products Track inline process and non-process changes to incorporate the changepoints into yield prediction model Develop yield models to identify potential parametric and defective loss components and support Process Integration, Device and Module teams to develop projects to eliminate systematic yield losses Support yield analysis of logic, SRAM, and other types of devices on foundry customer silicon Establish correlations between critical inline metrics and yield for better inline control and end of line projection Engage side-by-side with Product Integration and Device teams in customer silicon execution, such as skew split planning and DOE Lead investigations and root-causing on yield signals for foundry customer silicon Identify opportunities to optimize foundry product development operational systems and methodologies to improve efficiency and standardization Work as the technical interface between foundry and both internal stakeholders and external customers Qualifications Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research. Minimum Qualifications: Bachelor's Degree in Electrical Engineering, Materials Science, Physics, Chemical Engineering or other relevant engineering or physical science discipline with 6+ years of relevant work experience OR Master's Degree in Electrical Engineering, Materials Science, Physics, Chemical Engineering or other relevant engineering or physical science with 4+ years of relevant work experience OR PhD Degree in Electrical Engineering, Materials Science, Physics, Chemical Engineering or other relevant engineering or physical science discipline with 2+ years of industry experience The years of relevant work experience listed above must be in the field in at least one of the following areas: Semiconductor yield engineering Analysis of yield post silicon yield signal and root-causing Preferred Qualifications: 3+ years of semiconductor direct yield analysis and engineering experience 3+ direct experience in yield pareto, projection and yield roadmap construction 3+ years of experience within a foundry team, or foundry customer yield collaboration 3+ years of experience interpreting product data including inline, e-test and SORT data, finding failure root cause and inline indicator and driving for solutions Knowledge on inline inspection method, electrical test structures and SORT programs Exposure to fabless design house product development Foundry customer service experience and evidence of strong customer orientation. For information on Intel's immigration sponsorship guidelines, please see Intel U.S. Immigration Sponsorship Information Other Locations US, TX, Austin; US, AZ, Phoenix; US, CA, Folsom; US, CA, Santa Clara Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. Annual Salary Range for jobs which could be performed in the US $148,100.00-$209,100.00 Salary range dependent on a number of factors including location and experience Working Model This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. Job posting details (such as work model, location or time type) are subject to change.
Job Description At the heart of Intel's groundbreaking product advancements, the Logic Technology Development (LTD) organization is a powerhouse of process technology innovation. Our relentless pursuit of excellence and innovation propels Intel's Foundry strategy, ensuring that we not only meet but exceed the aspirations of our global customers. As we continue to lead the semiconductor industry, we are enhancing our technological capabilities to guarantee the triumph of our customers' diverse and ambitious projects. Your Role in Intel's Foundry Revolution: As a Foundry Technology Development - Staff Yield Engineer, you will be at the forefront of Intel's collaborative journey with our foundry partners. Your expertise will be pivotal in guiding our customers through the intricate journey of product development, starting from testing and validation to New Product Introduction (NPI) phase to the High Volume Manufacturing (HVM). You will play a vital role in overseeing the wafer manufacturing process and ensuring a seamless transition into volume production. This is a unique opportunity to be part of a team that is not just participating in the industry but actively shaping its future. We are seeking a broad range of semiconductor expertise across the range of foundry technology development. Based on experience, potential areas may include: Serve as the yield point of contact through the cycle of foundry product development, from design to initial High Volume Manufacturing (HVM) Define yield goal and roadmap for foundry customer silicon by collaborating with Intel Foundry Services (IFS), Technology Development (TD), and Product Integration Collaborate with TD Process Integration, Device, Defect Metro, and Lab to identify yield detractors and yield enhancement opportunities, specifically for foundry customer silicon Provide yield / defect density projection for different types of customer silicon, including test chips, shuttles, and products Track inline process and non-process changes to incorporate the changepoints into yield prediction model Develop yield models to identify potential parametric and defective loss components and support Process Integration, Device and Module teams to develop projects to eliminate systematic yield losses Support yield analysis of logic, SRAM, and other types of devices on foundry customer silicon Establish correlations between critical inline metrics and yield for better inline control and end of line projection Engage side-by-side with Product Integration and Device teams in customer silicon execution, such as skew split planning and DOE Lead investigations and root-causing on yield signals for foundry customer silicon Identify opportunities to optimize foundry product development operational systems and methodologies to improve efficiency and standardization Work as the technical interface between foundry and both internal stakeholders and external customers Qualifications Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research. Minimum Qualifications: Bachelor's Degree in Electrical Engineering, Materials Science, Physics, Chemical Engineering or other relevant engineering or physical science discipline with 6+ years of relevant work experience OR Master's Degree in Electrical Engineering, Materials Science, Physics, Chemical Engineering or other relevant engineering or physical science with 4+ years of relevant work experience OR PhD Degree in Electrical Engineering, Materials Science, Physics, Chemical Engineering or other relevant engineering or physical science discipline with 2+ years of industry experience The years of relevant work experience listed above must be in the field in at least one of the following areas: Semiconductor yield engineering Analysis of yield post silicon yield signal and root-causing Preferred Qualifications: 3+ years of semiconductor direct yield analysis and engineering experience 3+ direct experience in yield pareto, projection and yield roadmap construction 3+ years of experience within a foundry team, or foundry customer yield collaboration 3+ years of experience interpreting product data including inline, e-test and SORT data, finding failure root cause and inline indicator and driving for solutions Knowledge on inline inspection method, electrical test structures and SORT programs Exposure to fabless design house product development Foundry customer service experience and evidence of strong customer orientation. For information on Intel's immigration sponsorship guidelines, please see Intel U.S. Immigration Sponsorship Information Other Locations US, TX, Austin; US, AZ, Phoenix; US, CA, Folsom; US, CA, Santa Clara Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. Annual Salary Range for jobs which could be performed in the US $148,100.00-$209,100.00 Salary range dependent on a number of factors including location and experience Working Model This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. Job posting details (such as work model, location or time type) are subject to change.
08/03/2026
Full time
Job Description At the heart of Intel's groundbreaking product advancements, the Logic Technology Development (LTD) organization is a powerhouse of process technology innovation. Our relentless pursuit of excellence and innovation propels Intel's Foundry strategy, ensuring that we not only meet but exceed the aspirations of our global customers. As we continue to lead the semiconductor industry, we are enhancing our technological capabilities to guarantee the triumph of our customers' diverse and ambitious projects. Your Role in Intel's Foundry Revolution: As a Foundry Technology Development - Staff Yield Engineer, you will be at the forefront of Intel's collaborative journey with our foundry partners. Your expertise will be pivotal in guiding our customers through the intricate journey of product development, starting from testing and validation to New Product Introduction (NPI) phase to the High Volume Manufacturing (HVM). You will play a vital role in overseeing the wafer manufacturing process and ensuring a seamless transition into volume production. This is a unique opportunity to be part of a team that is not just participating in the industry but actively shaping its future. We are seeking a broad range of semiconductor expertise across the range of foundry technology development. Based on experience, potential areas may include: Serve as the yield point of contact through the cycle of foundry product development, from design to initial High Volume Manufacturing (HVM) Define yield goal and roadmap for foundry customer silicon by collaborating with Intel Foundry Services (IFS), Technology Development (TD), and Product Integration Collaborate with TD Process Integration, Device, Defect Metro, and Lab to identify yield detractors and yield enhancement opportunities, specifically for foundry customer silicon Provide yield / defect density projection for different types of customer silicon, including test chips, shuttles, and products Track inline process and non-process changes to incorporate the changepoints into yield prediction model Develop yield models to identify potential parametric and defective loss components and support Process Integration, Device and Module teams to develop projects to eliminate systematic yield losses Support yield analysis of logic, SRAM, and other types of devices on foundry customer silicon Establish correlations between critical inline metrics and yield for better inline control and end of line projection Engage side-by-side with Product Integration and Device teams in customer silicon execution, such as skew split planning and DOE Lead investigations and root-causing on yield signals for foundry customer silicon Identify opportunities to optimize foundry product development operational systems and methodologies to improve efficiency and standardization Work as the technical interface between foundry and both internal stakeholders and external customers Qualifications Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research. Minimum Qualifications: Bachelor's Degree in Electrical Engineering, Materials Science, Physics, Chemical Engineering or other relevant engineering or physical science discipline with 6+ years of relevant work experience OR Master's Degree in Electrical Engineering, Materials Science, Physics, Chemical Engineering or other relevant engineering or physical science with 4+ years of relevant work experience OR PhD Degree in Electrical Engineering, Materials Science, Physics, Chemical Engineering or other relevant engineering or physical science discipline with 2+ years of industry experience The years of relevant work experience listed above must be in the field in at least one of the following areas: Semiconductor yield engineering Analysis of yield post silicon yield signal and root-causing Preferred Qualifications: 3+ years of semiconductor direct yield analysis and engineering experience 3+ direct experience in yield pareto, projection and yield roadmap construction 3+ years of experience within a foundry team, or foundry customer yield collaboration 3+ years of experience interpreting product data including inline, e-test and SORT data, finding failure root cause and inline indicator and driving for solutions Knowledge on inline inspection method, electrical test structures and SORT programs Exposure to fabless design house product development Foundry customer service experience and evidence of strong customer orientation. For information on Intel's immigration sponsorship guidelines, please see Intel U.S. Immigration Sponsorship Information Other Locations US, TX, Austin; US, AZ, Phoenix; US, CA, Folsom; US, CA, Santa Clara Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. Annual Salary Range for jobs which could be performed in the US $148,100.00-$209,100.00 Salary range dependent on a number of factors including location and experience Working Model This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. Job posting details (such as work model, location or time type) are subject to change.
Job Description At the heart of Intel's groundbreaking product advancements, the Logic Technology Development (LTD) organization is a powerhouse of process technology innovation. Our relentless pursuit of excellence and innovation propels Intel's Foundry strategy, ensuring that we not only meet but exceed the aspirations of our global customers. As we continue to lead the semiconductor industry, we are enhancing our technological capabilities to guarantee the triumph of our customers' diverse and ambitious projects. Your Role in Intel's Foundry Revolution: As a Foundry Technology Development - Staff Yield Engineer, you will be at the forefront of Intel's collaborative journey with our foundry partners. Your expertise will be pivotal in guiding our customers through the intricate journey of product development, starting from testing and validation to New Product Introduction (NPI) phase to the High Volume Manufacturing (HVM). You will play a vital role in overseeing the wafer manufacturing process and ensuring a seamless transition into volume production. This is a unique opportunity to be part of a team that is not just participating in the industry but actively shaping its future. We are seeking a broad range of semiconductor expertise across the range of foundry technology development. Based on experience, potential areas may include: Serve as the yield point of contact through the cycle of foundry product development, from design to initial High Volume Manufacturing (HVM) Define yield goal and roadmap for foundry customer silicon by collaborating with Intel Foundry Services (IFS), Technology Development (TD), and Product Integration Collaborate with TD Process Integration, Device, Defect Metro, and Lab to identify yield detractors and yield enhancement opportunities, specifically for foundry customer silicon Provide yield / defect density projection for different types of customer silicon, including test chips, shuttles, and products Track inline process and non-process changes to incorporate the changepoints into yield prediction model Develop yield models to identify potential parametric and defective loss components and support Process Integration, Device and Module teams to develop projects to eliminate systematic yield losses Support yield analysis of logic, SRAM, and other types of devices on foundry customer silicon Establish correlations between critical inline metrics and yield for better inline control and end of line projection Engage side-by-side with Product Integration and Device teams in customer silicon execution, such as skew split planning and DOE Lead investigations and root-causing on yield signals for foundry customer silicon Identify opportunities to optimize foundry product development operational systems and methodologies to improve efficiency and standardization Work as the technical interface between foundry and both internal stakeholders and external customers Qualifications Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research. Minimum Qualifications: Bachelor's Degree in Electrical Engineering, Materials Science, Physics, Chemical Engineering or other relevant engineering or physical science discipline with 6+ years of relevant work experience OR Master's Degree in Electrical Engineering, Materials Science, Physics, Chemical Engineering or other relevant engineering or physical science with 4+ years of relevant work experience OR PhD Degree in Electrical Engineering, Materials Science, Physics, Chemical Engineering or other relevant engineering or physical science discipline with 2+ years of industry experience The years of relevant work experience listed above must be in the field in at least one of the following areas: Semiconductor yield engineering Analysis of yield post silicon yield signal and root-causing Preferred Qualifications: 3+ years of semiconductor direct yield analysis and engineering experience 3+ direct experience in yield pareto, projection and yield roadmap construction 3+ years of experience within a foundry team, or foundry customer yield collaboration 3+ years of experience interpreting product data including inline, e-test and SORT data, finding failure root cause and inline indicator and driving for solutions Knowledge on inline inspection method, electrical test structures and SORT programs Exposure to fabless design house product development Foundry customer service experience and evidence of strong customer orientation. For information on Intel's immigration sponsorship guidelines, please see Intel U.S. Immigration Sponsorship Information Other Locations US, TX, Austin; US, AZ, Phoenix; US, CA, Folsom; US, CA, Santa Clara Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. Annual Salary Range for jobs which could be performed in the US $148,100.00-$209,100.00 Salary range dependent on a number of factors including location and experience Working Model This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. Job posting details (such as work model, location or time type) are subject to change.
08/03/2026
Full time
Job Description At the heart of Intel's groundbreaking product advancements, the Logic Technology Development (LTD) organization is a powerhouse of process technology innovation. Our relentless pursuit of excellence and innovation propels Intel's Foundry strategy, ensuring that we not only meet but exceed the aspirations of our global customers. As we continue to lead the semiconductor industry, we are enhancing our technological capabilities to guarantee the triumph of our customers' diverse and ambitious projects. Your Role in Intel's Foundry Revolution: As a Foundry Technology Development - Staff Yield Engineer, you will be at the forefront of Intel's collaborative journey with our foundry partners. Your expertise will be pivotal in guiding our customers through the intricate journey of product development, starting from testing and validation to New Product Introduction (NPI) phase to the High Volume Manufacturing (HVM). You will play a vital role in overseeing the wafer manufacturing process and ensuring a seamless transition into volume production. This is a unique opportunity to be part of a team that is not just participating in the industry but actively shaping its future. We are seeking a broad range of semiconductor expertise across the range of foundry technology development. Based on experience, potential areas may include: Serve as the yield point of contact through the cycle of foundry product development, from design to initial High Volume Manufacturing (HVM) Define yield goal and roadmap for foundry customer silicon by collaborating with Intel Foundry Services (IFS), Technology Development (TD), and Product Integration Collaborate with TD Process Integration, Device, Defect Metro, and Lab to identify yield detractors and yield enhancement opportunities, specifically for foundry customer silicon Provide yield / defect density projection for different types of customer silicon, including test chips, shuttles, and products Track inline process and non-process changes to incorporate the changepoints into yield prediction model Develop yield models to identify potential parametric and defective loss components and support Process Integration, Device and Module teams to develop projects to eliminate systematic yield losses Support yield analysis of logic, SRAM, and other types of devices on foundry customer silicon Establish correlations between critical inline metrics and yield for better inline control and end of line projection Engage side-by-side with Product Integration and Device teams in customer silicon execution, such as skew split planning and DOE Lead investigations and root-causing on yield signals for foundry customer silicon Identify opportunities to optimize foundry product development operational systems and methodologies to improve efficiency and standardization Work as the technical interface between foundry and both internal stakeholders and external customers Qualifications Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research. Minimum Qualifications: Bachelor's Degree in Electrical Engineering, Materials Science, Physics, Chemical Engineering or other relevant engineering or physical science discipline with 6+ years of relevant work experience OR Master's Degree in Electrical Engineering, Materials Science, Physics, Chemical Engineering or other relevant engineering or physical science with 4+ years of relevant work experience OR PhD Degree in Electrical Engineering, Materials Science, Physics, Chemical Engineering or other relevant engineering or physical science discipline with 2+ years of industry experience The years of relevant work experience listed above must be in the field in at least one of the following areas: Semiconductor yield engineering Analysis of yield post silicon yield signal and root-causing Preferred Qualifications: 3+ years of semiconductor direct yield analysis and engineering experience 3+ direct experience in yield pareto, projection and yield roadmap construction 3+ years of experience within a foundry team, or foundry customer yield collaboration 3+ years of experience interpreting product data including inline, e-test and SORT data, finding failure root cause and inline indicator and driving for solutions Knowledge on inline inspection method, electrical test structures and SORT programs Exposure to fabless design house product development Foundry customer service experience and evidence of strong customer orientation. For information on Intel's immigration sponsorship guidelines, please see Intel U.S. Immigration Sponsorship Information Other Locations US, TX, Austin; US, AZ, Phoenix; US, CA, Folsom; US, CA, Santa Clara Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. Annual Salary Range for jobs which could be performed in the US $148,100.00-$209,100.00 Salary range dependent on a number of factors including location and experience Working Model This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. Job posting details (such as work model, location or time type) are subject to change.
Job Description At the heart of Intel's groundbreaking product advancements, the Logic Technology Development (LTD) organization is a powerhouse of process technology innovation. Our relentless pursuit of excellence and innovation propels Intel's Foundry strategy, ensuring that we not only meet but exceed the aspirations of our global customers. As we continue to lead the semiconductor industry, we are enhancing our technological capabilities to guarantee the triumph of our customers' diverse and ambitious projects. Your Role in Intel's Foundry Revolution: As a Foundry Technology Development - Staff Yield Engineer, you will be at the forefront of Intel's collaborative journey with our foundry partners. Your expertise will be pivotal in guiding our customers through the intricate journey of product development, starting from testing and validation to New Product Introduction (NPI) phase to the High Volume Manufacturing (HVM). You will play a vital role in overseeing the wafer manufacturing process and ensuring a seamless transition into volume production. This is a unique opportunity to be part of a team that is not just participating in the industry but actively shaping its future. We are seeking a broad range of semiconductor expertise across the range of foundry technology development. Based on experience, potential areas may include: Serve as the yield point of contact through the cycle of foundry product development, from design to initial High Volume Manufacturing (HVM) Define yield goal and roadmap for foundry customer silicon by collaborating with Intel Foundry Services (IFS), Technology Development (TD), and Product Integration Collaborate with TD Process Integration, Device, Defect Metro, and Lab to identify yield detractors and yield enhancement opportunities, specifically for foundry customer silicon Provide yield / defect density projection for different types of customer silicon, including test chips, shuttles, and products Track inline process and non-process changes to incorporate the changepoints into yield prediction model Develop yield models to identify potential parametric and defective loss components and support Process Integration, Device and Module teams to develop projects to eliminate systematic yield losses Support yield analysis of logic, SRAM, and other types of devices on foundry customer silicon Establish correlations between critical inline metrics and yield for better inline control and end of line projection Engage side-by-side with Product Integration and Device teams in customer silicon execution, such as skew split planning and DOE Lead investigations and root-causing on yield signals for foundry customer silicon Identify opportunities to optimize foundry product development operational systems and methodologies to improve efficiency and standardization Work as the technical interface between foundry and both internal stakeholders and external customers Qualifications Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research. Minimum Qualifications: Bachelor's Degree in Electrical Engineering, Materials Science, Physics, Chemical Engineering or other relevant engineering or physical science discipline with 6+ years of relevant work experience OR Master's Degree in Electrical Engineering, Materials Science, Physics, Chemical Engineering or other relevant engineering or physical science with 4+ years of relevant work experience OR PhD Degree in Electrical Engineering, Materials Science, Physics, Chemical Engineering or other relevant engineering or physical science discipline with 2+ years of industry experience The years of relevant work experience listed above must be in the field in at least one of the following areas: Semiconductor yield engineering Analysis of yield post silicon yield signal and root-causing Preferred Qualifications: 3+ years of semiconductor direct yield analysis and engineering experience 3+ direct experience in yield pareto, projection and yield roadmap construction 3+ years of experience within a foundry team, or foundry customer yield collaboration 3+ years of experience interpreting product data including inline, e-test and SORT data, finding failure root cause and inline indicator and driving for solutions Knowledge on inline inspection method, electrical test structures and SORT programs Exposure to fabless design house product development Foundry customer service experience and evidence of strong customer orientation. For information on Intel's immigration sponsorship guidelines, please see Intel U.S. Immigration Sponsorship Information Other Locations US, TX, Austin; US, AZ, Phoenix; US, CA, Folsom; US, CA, Santa Clara Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. Annual Salary Range for jobs which could be performed in the US $148,100.00-$209,100.00 Salary range dependent on a number of factors including location and experience Working Model This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. Job posting details (such as work model, location or time type) are subject to change.
08/03/2026
Full time
Job Description At the heart of Intel's groundbreaking product advancements, the Logic Technology Development (LTD) organization is a powerhouse of process technology innovation. Our relentless pursuit of excellence and innovation propels Intel's Foundry strategy, ensuring that we not only meet but exceed the aspirations of our global customers. As we continue to lead the semiconductor industry, we are enhancing our technological capabilities to guarantee the triumph of our customers' diverse and ambitious projects. Your Role in Intel's Foundry Revolution: As a Foundry Technology Development - Staff Yield Engineer, you will be at the forefront of Intel's collaborative journey with our foundry partners. Your expertise will be pivotal in guiding our customers through the intricate journey of product development, starting from testing and validation to New Product Introduction (NPI) phase to the High Volume Manufacturing (HVM). You will play a vital role in overseeing the wafer manufacturing process and ensuring a seamless transition into volume production. This is a unique opportunity to be part of a team that is not just participating in the industry but actively shaping its future. We are seeking a broad range of semiconductor expertise across the range of foundry technology development. Based on experience, potential areas may include: Serve as the yield point of contact through the cycle of foundry product development, from design to initial High Volume Manufacturing (HVM) Define yield goal and roadmap for foundry customer silicon by collaborating with Intel Foundry Services (IFS), Technology Development (TD), and Product Integration Collaborate with TD Process Integration, Device, Defect Metro, and Lab to identify yield detractors and yield enhancement opportunities, specifically for foundry customer silicon Provide yield / defect density projection for different types of customer silicon, including test chips, shuttles, and products Track inline process and non-process changes to incorporate the changepoints into yield prediction model Develop yield models to identify potential parametric and defective loss components and support Process Integration, Device and Module teams to develop projects to eliminate systematic yield losses Support yield analysis of logic, SRAM, and other types of devices on foundry customer silicon Establish correlations between critical inline metrics and yield for better inline control and end of line projection Engage side-by-side with Product Integration and Device teams in customer silicon execution, such as skew split planning and DOE Lead investigations and root-causing on yield signals for foundry customer silicon Identify opportunities to optimize foundry product development operational systems and methodologies to improve efficiency and standardization Work as the technical interface between foundry and both internal stakeholders and external customers Qualifications Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research. Minimum Qualifications: Bachelor's Degree in Electrical Engineering, Materials Science, Physics, Chemical Engineering or other relevant engineering or physical science discipline with 6+ years of relevant work experience OR Master's Degree in Electrical Engineering, Materials Science, Physics, Chemical Engineering or other relevant engineering or physical science with 4+ years of relevant work experience OR PhD Degree in Electrical Engineering, Materials Science, Physics, Chemical Engineering or other relevant engineering or physical science discipline with 2+ years of industry experience The years of relevant work experience listed above must be in the field in at least one of the following areas: Semiconductor yield engineering Analysis of yield post silicon yield signal and root-causing Preferred Qualifications: 3+ years of semiconductor direct yield analysis and engineering experience 3+ direct experience in yield pareto, projection and yield roadmap construction 3+ years of experience within a foundry team, or foundry customer yield collaboration 3+ years of experience interpreting product data including inline, e-test and SORT data, finding failure root cause and inline indicator and driving for solutions Knowledge on inline inspection method, electrical test structures and SORT programs Exposure to fabless design house product development Foundry customer service experience and evidence of strong customer orientation. For information on Intel's immigration sponsorship guidelines, please see Intel U.S. Immigration Sponsorship Information Other Locations US, TX, Austin; US, AZ, Phoenix; US, CA, Folsom; US, CA, Santa Clara Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. Annual Salary Range for jobs which could be performed in the US $148,100.00-$209,100.00 Salary range dependent on a number of factors including location and experience Working Model This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. Job posting details (such as work model, location or time type) are subject to change.
Job Description At the heart of Intel's groundbreaking product advancements, the Logic Technology Development (LTD) organization is a powerhouse of process technology innovation. Our relentless pursuit of excellence and innovation propels Intel's Foundry strategy, ensuring that we not only meet but exceed the aspirations of our global customers. As we continue to lead the semiconductor industry, we are enhancing our technological capabilities to guarantee the triumph of our customers' diverse and ambitious projects. Your Role in Intel's Foundry Revolution: As a Foundry Technology Development - Staff Yield Engineer, you will be at the forefront of Intel's collaborative journey with our foundry partners. Your expertise will be pivotal in guiding our customers through the intricate journey of product development, starting from testing and validation to New Product Introduction (NPI) phase to the High Volume Manufacturing (HVM). You will play a vital role in overseeing the wafer manufacturing process and ensuring a seamless transition into volume production. This is a unique opportunity to be part of a team that is not just participating in the industry but actively shaping its future. We are seeking a broad range of semiconductor expertise across the range of foundry technology development. Based on experience, potential areas may include: Serve as the yield point of contact through the cycle of foundry product development, from design to initial High Volume Manufacturing (HVM) Define yield goal and roadmap for foundry customer silicon by collaborating with Intel Foundry Services (IFS), Technology Development (TD), and Product Integration Collaborate with TD Process Integration, Device, Defect Metro, and Lab to identify yield detractors and yield enhancement opportunities, specifically for foundry customer silicon Provide yield / defect density projection for different types of customer silicon, including test chips, shuttles, and products Track inline process and non-process changes to incorporate the changepoints into yield prediction model Develop yield models to identify potential parametric and defective loss components and support Process Integration, Device and Module teams to develop projects to eliminate systematic yield losses Support yield analysis of logic, SRAM, and other types of devices on foundry customer silicon Establish correlations between critical inline metrics and yield for better inline control and end of line projection Engage side-by-side with Product Integration and Device teams in customer silicon execution, such as skew split planning and DOE Lead investigations and root-causing on yield signals for foundry customer silicon Identify opportunities to optimize foundry product development operational systems and methodologies to improve efficiency and standardization Work as the technical interface between foundry and both internal stakeholders and external customers Qualifications Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research. Minimum Qualifications: Bachelor's Degree in Electrical Engineering, Materials Science, Physics, Chemical Engineering or other relevant engineering or physical science discipline with 6+ years of relevant work experience OR Master's Degree in Electrical Engineering, Materials Science, Physics, Chemical Engineering or other relevant engineering or physical science with 4+ years of relevant work experience OR PhD Degree in Electrical Engineering, Materials Science, Physics, Chemical Engineering or other relevant engineering or physical science discipline with 2+ years of industry experience The years of relevant work experience listed above must be in the field in at least one of the following areas: Semiconductor yield engineering Analysis of yield post silicon yield signal and root-causing Preferred Qualifications: 3+ years of semiconductor direct yield analysis and engineering experience 3+ direct experience in yield pareto, projection and yield roadmap construction 3+ years of experience within a foundry team, or foundry customer yield collaboration 3+ years of experience interpreting product data including inline, e-test and SORT data, finding failure root cause and inline indicator and driving for solutions Knowledge on inline inspection method, electrical test structures and SORT programs Exposure to fabless design house product development Foundry customer service experience and evidence of strong customer orientation. For information on Intel's immigration sponsorship guidelines, please see Intel U.S. Immigration Sponsorship Information Other Locations US, TX, Austin; US, AZ, Phoenix; US, CA, Folsom; US, CA, Santa Clara Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. Annual Salary Range for jobs which could be performed in the US $148,100.00-$209,100.00 Salary range dependent on a number of factors including location and experience Working Model This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. Job posting details (such as work model, location or time type) are subject to change.
08/03/2026
Full time
Job Description At the heart of Intel's groundbreaking product advancements, the Logic Technology Development (LTD) organization is a powerhouse of process technology innovation. Our relentless pursuit of excellence and innovation propels Intel's Foundry strategy, ensuring that we not only meet but exceed the aspirations of our global customers. As we continue to lead the semiconductor industry, we are enhancing our technological capabilities to guarantee the triumph of our customers' diverse and ambitious projects. Your Role in Intel's Foundry Revolution: As a Foundry Technology Development - Staff Yield Engineer, you will be at the forefront of Intel's collaborative journey with our foundry partners. Your expertise will be pivotal in guiding our customers through the intricate journey of product development, starting from testing and validation to New Product Introduction (NPI) phase to the High Volume Manufacturing (HVM). You will play a vital role in overseeing the wafer manufacturing process and ensuring a seamless transition into volume production. This is a unique opportunity to be part of a team that is not just participating in the industry but actively shaping its future. We are seeking a broad range of semiconductor expertise across the range of foundry technology development. Based on experience, potential areas may include: Serve as the yield point of contact through the cycle of foundry product development, from design to initial High Volume Manufacturing (HVM) Define yield goal and roadmap for foundry customer silicon by collaborating with Intel Foundry Services (IFS), Technology Development (TD), and Product Integration Collaborate with TD Process Integration, Device, Defect Metro, and Lab to identify yield detractors and yield enhancement opportunities, specifically for foundry customer silicon Provide yield / defect density projection for different types of customer silicon, including test chips, shuttles, and products Track inline process and non-process changes to incorporate the changepoints into yield prediction model Develop yield models to identify potential parametric and defective loss components and support Process Integration, Device and Module teams to develop projects to eliminate systematic yield losses Support yield analysis of logic, SRAM, and other types of devices on foundry customer silicon Establish correlations between critical inline metrics and yield for better inline control and end of line projection Engage side-by-side with Product Integration and Device teams in customer silicon execution, such as skew split planning and DOE Lead investigations and root-causing on yield signals for foundry customer silicon Identify opportunities to optimize foundry product development operational systems and methodologies to improve efficiency and standardization Work as the technical interface between foundry and both internal stakeholders and external customers Qualifications Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research. Minimum Qualifications: Bachelor's Degree in Electrical Engineering, Materials Science, Physics, Chemical Engineering or other relevant engineering or physical science discipline with 6+ years of relevant work experience OR Master's Degree in Electrical Engineering, Materials Science, Physics, Chemical Engineering or other relevant engineering or physical science with 4+ years of relevant work experience OR PhD Degree in Electrical Engineering, Materials Science, Physics, Chemical Engineering or other relevant engineering or physical science discipline with 2+ years of industry experience The years of relevant work experience listed above must be in the field in at least one of the following areas: Semiconductor yield engineering Analysis of yield post silicon yield signal and root-causing Preferred Qualifications: 3+ years of semiconductor direct yield analysis and engineering experience 3+ direct experience in yield pareto, projection and yield roadmap construction 3+ years of experience within a foundry team, or foundry customer yield collaboration 3+ years of experience interpreting product data including inline, e-test and SORT data, finding failure root cause and inline indicator and driving for solutions Knowledge on inline inspection method, electrical test structures and SORT programs Exposure to fabless design house product development Foundry customer service experience and evidence of strong customer orientation. For information on Intel's immigration sponsorship guidelines, please see Intel U.S. Immigration Sponsorship Information Other Locations US, TX, Austin; US, AZ, Phoenix; US, CA, Folsom; US, CA, Santa Clara Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. Annual Salary Range for jobs which could be performed in the US $148,100.00-$209,100.00 Salary range dependent on a number of factors including location and experience Working Model This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. Job posting details (such as work model, location or time type) are subject to change.
Job Description Note: This role requires regular onsite presence to fulfill essential job responsibilities. Drives technology development and enablement for both high volume manufacturing and future technology, provides process integration and equipment solutions, and performs feasibility studies to meet desired device specifications. Leads design and development of technically sophisticated manufacturing processes and/or repair reverse engineering including material selection, parameter optimization, equipment metrology, and system design to enable new product designs and functional requirements. Performs pathfinding activities in support of process and hardware development enabling manufacturing of innovative device architectures and develops roadmaps for technologies enabling future roadmap. Recommends and implements modifications for operating equipment to improve production efficiency, manufacturing techniques, and optimizing production output for existing products. Partners with key equipment and materials suppliers to develop and implement enabling elements of the technology. Performs process technology feasibility studies through theoretical simulations and/or practical engineering methods. Remains updated on relevant industrial process and material manufacturing technical trends and develops view of inherent future Intel process technology needs to push industry forward by partnering with vendor ecosystem to build cost sensitive roadmap. Required Skills and Experience Proven track record of technical ownership and delivery of dry etch process innovations that enabled high volume manufacturing, yield improvement, reliability, or technology node transitions. Expert level understanding of plasma physics, plasma-surface interactions, pattern fidelity, selectivity, defectivity, and profile control for advanced device structures. Demonstrated ability to define long term technical direction and translate research concepts into manufacturable solutions at scale. Extensive experience with advanced data analytics, statistical modeling, and design of experiments (DOE) applied to complex semiconductor process problems. Recognized technical authority who influences decisions across modules, organizations, or technology programs without formal management authority. Preferred Skills and Experience Sustained leadership in developing and deploying next generation dry etch solutions for advanced logic or foundry technologies (e.g., FinFET, GAA, nanosheet architectures). Deep experience with advanced etch technologies, such as: High aspect ratio plasma etch (HARC); Atomic Layer Etch (ALE), EUV patterned layer etch integration; Radical and Vapor phase isotropic etching; Ash and surface treatments; Novel patterning or materials specific etch solutions Demonstrated history of breaking technical bottlenecks that materially impacted product ramp success, cost, or yield across multiple process nodes or product generations. Expertise in advanced materials and device characterization, including SEM, TEM, CD SEM, AFM, XPS, and electrical correlation. Strong publication, patent, or internal technology disclosure record that evidences field level or industry recognized contributions. Ability to mentor senior engineers, set technical standards, and elevate organizational capability across the dry etch discipline. Proven effectiveness in influencing cross functional and external stakeholders, including integration, device, yield, and equipment suppliers, to align on long term technical strategies. Experience shaping multiyear roadmaps for process platforms, tooling strategies, or foundational etch capabilities. Qualifications PhD with 10+ years of directly relevant experience, or Master's degree with 15+ years of experience, in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field. Deep, authoritative expertise in dry etch semiconductor manufacturing, with demonstrated leadership over complex process development or platform level solutions. Experience working in dry etch in a foundry Other Locations US, TX, Austin; US, AZ, Phoenix; US, CA, Folsom; US, CA, Santa Clara Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. Annual Salary Range for jobs which could be performed in the US $201,330.00-$284,230.00 Salary range dependent on a number of factors including location and experience Working Model This role will require an on-site presence. Job posting details (such as work model, location or time type) are subject to change.Position of TrustThis role is a Position of Trust. Should you accept this position, you must consent to and pass an extended Background Investigation, which includes (subject to country law), extended education, SEC sanctions, and additional criminal and civil checks. For internals, this investigation may or may not be completed prior to starting the position. For additional questions, please contact your Recruiter.
08/03/2026
Full time
Job Description Note: This role requires regular onsite presence to fulfill essential job responsibilities. Drives technology development and enablement for both high volume manufacturing and future technology, provides process integration and equipment solutions, and performs feasibility studies to meet desired device specifications. Leads design and development of technically sophisticated manufacturing processes and/or repair reverse engineering including material selection, parameter optimization, equipment metrology, and system design to enable new product designs and functional requirements. Performs pathfinding activities in support of process and hardware development enabling manufacturing of innovative device architectures and develops roadmaps for technologies enabling future roadmap. Recommends and implements modifications for operating equipment to improve production efficiency, manufacturing techniques, and optimizing production output for existing products. Partners with key equipment and materials suppliers to develop and implement enabling elements of the technology. Performs process technology feasibility studies through theoretical simulations and/or practical engineering methods. Remains updated on relevant industrial process and material manufacturing technical trends and develops view of inherent future Intel process technology needs to push industry forward by partnering with vendor ecosystem to build cost sensitive roadmap. Required Skills and Experience Proven track record of technical ownership and delivery of dry etch process innovations that enabled high volume manufacturing, yield improvement, reliability, or technology node transitions. Expert level understanding of plasma physics, plasma-surface interactions, pattern fidelity, selectivity, defectivity, and profile control for advanced device structures. Demonstrated ability to define long term technical direction and translate research concepts into manufacturable solutions at scale. Extensive experience with advanced data analytics, statistical modeling, and design of experiments (DOE) applied to complex semiconductor process problems. Recognized technical authority who influences decisions across modules, organizations, or technology programs without formal management authority. Preferred Skills and Experience Sustained leadership in developing and deploying next generation dry etch solutions for advanced logic or foundry technologies (e.g., FinFET, GAA, nanosheet architectures). Deep experience with advanced etch technologies, such as: High aspect ratio plasma etch (HARC); Atomic Layer Etch (ALE), EUV patterned layer etch integration; Radical and Vapor phase isotropic etching; Ash and surface treatments; Novel patterning or materials specific etch solutions Demonstrated history of breaking technical bottlenecks that materially impacted product ramp success, cost, or yield across multiple process nodes or product generations. Expertise in advanced materials and device characterization, including SEM, TEM, CD SEM, AFM, XPS, and electrical correlation. Strong publication, patent, or internal technology disclosure record that evidences field level or industry recognized contributions. Ability to mentor senior engineers, set technical standards, and elevate organizational capability across the dry etch discipline. Proven effectiveness in influencing cross functional and external stakeholders, including integration, device, yield, and equipment suppliers, to align on long term technical strategies. Experience shaping multiyear roadmaps for process platforms, tooling strategies, or foundational etch capabilities. Qualifications PhD with 10+ years of directly relevant experience, or Master's degree with 15+ years of experience, in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field. Deep, authoritative expertise in dry etch semiconductor manufacturing, with demonstrated leadership over complex process development or platform level solutions. Experience working in dry etch in a foundry Other Locations US, TX, Austin; US, AZ, Phoenix; US, CA, Folsom; US, CA, Santa Clara Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. Annual Salary Range for jobs which could be performed in the US $201,330.00-$284,230.00 Salary range dependent on a number of factors including location and experience Working Model This role will require an on-site presence. Job posting details (such as work model, location or time type) are subject to change.Position of TrustThis role is a Position of Trust. Should you accept this position, you must consent to and pass an extended Background Investigation, which includes (subject to country law), extended education, SEC sanctions, and additional criminal and civil checks. For internals, this investigation may or may not be completed prior to starting the position. For additional questions, please contact your Recruiter.
Job Description Note: This role requires regular onsite presence to fulfill essential job responsibilities. Drives technology development and enablement for both high volume manufacturing and future technology, provides process integration and equipment solutions, and performs feasibility studies to meet desired device specifications. Leads design and development of technically sophisticated manufacturing processes and/or repair reverse engineering including material selection, parameter optimization, equipment metrology, and system design to enable new product designs and functional requirements. Performs pathfinding activities in support of process and hardware development enabling manufacturing of innovative device architectures and develops roadmaps for technologies enabling future roadmap. Recommends and implements modifications for operating equipment to improve production efficiency, manufacturing techniques, and optimizing production output for existing products. Partners with key equipment and materials suppliers to develop and implement enabling elements of the technology. Performs process technology feasibility studies through theoretical simulations and/or practical engineering methods. Remains updated on relevant industrial process and material manufacturing technical trends and develops view of inherent future Intel process technology needs to push industry forward by partnering with vendor ecosystem to build cost sensitive roadmap. Required Skills and Experience Proven track record of technical ownership and delivery of dry etch process innovations that enabled high volume manufacturing, yield improvement, reliability, or technology node transitions. Expert level understanding of plasma physics, plasma-surface interactions, pattern fidelity, selectivity, defectivity, and profile control for advanced device structures. Demonstrated ability to define long term technical direction and translate research concepts into manufacturable solutions at scale. Extensive experience with advanced data analytics, statistical modeling, and design of experiments (DOE) applied to complex semiconductor process problems. Recognized technical authority who influences decisions across modules, organizations, or technology programs without formal management authority. Preferred Skills and Experience Sustained leadership in developing and deploying next generation dry etch solutions for advanced logic or foundry technologies (e.g., FinFET, GAA, nanosheet architectures). Deep experience with advanced etch technologies, such as: High aspect ratio plasma etch (HARC); Atomic Layer Etch (ALE), EUV patterned layer etch integration; Radical and Vapor phase isotropic etching; Ash and surface treatments; Novel patterning or materials specific etch solutions Demonstrated history of breaking technical bottlenecks that materially impacted product ramp success, cost, or yield across multiple process nodes or product generations. Expertise in advanced materials and device characterization, including SEM, TEM, CD SEM, AFM, XPS, and electrical correlation. Strong publication, patent, or internal technology disclosure record that evidences field level or industry recognized contributions. Ability to mentor senior engineers, set technical standards, and elevate organizational capability across the dry etch discipline. Proven effectiveness in influencing cross functional and external stakeholders, including integration, device, yield, and equipment suppliers, to align on long term technical strategies. Experience shaping multiyear roadmaps for process platforms, tooling strategies, or foundational etch capabilities. Qualifications PhD with 10+ years of directly relevant experience, or Master's degree with 15+ years of experience, in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field. Deep, authoritative expertise in dry etch semiconductor manufacturing, with demonstrated leadership over complex process development or platform level solutions. Experience working in dry etch in a foundry Other Locations US, TX, Austin; US, AZ, Phoenix; US, CA, Folsom; US, CA, Santa Clara Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. Annual Salary Range for jobs which could be performed in the US $201,330.00-$284,230.00 Salary range dependent on a number of factors including location and experience Working Model This role will require an on-site presence. Job posting details (such as work model, location or time type) are subject to change.Position of TrustThis role is a Position of Trust. Should you accept this position, you must consent to and pass an extended Background Investigation, which includes (subject to country law), extended education, SEC sanctions, and additional criminal and civil checks. For internals, this investigation may or may not be completed prior to starting the position. For additional questions, please contact your Recruiter.
08/02/2026
Full time
Job Description Note: This role requires regular onsite presence to fulfill essential job responsibilities. Drives technology development and enablement for both high volume manufacturing and future technology, provides process integration and equipment solutions, and performs feasibility studies to meet desired device specifications. Leads design and development of technically sophisticated manufacturing processes and/or repair reverse engineering including material selection, parameter optimization, equipment metrology, and system design to enable new product designs and functional requirements. Performs pathfinding activities in support of process and hardware development enabling manufacturing of innovative device architectures and develops roadmaps for technologies enabling future roadmap. Recommends and implements modifications for operating equipment to improve production efficiency, manufacturing techniques, and optimizing production output for existing products. Partners with key equipment and materials suppliers to develop and implement enabling elements of the technology. Performs process technology feasibility studies through theoretical simulations and/or practical engineering methods. Remains updated on relevant industrial process and material manufacturing technical trends and develops view of inherent future Intel process technology needs to push industry forward by partnering with vendor ecosystem to build cost sensitive roadmap. Required Skills and Experience Proven track record of technical ownership and delivery of dry etch process innovations that enabled high volume manufacturing, yield improvement, reliability, or technology node transitions. Expert level understanding of plasma physics, plasma-surface interactions, pattern fidelity, selectivity, defectivity, and profile control for advanced device structures. Demonstrated ability to define long term technical direction and translate research concepts into manufacturable solutions at scale. Extensive experience with advanced data analytics, statistical modeling, and design of experiments (DOE) applied to complex semiconductor process problems. Recognized technical authority who influences decisions across modules, organizations, or technology programs without formal management authority. Preferred Skills and Experience Sustained leadership in developing and deploying next generation dry etch solutions for advanced logic or foundry technologies (e.g., FinFET, GAA, nanosheet architectures). Deep experience with advanced etch technologies, such as: High aspect ratio plasma etch (HARC); Atomic Layer Etch (ALE), EUV patterned layer etch integration; Radical and Vapor phase isotropic etching; Ash and surface treatments; Novel patterning or materials specific etch solutions Demonstrated history of breaking technical bottlenecks that materially impacted product ramp success, cost, or yield across multiple process nodes or product generations. Expertise in advanced materials and device characterization, including SEM, TEM, CD SEM, AFM, XPS, and electrical correlation. Strong publication, patent, or internal technology disclosure record that evidences field level or industry recognized contributions. Ability to mentor senior engineers, set technical standards, and elevate organizational capability across the dry etch discipline. Proven effectiveness in influencing cross functional and external stakeholders, including integration, device, yield, and equipment suppliers, to align on long term technical strategies. Experience shaping multiyear roadmaps for process platforms, tooling strategies, or foundational etch capabilities. Qualifications PhD with 10+ years of directly relevant experience, or Master's degree with 15+ years of experience, in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field. Deep, authoritative expertise in dry etch semiconductor manufacturing, with demonstrated leadership over complex process development or platform level solutions. Experience working in dry etch in a foundry Other Locations US, TX, Austin; US, AZ, Phoenix; US, CA, Folsom; US, CA, Santa Clara Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. Annual Salary Range for jobs which could be performed in the US $201,330.00-$284,230.00 Salary range dependent on a number of factors including location and experience Working Model This role will require an on-site presence. Job posting details (such as work model, location or time type) are subject to change.Position of TrustThis role is a Position of Trust. Should you accept this position, you must consent to and pass an extended Background Investigation, which includes (subject to country law), extended education, SEC sanctions, and additional criminal and civil checks. For internals, this investigation may or may not be completed prior to starting the position. For additional questions, please contact your Recruiter.
Job Description Note: This role requires regular onsite presence to fulfill essential job responsibilities. Drives technology development and enablement for both high volume manufacturing and future technology, provides process integration and equipment solutions, and performs feasibility studies to meet desired device specifications. Leads design and development of technically sophisticated manufacturing processes and/or repair reverse engineering including material selection, parameter optimization, equipment metrology, and system design to enable new product designs and functional requirements. Performs pathfinding activities in support of process and hardware development enabling manufacturing of innovative device architectures and develops roadmaps for technologies enabling future roadmap. Recommends and implements modifications for operating equipment to improve production efficiency, manufacturing techniques, and optimizing production output for existing products. Partners with key equipment and materials suppliers to develop and implement enabling elements of the technology. Performs process technology feasibility studies through theoretical simulations and/or practical engineering methods. Remains updated on relevant industrial process and material manufacturing technical trends and develops view of inherent future Intel process technology needs to push industry forward by partnering with vendor ecosystem to build cost sensitive roadmap. Required Skills and Experience Proven track record of technical ownership and delivery of dry etch process innovations that enabled high volume manufacturing, yield improvement, reliability, or technology node transitions. Expert level understanding of plasma physics, plasma-surface interactions, pattern fidelity, selectivity, defectivity, and profile control for advanced device structures. Demonstrated ability to define long term technical direction and translate research concepts into manufacturable solutions at scale. Extensive experience with advanced data analytics, statistical modeling, and design of experiments (DOE) applied to complex semiconductor process problems. Recognized technical authority who influences decisions across modules, organizations, or technology programs without formal management authority. Preferred Skills and Experience Sustained leadership in developing and deploying next generation dry etch solutions for advanced logic or foundry technologies (e.g., FinFET, GAA, nanosheet architectures). Deep experience with advanced etch technologies, such as: High aspect ratio plasma etch (HARC); Atomic Layer Etch (ALE), EUV patterned layer etch integration; Radical and Vapor phase isotropic etching; Ash and surface treatments; Novel patterning or materials specific etch solutions Demonstrated history of breaking technical bottlenecks that materially impacted product ramp success, cost, or yield across multiple process nodes or product generations. Expertise in advanced materials and device characterization, including SEM, TEM, CD SEM, AFM, XPS, and electrical correlation. Strong publication, patent, or internal technology disclosure record that evidences field level or industry recognized contributions. Ability to mentor senior engineers, set technical standards, and elevate organizational capability across the dry etch discipline. Proven effectiveness in influencing cross functional and external stakeholders, including integration, device, yield, and equipment suppliers, to align on long term technical strategies. Experience shaping multiyear roadmaps for process platforms, tooling strategies, or foundational etch capabilities. Qualifications PhD with 10+ years of directly relevant experience, or Master's degree with 15+ years of experience, in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field. Deep, authoritative expertise in dry etch semiconductor manufacturing, with demonstrated leadership over complex process development or platform level solutions. Experience working in dry etch in a foundry Other Locations US, TX, Austin; US, AZ, Phoenix; US, CA, Folsom; US, CA, Santa Clara Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. Annual Salary Range for jobs which could be performed in the US $201,330.00-$284,230.00 Salary range dependent on a number of factors including location and experience Working Model This role will require an on-site presence. Job posting details (such as work model, location or time type) are subject to change.Position of TrustThis role is a Position of Trust. Should you accept this position, you must consent to and pass an extended Background Investigation, which includes (subject to country law), extended education, SEC sanctions, and additional criminal and civil checks. For internals, this investigation may or may not be completed prior to starting the position. For additional questions, please contact your Recruiter.
08/02/2026
Full time
Job Description Note: This role requires regular onsite presence to fulfill essential job responsibilities. Drives technology development and enablement for both high volume manufacturing and future technology, provides process integration and equipment solutions, and performs feasibility studies to meet desired device specifications. Leads design and development of technically sophisticated manufacturing processes and/or repair reverse engineering including material selection, parameter optimization, equipment metrology, and system design to enable new product designs and functional requirements. Performs pathfinding activities in support of process and hardware development enabling manufacturing of innovative device architectures and develops roadmaps for technologies enabling future roadmap. Recommends and implements modifications for operating equipment to improve production efficiency, manufacturing techniques, and optimizing production output for existing products. Partners with key equipment and materials suppliers to develop and implement enabling elements of the technology. Performs process technology feasibility studies through theoretical simulations and/or practical engineering methods. Remains updated on relevant industrial process and material manufacturing technical trends and develops view of inherent future Intel process technology needs to push industry forward by partnering with vendor ecosystem to build cost sensitive roadmap. Required Skills and Experience Proven track record of technical ownership and delivery of dry etch process innovations that enabled high volume manufacturing, yield improvement, reliability, or technology node transitions. Expert level understanding of plasma physics, plasma-surface interactions, pattern fidelity, selectivity, defectivity, and profile control for advanced device structures. Demonstrated ability to define long term technical direction and translate research concepts into manufacturable solutions at scale. Extensive experience with advanced data analytics, statistical modeling, and design of experiments (DOE) applied to complex semiconductor process problems. Recognized technical authority who influences decisions across modules, organizations, or technology programs without formal management authority. Preferred Skills and Experience Sustained leadership in developing and deploying next generation dry etch solutions for advanced logic or foundry technologies (e.g., FinFET, GAA, nanosheet architectures). Deep experience with advanced etch technologies, such as: High aspect ratio plasma etch (HARC); Atomic Layer Etch (ALE), EUV patterned layer etch integration; Radical and Vapor phase isotropic etching; Ash and surface treatments; Novel patterning or materials specific etch solutions Demonstrated history of breaking technical bottlenecks that materially impacted product ramp success, cost, or yield across multiple process nodes or product generations. Expertise in advanced materials and device characterization, including SEM, TEM, CD SEM, AFM, XPS, and electrical correlation. Strong publication, patent, or internal technology disclosure record that evidences field level or industry recognized contributions. Ability to mentor senior engineers, set technical standards, and elevate organizational capability across the dry etch discipline. Proven effectiveness in influencing cross functional and external stakeholders, including integration, device, yield, and equipment suppliers, to align on long term technical strategies. Experience shaping multiyear roadmaps for process platforms, tooling strategies, or foundational etch capabilities. Qualifications PhD with 10+ years of directly relevant experience, or Master's degree with 15+ years of experience, in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field. Deep, authoritative expertise in dry etch semiconductor manufacturing, with demonstrated leadership over complex process development or platform level solutions. Experience working in dry etch in a foundry Other Locations US, TX, Austin; US, AZ, Phoenix; US, CA, Folsom; US, CA, Santa Clara Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. Annual Salary Range for jobs which could be performed in the US $201,330.00-$284,230.00 Salary range dependent on a number of factors including location and experience Working Model This role will require an on-site presence. Job posting details (such as work model, location or time type) are subject to change.Position of TrustThis role is a Position of Trust. Should you accept this position, you must consent to and pass an extended Background Investigation, which includes (subject to country law), extended education, SEC sanctions, and additional criminal and civil checks. For internals, this investigation may or may not be completed prior to starting the position. For additional questions, please contact your Recruiter.
Job Description Intel is shaping the future of technology to help create a better future for the entire world. Our work in pushing forward fields like AI, analytics, and cloud-to-edge technology is at the heart of countless innovations. With a career at Intel, you'll have the opportunity to use technology to power major breakthroughs and create enhancements that improve our everyday quality of life. We're looking to hire a highly motivated mechanical engineer to join Advanced Packaging Mechanical Analysis team located in Chandler AZ. This role is focused on developing Multiphysics thermo-mechanical simulations to support design, definition, development and qualifications of advanced semiconductor packaging led by Intel Foundry. This position offers the opportunity to work at the forefront of semiconductor packaging innovation, collaborating with engineers and researchers across multiple business groups such as design, technology integration, reliability, yield and manufacturing. This role requires regular onsite presence to fulfill essential job responsibilities. Key Responsibilities. Develop and validate finite element analysis (FEA) models to simulate thermal and mechanical behavior of advanced semiconductor packages. Perform simulations to evaluate stress, strain, warpage, delamination, thermal cycling, and reliability risks across a wide range of package architectures. Collaborate with cross-functional teams to define simulation requirements, interpret results, and provide actionable design and process recommendations. Design and coordinate lab tests and research on basic materials and properties to understand material behavior and reliability failure mechanisms. The ideal candidate will have to drive strategic development activities and work closely with internal and external customer organizations to plan, execute and communicate development activities and programs. The team leverages both experimental and numerical methods across a broad range of areas, including thermal, mechanical, and fluids. The team typically uses a combination of simulations and experiments, as needed, to help solve practical engineering problems. The team frequently leverages advanced analysis methods (statistical, AI/ML) to supplement modeling and experimental approaches. The ideal candidate should exhibit the following skills or behavioral traits: Demonstrated ability to work seamlessly between experiments and simulations. Qualifications You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research. Minimum Qualifications: PhD Degree in Mechanical Engineering, Chemical Engineering or Material Sciences or a related field with emphasis in solid mechanics. 3+ years of Thermal-mechanical work/research experience with emphasis on silicon reliability 3+ years of experience with Finite Element Analysis tools 3+ years of experience with experimental material characterization metrologies such as DMA/TMA and nano-indentation. Preferred Qualifications: Experience with multi-physics simulations, including coupled electro-thermal-mechanical analysis, free surface two phase flows, electroplating and plasma. Experience with co-packaging optics, optical coupling, fiber pigtail attachment, free space optics. Experience with designing, planning and executing experiments, along with interpretation of results. Experience with scripting and automation (e.g., Python, TCL, MATLAB) to streamline simulation workflows. Knowledge in advanced packaging technologies, familiarity with semiconductor packaging processes, including die attach, underfill, molding, bumping, surface mount and reflow. Programming/script development with artificial intelligence and machine learning concepts. Previous related work experience in a semiconductor foundry preferred. Join us at Intel and be part of a team that values innovation, collaboration, and making a meaningful impact. Apply today to embark on a rewarding career journey with us! Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. Annual Salary Range for jobs which could be performed in the US $148,100.00-$209,100.00 Salary range dependent on a number of factors including location and experience Working Model This role will require an on-site presence. Job posting details (such as work model, location or time type) are subject to change.
08/02/2026
Full time
Job Description Intel is shaping the future of technology to help create a better future for the entire world. Our work in pushing forward fields like AI, analytics, and cloud-to-edge technology is at the heart of countless innovations. With a career at Intel, you'll have the opportunity to use technology to power major breakthroughs and create enhancements that improve our everyday quality of life. We're looking to hire a highly motivated mechanical engineer to join Advanced Packaging Mechanical Analysis team located in Chandler AZ. This role is focused on developing Multiphysics thermo-mechanical simulations to support design, definition, development and qualifications of advanced semiconductor packaging led by Intel Foundry. This position offers the opportunity to work at the forefront of semiconductor packaging innovation, collaborating with engineers and researchers across multiple business groups such as design, technology integration, reliability, yield and manufacturing. This role requires regular onsite presence to fulfill essential job responsibilities. Key Responsibilities. Develop and validate finite element analysis (FEA) models to simulate thermal and mechanical behavior of advanced semiconductor packages. Perform simulations to evaluate stress, strain, warpage, delamination, thermal cycling, and reliability risks across a wide range of package architectures. Collaborate with cross-functional teams to define simulation requirements, interpret results, and provide actionable design and process recommendations. Design and coordinate lab tests and research on basic materials and properties to understand material behavior and reliability failure mechanisms. The ideal candidate will have to drive strategic development activities and work closely with internal and external customer organizations to plan, execute and communicate development activities and programs. The team leverages both experimental and numerical methods across a broad range of areas, including thermal, mechanical, and fluids. The team typically uses a combination of simulations and experiments, as needed, to help solve practical engineering problems. The team frequently leverages advanced analysis methods (statistical, AI/ML) to supplement modeling and experimental approaches. The ideal candidate should exhibit the following skills or behavioral traits: Demonstrated ability to work seamlessly between experiments and simulations. Qualifications You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research. Minimum Qualifications: PhD Degree in Mechanical Engineering, Chemical Engineering or Material Sciences or a related field with emphasis in solid mechanics. 3+ years of Thermal-mechanical work/research experience with emphasis on silicon reliability 3+ years of experience with Finite Element Analysis tools 3+ years of experience with experimental material characterization metrologies such as DMA/TMA and nano-indentation. Preferred Qualifications: Experience with multi-physics simulations, including coupled electro-thermal-mechanical analysis, free surface two phase flows, electroplating and plasma. Experience with co-packaging optics, optical coupling, fiber pigtail attachment, free space optics. Experience with designing, planning and executing experiments, along with interpretation of results. Experience with scripting and automation (e.g., Python, TCL, MATLAB) to streamline simulation workflows. Knowledge in advanced packaging technologies, familiarity with semiconductor packaging processes, including die attach, underfill, molding, bumping, surface mount and reflow. Programming/script development with artificial intelligence and machine learning concepts. Previous related work experience in a semiconductor foundry preferred. Join us at Intel and be part of a team that values innovation, collaboration, and making a meaningful impact. Apply today to embark on a rewarding career journey with us! Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. Annual Salary Range for jobs which could be performed in the US $148,100.00-$209,100.00 Salary range dependent on a number of factors including location and experience Working Model This role will require an on-site presence. Job posting details (such as work model, location or time type) are subject to change.
Job Description Note: This role requires regular onsite presence to fulfill essential job responsibilities. Drives technology development and enablement for both high volume manufacturing and future technology, provides process integration and equipment solutions, and performs feasibility studies to meet desired device specifications. Leads design and development of technically sophisticated manufacturing processes and/or repair reverse engineering including material selection, parameter optimization, equipment metrology, and system design to enable new product designs and functional requirements. Performs pathfinding activities in support of process and hardware development enabling manufacturing of innovative device architectures and develops roadmaps for technologies enabling future roadmap. Recommends and implements modifications for operating equipment to improve production efficiency, manufacturing techniques, and optimizing production output for existing products. Partners with key equipment and materials suppliers to develop and implement enabling elements of the technology. Performs process technology feasibility studies through theoretical simulations and/or practical engineering methods. Remains updated on relevant industrial process and material manufacturing technical trends and develops view of inherent future Intel process technology needs to push industry forward by partnering with vendor ecosystem to build cost sensitive roadmap. Required Skills and Experience Proven track record of technical ownership and delivery of dry etch process innovations that enabled high volume manufacturing, yield improvement, reliability, or technology node transitions. Expert level understanding of plasma physics, plasma-surface interactions, pattern fidelity, selectivity, defectivity, and profile control for advanced device structures. Demonstrated ability to define long term technical direction and translate research concepts into manufacturable solutions at scale. Extensive experience with advanced data analytics, statistical modeling, and design of experiments (DOE) applied to complex semiconductor process problems. Recognized technical authority who influences decisions across modules, organizations, or technology programs without formal management authority. Preferred Skills and Experience Sustained leadership in developing and deploying next generation dry etch solutions for advanced logic or foundry technologies (e.g., FinFET, GAA, nanosheet architectures). Deep experience with advanced etch technologies, such as: High aspect ratio plasma etch (HARC); Atomic Layer Etch (ALE), EUV patterned layer etch integration; Radical and Vapor phase isotropic etching; Ash and surface treatments; Novel patterning or materials specific etch solutions Demonstrated history of breaking technical bottlenecks that materially impacted product ramp success, cost, or yield across multiple process nodes or product generations. Expertise in advanced materials and device characterization, including SEM, TEM, CD SEM, AFM, XPS, and electrical correlation. Strong publication, patent, or internal technology disclosure record that evidences field level or industry recognized contributions. Ability to mentor senior engineers, set technical standards, and elevate organizational capability across the dry etch discipline. Proven effectiveness in influencing cross functional and external stakeholders, including integration, device, yield, and equipment suppliers, to align on long term technical strategies. Experience shaping multiyear roadmaps for process platforms, tooling strategies, or foundational etch capabilities. Qualifications PhD with 10+ years of directly relevant experience, or Master's degree with 15+ years of experience, in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field. Deep, authoritative expertise in dry etch semiconductor manufacturing, with demonstrated leadership over complex process development or platform level solutions. Experience working in dry etch in a foundry Other Locations US, TX, Austin; US, AZ, Phoenix; US, CA, Folsom; US, CA, Santa Clara Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. Annual Salary Range for jobs which could be performed in the US $201,330.00-$284,230.00 Salary range dependent on a number of factors including location and experience Working Model This role will require an on-site presence. Job posting details (such as work model, location or time type) are subject to change.Position of TrustThis role is a Position of Trust. Should you accept this position, you must consent to and pass an extended Background Investigation, which includes (subject to country law), extended education, SEC sanctions, and additional criminal and civil checks. For internals, this investigation may or may not be completed prior to starting the position. For additional questions, please contact your Recruiter.
08/02/2026
Full time
Job Description Note: This role requires regular onsite presence to fulfill essential job responsibilities. Drives technology development and enablement for both high volume manufacturing and future technology, provides process integration and equipment solutions, and performs feasibility studies to meet desired device specifications. Leads design and development of technically sophisticated manufacturing processes and/or repair reverse engineering including material selection, parameter optimization, equipment metrology, and system design to enable new product designs and functional requirements. Performs pathfinding activities in support of process and hardware development enabling manufacturing of innovative device architectures and develops roadmaps for technologies enabling future roadmap. Recommends and implements modifications for operating equipment to improve production efficiency, manufacturing techniques, and optimizing production output for existing products. Partners with key equipment and materials suppliers to develop and implement enabling elements of the technology. Performs process technology feasibility studies through theoretical simulations and/or practical engineering methods. Remains updated on relevant industrial process and material manufacturing technical trends and develops view of inherent future Intel process technology needs to push industry forward by partnering with vendor ecosystem to build cost sensitive roadmap. Required Skills and Experience Proven track record of technical ownership and delivery of dry etch process innovations that enabled high volume manufacturing, yield improvement, reliability, or technology node transitions. Expert level understanding of plasma physics, plasma-surface interactions, pattern fidelity, selectivity, defectivity, and profile control for advanced device structures. Demonstrated ability to define long term technical direction and translate research concepts into manufacturable solutions at scale. Extensive experience with advanced data analytics, statistical modeling, and design of experiments (DOE) applied to complex semiconductor process problems. Recognized technical authority who influences decisions across modules, organizations, or technology programs without formal management authority. Preferred Skills and Experience Sustained leadership in developing and deploying next generation dry etch solutions for advanced logic or foundry technologies (e.g., FinFET, GAA, nanosheet architectures). Deep experience with advanced etch technologies, such as: High aspect ratio plasma etch (HARC); Atomic Layer Etch (ALE), EUV patterned layer etch integration; Radical and Vapor phase isotropic etching; Ash and surface treatments; Novel patterning or materials specific etch solutions Demonstrated history of breaking technical bottlenecks that materially impacted product ramp success, cost, or yield across multiple process nodes or product generations. Expertise in advanced materials and device characterization, including SEM, TEM, CD SEM, AFM, XPS, and electrical correlation. Strong publication, patent, or internal technology disclosure record that evidences field level or industry recognized contributions. Ability to mentor senior engineers, set technical standards, and elevate organizational capability across the dry etch discipline. Proven effectiveness in influencing cross functional and external stakeholders, including integration, device, yield, and equipment suppliers, to align on long term technical strategies. Experience shaping multiyear roadmaps for process platforms, tooling strategies, or foundational etch capabilities. Qualifications PhD with 10+ years of directly relevant experience, or Master's degree with 15+ years of experience, in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field. Deep, authoritative expertise in dry etch semiconductor manufacturing, with demonstrated leadership over complex process development or platform level solutions. Experience working in dry etch in a foundry Other Locations US, TX, Austin; US, AZ, Phoenix; US, CA, Folsom; US, CA, Santa Clara Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. Annual Salary Range for jobs which could be performed in the US $201,330.00-$284,230.00 Salary range dependent on a number of factors including location and experience Working Model This role will require an on-site presence. Job posting details (such as work model, location or time type) are subject to change.Position of TrustThis role is a Position of Trust. Should you accept this position, you must consent to and pass an extended Background Investigation, which includes (subject to country law), extended education, SEC sanctions, and additional criminal and civil checks. For internals, this investigation may or may not be completed prior to starting the position. For additional questions, please contact your Recruiter.
Job Description Note: This role requires regular onsite presence to fulfill essential job responsibilities. Drives technology development and enablement for both high volume manufacturing and future technology, provides process integration and equipment solutions, and performs feasibility studies to meet desired device specifications. Leads design and development of technically sophisticated manufacturing processes and/or repair reverse engineering including material selection, parameter optimization, equipment metrology, and system design to enable new product designs and functional requirements. Performs pathfinding activities in support of process and hardware development enabling manufacturing of innovative device architectures and develops roadmaps for technologies enabling future roadmap. Recommends and implements modifications for operating equipment to improve production efficiency, manufacturing techniques, and optimizing production output for existing products. Partners with key equipment and materials suppliers to develop and implement enabling elements of the technology. Performs process technology feasibility studies through theoretical simulations and/or practical engineering methods. Remains updated on relevant industrial process and material manufacturing technical trends and develops view of inherent future Intel process technology needs to push industry forward by partnering with vendor ecosystem to build cost sensitive roadmap. Required Skills and Experience Proven track record of technical ownership and delivery of dry etch process innovations that enabled high volume manufacturing, yield improvement, reliability, or technology node transitions. Expert level understanding of plasma physics, plasma-surface interactions, pattern fidelity, selectivity, defectivity, and profile control for advanced device structures. Demonstrated ability to define long term technical direction and translate research concepts into manufacturable solutions at scale. Extensive experience with advanced data analytics, statistical modeling, and design of experiments (DOE) applied to complex semiconductor process problems. Recognized technical authority who influences decisions across modules, organizations, or technology programs without formal management authority. Preferred Skills and Experience Sustained leadership in developing and deploying next generation dry etch solutions for advanced logic or foundry technologies (e.g., FinFET, GAA, nanosheet architectures). Deep experience with advanced etch technologies, such as: High aspect ratio plasma etch (HARC); Atomic Layer Etch (ALE), EUV patterned layer etch integration; Radical and Vapor phase isotropic etching; Ash and surface treatments; Novel patterning or materials specific etch solutions Demonstrated history of breaking technical bottlenecks that materially impacted product ramp success, cost, or yield across multiple process nodes or product generations. Expertise in advanced materials and device characterization, including SEM, TEM, CD SEM, AFM, XPS, and electrical correlation. Strong publication, patent, or internal technology disclosure record that evidences field level or industry recognized contributions. Ability to mentor senior engineers, set technical standards, and elevate organizational capability across the dry etch discipline. Proven effectiveness in influencing cross functional and external stakeholders, including integration, device, yield, and equipment suppliers, to align on long term technical strategies. Experience shaping multiyear roadmaps for process platforms, tooling strategies, or foundational etch capabilities. Qualifications PhD with 10+ years of directly relevant experience, or Master's degree with 15+ years of experience, in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field. Deep, authoritative expertise in dry etch semiconductor manufacturing, with demonstrated leadership over complex process development or platform level solutions. Experience working in dry etch in a foundry Other Locations US, TX, Austin; US, AZ, Phoenix; US, CA, Folsom; US, CA, Santa Clara Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. Annual Salary Range for jobs which could be performed in the US $201,330.00-$284,230.00 Salary range dependent on a number of factors including location and experience Working Model This role will require an on-site presence. Job posting details (such as work model, location or time type) are subject to change.Position of TrustThis role is a Position of Trust. Should you accept this position, you must consent to and pass an extended Background Investigation, which includes (subject to country law), extended education, SEC sanctions, and additional criminal and civil checks. For internals, this investigation may or may not be completed prior to starting the position. For additional questions, please contact your Recruiter.
08/02/2026
Full time
Job Description Note: This role requires regular onsite presence to fulfill essential job responsibilities. Drives technology development and enablement for both high volume manufacturing and future technology, provides process integration and equipment solutions, and performs feasibility studies to meet desired device specifications. Leads design and development of technically sophisticated manufacturing processes and/or repair reverse engineering including material selection, parameter optimization, equipment metrology, and system design to enable new product designs and functional requirements. Performs pathfinding activities in support of process and hardware development enabling manufacturing of innovative device architectures and develops roadmaps for technologies enabling future roadmap. Recommends and implements modifications for operating equipment to improve production efficiency, manufacturing techniques, and optimizing production output for existing products. Partners with key equipment and materials suppliers to develop and implement enabling elements of the technology. Performs process technology feasibility studies through theoretical simulations and/or practical engineering methods. Remains updated on relevant industrial process and material manufacturing technical trends and develops view of inherent future Intel process technology needs to push industry forward by partnering with vendor ecosystem to build cost sensitive roadmap. Required Skills and Experience Proven track record of technical ownership and delivery of dry etch process innovations that enabled high volume manufacturing, yield improvement, reliability, or technology node transitions. Expert level understanding of plasma physics, plasma-surface interactions, pattern fidelity, selectivity, defectivity, and profile control for advanced device structures. Demonstrated ability to define long term technical direction and translate research concepts into manufacturable solutions at scale. Extensive experience with advanced data analytics, statistical modeling, and design of experiments (DOE) applied to complex semiconductor process problems. Recognized technical authority who influences decisions across modules, organizations, or technology programs without formal management authority. Preferred Skills and Experience Sustained leadership in developing and deploying next generation dry etch solutions for advanced logic or foundry technologies (e.g., FinFET, GAA, nanosheet architectures). Deep experience with advanced etch technologies, such as: High aspect ratio plasma etch (HARC); Atomic Layer Etch (ALE), EUV patterned layer etch integration; Radical and Vapor phase isotropic etching; Ash and surface treatments; Novel patterning or materials specific etch solutions Demonstrated history of breaking technical bottlenecks that materially impacted product ramp success, cost, or yield across multiple process nodes or product generations. Expertise in advanced materials and device characterization, including SEM, TEM, CD SEM, AFM, XPS, and electrical correlation. Strong publication, patent, or internal technology disclosure record that evidences field level or industry recognized contributions. Ability to mentor senior engineers, set technical standards, and elevate organizational capability across the dry etch discipline. Proven effectiveness in influencing cross functional and external stakeholders, including integration, device, yield, and equipment suppliers, to align on long term technical strategies. Experience shaping multiyear roadmaps for process platforms, tooling strategies, or foundational etch capabilities. Qualifications PhD with 10+ years of directly relevant experience, or Master's degree with 15+ years of experience, in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field. Deep, authoritative expertise in dry etch semiconductor manufacturing, with demonstrated leadership over complex process development or platform level solutions. Experience working in dry etch in a foundry Other Locations US, TX, Austin; US, AZ, Phoenix; US, CA, Folsom; US, CA, Santa Clara Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. Annual Salary Range for jobs which could be performed in the US $201,330.00-$284,230.00 Salary range dependent on a number of factors including location and experience Working Model This role will require an on-site presence. Job posting details (such as work model, location or time type) are subject to change.Position of TrustThis role is a Position of Trust. Should you accept this position, you must consent to and pass an extended Background Investigation, which includes (subject to country law), extended education, SEC sanctions, and additional criminal and civil checks. For internals, this investigation may or may not be completed prior to starting the position. For additional questions, please contact your Recruiter.
